Abstract: A method, a computer program product, and a computer system determine a qualified exchange. The method includes receiving a request for a status of an exchange. The method includes determining the status of the exchange using a qualification analysis. The qualification analysis includes a plurality of prevailing factors and a multi-step analysis. Satisfaction of one of the prevailing factors automatically qualifies the status of the exchange as the qualified exchange. the multi-step analysis includes a plurality of tests. Satisfaction of each of the tests qualifies the status of the exchange as the qualified exchange. The method includes generating and transmitting a response indicative of the status of the exchange.

Abstract: A method, a computer program product, and a computer system determine a qualified exchange. The method includes receiving a request for a status of an exchange. The method includes determining the status of the exchange using a qualification analysis. The qualification analysis includes a plurality of prevailing factors and a multi-step analysis. Satisfaction of one of the prevailing factors automatically qualifies the status of the exchange as the qualified exchange. the multi-step analysis includes a plurality of tests. Satisfaction of each of the tests qualifies the status of the exchange as the qualified exchange. The method includes generating and transmitting a response indicative of the status of the exchange.

Abstract: A ball grid array resistor network that has a ground plane to reduce noise and improve signal integrity. The ball grid array resistor network includes a substrate having a first and a second surface and vias that extending through the substrate between the first and second surfaces. Resistors are located on the first surface between the vias. Conductors are located over the vias and are electrically connected to ends of the resistors. A cover coat covers the conductors and resistors. A ground plane is located on the second surface. An insulating layer is located over the ground plane. Ball pads are located over the vias. The ball pads are electrically connected to the vias. Solder spheres are attached to the ball pads.

Abstract: A ball grid array resistor network that has a ground plane to reduce noise and improve signal integrity. The ball grid array resistor network includes a substrate having a first and a second surface and vias that extending through the substrate between the first and second surfaces. Resistors are located on the first surface between the vias. Conductors are located over the vias and are electrically connected to ends of the resistors. A cover coat covers the conductors and resistors. A ground plane is located on the second surface. An insulating layer is located over the ground plane. Ball pads are located over the vias. The ball pads are electrically connected to the vias. Solder spheres are attached to the ball pads.

Abstract: A ball grid array resistor network that has a ground plane to reduce noise and improve signal integrity. The ball grid array resistor network includes a substrate having a first and a second surface and vias that extending through the substrate between the first and second surfaces. Resistors are located on the first surface between the vias. Conductors are located over the vias and are electrically connected to ends of the resistors. A cover coat covers the conductors and resistors. A ground plane is located on the second surface. An insulating layer is located over the ground plane. Ball pads are located over the vias. The ball pads are electrically connected to the vias. Solder spheres are attached to the ball pads.

Abstract: A ball grid array resistor network that has a ground plane to reduce noise and improve signal integrity. The ball grid array resistor network includes a substrate having a first and a second surface and vias that extending through the substrate between the first and second surfaces. Resistors are located on the first surface between the vias. Conductors are located over the vias and are electrically connected to ends of the resistors. A cover coat covers the conductors and resistors. A ground plane is located on the second surface. An insulating layer is located over the ground plane. Ball pads are located over the vias. The ball pads are electrically connected to the vias. Solder spheres are attached to the ball pads.