Patents by Inventor Cynthia J. Moring

Cynthia J. Moring has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5194713
    Abstract: Disclosed is a method of fabricating a microelectronic circuit package. The circuit package has a reinforced fluorocarbon polymer dielectric. According to the disclosed process, vias or through holes are formed in the composite by a process that leaves debris. The debris in the formed vias or through holes is reflowed in order to smooth the via and through hole walls for subsequent plating.
    Type: Grant
    Filed: October 17, 1991
    Date of Patent: March 16, 1993
    Assignee: International Business Machines Corporation
    Inventors: Frank D. Egitto, Cynthia J. Moring, Daniel C. Van Hart