Abstract: Electronic packages that consist of dies sealed within hollow plastic enclosures with electrically conductive leads penetrating the enclosure walls to access the die circuitry are manufactured by applying a heat-curable adhesive to the leads at only those locations where the surfaces of the leads will interface with the enclosure material, molding the package around the leads, and curing the adhesive during the molding process or during a post-cure. The adhesive is formulated to form a gas-tight seal around the leads and to maintain the seal during the thermal cycling that the components are exposed to during the typical procedures involved in manufacturing the packages and in making the electrical connections to other circuitry, as well as the typical environmental changes that the finished and installed product is exposed to during use.

Abstract: The invention is methods and compositions for removing bonding agents from the hard surfaces of machinery and, in its most preferred mode packaging equipment. The release composition comprises lecithin and a hydrophobic carrier. The method comprises the steps of applying a release composition to the surfaces of the packaging equipment. The packaging equipment is then used. Any bonding agent deposited on the treated areas of the packaging equipment may then be removed. The invention is applicable to any number of package and container manufacture environments including package assembly, package sealing, product sealing, and labeling.

Abstract: The invention relates to a coating composition film or barrier layer containing an inorganic salt composition having a phosphate and a carbonate source and a surfactant composition. The aqueous coating can be applied to surfaces in food preparation units. The compositions of the invention can be used in methods for coating hard surfaces of food preparation units by applying the aqueous material through a spray or other aerosol apparatus to form a uniform coating. Upon drying, the water from the coating can evaporate leaving an organic/inorganic film which can support baked-on food soil and promote easy removal.