Abstract: A tunable, dynamic counterbalance suitable for use, inter alia, in a die bonding system to stabilize one or more gantries disposed thereon, the tunable, dynamic counterbalance being operatively connected to a gantry and comprising at least one counter-weight disposed in a base of the system, the gantry being configured to move opposite the counterweight, thereby stabilizing that gantry as well as any other device and/or system disposed on the die bonding system, including a second or subsequent gantry, wherein the counterbalance reduces or eliminates the need for stabilizing mass, reducing the environmental impact of the gantry and allowing such systems to be closely spaced and used on second and subsequent floors of a building, while maintaining or even providing an increase in die placement accuracy, in the exemplary and non-limiting case of a die bonding system, and/or reduction in cycle time, relative to weighted bases in common use today.

Abstract: A die bonding system comprising a heated bond head with the ability to heat up and cool down quickly, change tips to handle different sized dies, and load and unload tips automatically while maintaining the precision required to handle dies smaller than 200 um2.

Abstract: A die bonding system comprising a wafer lift and level assembly configured to allow rapid planarization of a wafer comprising a wafer frame configured to retain a wafer and be slidably retained within guide clevises and a leveling pedestal configured to support a wafer from below in a localized area where a die bonding operation is to take place, allowing the quick and repeatable planarization of die(s) to the wafer without the need for distinct planarization procedures that would slow cycle times and decrease production.

Abstract: A die bonding system comprising a wafer lift and level assembly configured to allow rapid planarization of a wafer comprising a wafer frame configured to retain a wafer and be slidably retained within guide clevises and a leveling pedestal configured to support a wafer from below in a localized area where a die bonding operation is to take place, allowing the quick and repeatable planarization of die(s) to the wafer without the need for distinct planarization procedures that would slow cycle times and decrease production.

Abstract: A die bonding system comprising a heated bond head with the ability to heat up and cool down quickly, change tips to handle different sized dies, and load and unload tips automatically while maintaining the precision required to handle dies smaller than 200 um2.

Abstract: Co-planarity adjustment systems and methods, gantries capable of applying high force without imposing moment loads to their bearings, systems and methods for achieving rapid heating and cooling and efficient slidable seal systems capable of sealing a chamber and injecting one or more fluids into the chamber as well as actively recovering portions of such fluid which have migrated into the seal itself are disclosed in the context of thermo-compression bonding systems, apparatuses and methods, although many alternative uses will be apparent to those of skill in the art.

Abstract: Co-planarity adjustment systems and methods, gantries capable of applying high force without imposing moment loads to their bearings, systems and methods for achieving rapid heating and cooling and efficient slidable seal systems capable of sealing a chamber and injecting one or more fluids into the chamber as well as actively recovering portions of such fluid which have migrated into the seal itself are disclosed in the context of thermo-compression bonding systems, apparatuses and methods, although many alternative uses will be apparent to those of skill in the art.

Abstract: A system and method are provided for enabling the production of semiconductors requiring very high precision thermo-compression bonding, the system comprising a thermo-compression bonding system having force and/or distance measuring sensors configured to sense thermal expansion of system components and a controller configured to counteract such expansion by exercising appropriate control over such system. This system and method may be used for both constant force profile applications as well as those requiring variable force during a bonding operation.

Abstract: A dispensing apparatus has a motor drive that moves an output member along an axis in a first chamber. A shuttle valve controls flow between a first chamber and either a reservoir of material or an output port. Extending the output member discharges precise volumes of material through an output port. Retracting the output member fills the first chamber.

Abstract: A flip chip assembly machine (FCAM) (30) includes a main gantry (50) and a substrate camera gantry (40) that are configured to operate independently of each other and, respectively, support a die (12) and a substrate camera (38) for alignment purposes. The FCAM further includes a fluxer (130) for applying flux to the die. A flip-to-flux pick and place subassembly (116) picks up a die and places it in flux (46) independently of the operation of the main gantry, which may perform another task during the flux dwell time. A substrate carrier conveyor (154) includes a walking beam (260) to rapidly accelerate and decelerate substrate carrier movement into and out of the FCAM.

Abstract: A method and apparatus for accurately registering electronic chip bonding pads with substrate leads. Images are developed of different portions of the interface between the electronic chip and the substrate by reflecting collimated, parallel light from the bottom of the chip through transparent areas of the substrate. Image analysis of the composite, superimposed images from spaced positions containing the bonding pads and the leads provide a corrective positioning after which the electronic chip and substrate are brought into contact.

Abstract: A dispensing pump includes first and second sleeve assemblies. Each sleeve assembly includes a rotary valve having an input and output position and a longitudinally displaceable piston that moves between a first position abutting the valve and a second position displaced from the valve. The sleeve connects to a manifold with input and output passages that align with input and output apertures in the sleeve. Withdrawing the piston with the input port of the valve aligned with the input aperture draws material into the sleeve. Moving the piston toward the valve in the output position with the output port aligned with the output passage displaces material from the manifold.