Patents by Inventor Cyrus Baldwin

Cyrus Baldwin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070183772
    Abstract: An electronic device housing which may be cooled via a heat pump (e.g., heat exchange unit or thermo electric cooling mechanism) is provided. The housing may have a heat pump aperture sized and configured to receive the heat pump. The heat pump may comprise an internal heat sink positioned inside the housing and an external heat sink positioned exterior to the housing. A peltier module may be interposed between the internal and external heat sinks to transfer heat absorbed by the internal heat sink from the housing inside to the external heat sink. The external heat sink subsequently transfers the heat to the environment. Such heat transfer between the internal and external heat sinks may be further facilitated via an internal fan and external fan which are positioned adjacent to the internal and external heat sinks, respectively.
    Type: Application
    Filed: April 5, 2007
    Publication date: August 9, 2007
    Inventors: Cyrus Baldwin, Zachary Saielli, Mark Creighton
  • Publication number: 20050232624
    Abstract: A housing including an enclosure and a backup battery system is provided wherein the backup battery system may be disposed within the enclosure. The enclosure may also be locked such that unauthorized personnel may not tamper with the camera's operation. More particularly, the camera may be typically powered via a 110 VAC wall outlet. If the camera's normal power is interrupted, a battery of the backup battery system contained within the enclosure may route power to the camera such that the camera continues to capture images even though the power which normally operates the camera is interrupted.
    Type: Application
    Filed: March 24, 2005
    Publication date: October 20, 2005
    Inventor: Cyrus Baldwin
  • Publication number: 20050213960
    Abstract: An electronic device housing which may be cooled via a heat pump (e.g., heat exchange unit or thermo electric cooling mechanism) is provided. The housing may have a heat pump aperture sized and configured to receive the heat pump. The heat pump may comprise an internal heat sink positioned inside the housing and an external heat sink positioned exterior to the housing. A peltier module may be interposed between the internal and external heat sinks to transfer heat absorbed by the internal heat sink from the housing inside to the external heat sink. The external heat sink subsequently transfers the heat to the environment. Such heat transfer between the internal and external heat sinks may be further facilitated via an internal fan and external fan which are positioned adjacent to the internal and external heat sinks, respectively.
    Type: Application
    Filed: October 29, 2004
    Publication date: September 29, 2005
    Inventors: Cyrus Baldwin, Zachary Saielli, Mark Creighton