Patents by Inventor Cyrus Y. LIU
Cyrus Y. LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10198040Abstract: An electronic device may have a flexible portion that allows the device to be folded. The device may have a flexible display. The flexible display may have a flexible display layer, a cover layer, a touch sensor interposed between the flexible display layer and the cover layer, a support layer, and a polarizer layer. The polarizer layer may be interposed between the touch sensor and the flexible display or between the touch sensor and the cover layer. The touch sensor may include optically clear adhesive that is flexible and facilitates bending of the display. The optically clear adhesive may include additives such as water vapor penetration reducing additive, anticorrosion additive, ultraviolet-light blocking additive, and index-of-refraction adjustment additive. The support layer may be formed from shape memory alloy or amorphous metal and may have openings to facilitate bending.Type: GrantFiled: September 22, 2016Date of Patent: February 5, 2019Assignee: Apple Inc.Inventors: Zhen Zhang, Victor H. Yin, Cyrus Y. Liu, Paul S. Drzaic, Sungwon Bae, Chun-Hao Tung, Kiarash Vakhshouri, Sunggu Kang, John Z. Zhong
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Patent number: 9942986Abstract: Components may have substrates with metal traces that form mating contacts. The components may be bonded together using anisotropic conductive adhesive bonding techniques. During bonding, conductive particles may be concentrated over the contacts by application of magnetic or electric fields or by using a template transfer process. Gaps between the contacts may be at least partially free of conductive particles to help isolate adjacent contacts. Polymer between the substrates may attach the substrates together. The conductive particles may be embedded in the polymer and crushed or melted to short opposing contacts together.Type: GrantFiled: January 6, 2017Date of Patent: April 10, 2018Assignee: Apple Inc.Inventors: Koohee Han, Hui Chen, Kuo-Hua Sung, Cyrus Y. Liu, To C. Tan
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Publication number: 20180092209Abstract: Components may have substrates with metal traces that form mating contacts. The components may be bonded together using anisotropic conductive adhesive bonding techniques. During bonding, conductive particles may be concentrated over the contacts by application of magnetic or electric fields or by using a template transfer process. Gaps between the contacts may be at least partially free of conductive particles to help isolate adjacent contacts. Polymer between the substrates may attach the substrates together. The conductive particles may be embedded in the polymer and crushed or melted to short opposing contacts together.Type: ApplicationFiled: January 6, 2017Publication date: March 29, 2018Inventors: Koohee Han, Hui Chen, Kuo-Hua Sung, Cyrus Y. Liu, To C. Tan
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Publication number: 20170336831Abstract: An electronic device may have a flexible portion that allows the device to be folded. The device may have a flexible display. The flexible display may have a flexible display layer, a cover layer, a touch sensor interposed between the flexible display layer and the cover layer, a support layer, and a polarizer layer. The polarizer layer may be interposed between the touch sensor and the flexible display or between the touch sensor and the cover layer. The touch sensor may include optically clear adhesive that is flexible and facilitates bending of the display. The optically clear adhesive may include additives such as water vapor penetration reducing additive, anticorrosion additive, ultraviolet-light blocking additive, and index-of-refraction adjustment additive. The support layer may be formed from shape memory alloy or amorphous metal and may have openings to facilitate bending.Type: ApplicationFiled: September 22, 2016Publication date: November 23, 2017Inventors: Zhen Zhang, Victor H. Yin, Cyrus Y. Liu, Paul S. Drzaic, Sungwon Bae, Chun-Hao Tung, Kiarash Vakhshouri, Sunggu Kang, John Z. Zhong
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Patent number: 9653425Abstract: Anisotropic conductive film (ACF) structures and manufacturing methods for forming the same are described. The manufacturing methods include preventing clusters of conductive particles from forming between adjacent bonding pads and that are associated with electrical shorting of ACF structures. In some embodiments, the methods involve use of multiple layered ACF materials that include a non-electrically conductive layer that reduces the likelihood of formation of conductive particle clusters between bonding pads. In some embodiment, the methods include the use of ultraviolet sensitive ACF material combined with lithography techniques that eliminate conductive particles from between neighboring bonding pads. In some embodiments, the methods involve the use of insulation spacers that block conductive particles from entering between bonding pads. Any suitable combination of the described methods can be used.Type: GrantFiled: August 26, 2015Date of Patent: May 16, 2017Assignee: Apple Inc.Inventors: Bo Zhang, Sang Ha Kim, Cyrus Y. Liu, Kuo-Hua Sung
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Publication number: 20170062379Abstract: Anisotropic conductive film (ACF) structures and manufacturing methods for forming the same are described. The manufacturing methods include preventing clusters of conductive particles from forming between adjacent bonding pads and that are associated with electrical shorting of ACF structures. In some embodiments, the methods involve use of multiple layered ACF materials that include a non-electrically conductive layer that reduces the likelihood of formation of conductive particle clusters between bonding pads. In some embodiment, the methods include the use of ultraviolet sensitive ACF material combined with lithography techniques that eliminate conductive particles from between neighboring bonding pads. In some embodiments, the methods involve the use of insulation spacers that block conductive particles from entering between bonding pads. Any suitable combination of the described methods can be used.Type: ApplicationFiled: August 26, 2015Publication date: March 2, 2017Inventors: Bo Zhang, Sang Ha Kim, Cyrus Y. Liu, Kuo-Hua Sung
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Patent number: 9494178Abstract: Structures in an electronic device such as substrates associated with a display may be bonded together using liquid adhesive. Fiber-based equipment may be used to apply ultraviolet light to peripheral edges of an adhesive layer during bonding. There-dimensional adhesive shapes may be produced using nozzles with adjustable openings, computer-controlled positioners, and other adhesive dispensing equipment. Ultraviolet light may be applied to liquid adhesive through a mask with an opacity gradient. Adjustable shutter structures may control adhesive exposure to ultraviolet light. Ultraviolet light exposure may be used to create an adhesive dam that helps create a well defined adhesive border. Multiple layers of adhesive may be applied between a pair of substrates.Type: GrantFiled: February 18, 2014Date of Patent: November 15, 2016Assignee: Apple Inc.Inventors: Cyrus Y. Liu, Kuo-Hua Sung, Po-Jui Chen, Silvio Grespan
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Publication number: 20160101609Abstract: An electronic device may have display layers and other structures. A layer of liquid adhesive may be patterned onto a structure. The liquid adhesive may be pre-cured to increase the viscosity of the liquid adhesive and to partially shrink the liquid adhesive. The structure to which the liquid adhesive has been applied may be laminated to another structure. During lamination, the pre-cured liquid adhesive may be compressed between the structures that are being laminated. The adhesive may then be fully cured to bond the structures together. The thickening of the liquid adhesive during pre-curing helps control the spread of the adhesive. The shrinking of the liquid adhesive helps prevent stresses from developing that could lead to visible stress-induced artifacts following curing.Type: ApplicationFiled: November 11, 2014Publication date: April 14, 2016Inventors: Cyrus Y. Liu, Der-Song Lin, Kuo-Hua Sung
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Patent number: 9302457Abstract: Methods and devices for using liquid optically clear adhesives (LOCAs) are described. A method for detecting uncured LOCA between a first substrate and a second substrate is described. In addition, an improved method for curing a laminated stack up having LOCA between a first substrate and a second substrate is described. The method includes a pre-curing method involving variable exposure of the LOCA. In addition, an improved light emitting diode (LED) unit assembly for exposing a laminated stack up to ultraviolet (UV) light during a pre-curing process is described. A method for testing the LED unit assembly prior to a pre-curing process is described.Type: GrantFiled: February 13, 2013Date of Patent: April 5, 2016Assignee: Apple Inc.Inventors: Silvio Grespan, Shih-Min Hsu, Heng-Hsi Wu, Kuo-Hua Sung, Cyrus Y. Liu
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Publication number: 20140246148Abstract: Structures in an electronic device such as substrates associated with a display may be bonded together using liquid adhesive. Fiber-based equipment may be used to apply ultraviolet light to peripheral edges of an adhesive layer during bonding. There-dimensional adhesive shapes may be produced using nozzles with adjustable openings, computer-controlled positioners, and other adhesive dispensing equipment. Ultraviolet light may be applied to liquid adhesive through a mask with an opacity gradient. Adjustable shutter structures may control adhesive exposure to ultraviolet light. Ultraviolet light exposure may be used to create an adhesive dam that helps create a well defined adhesive border. Multiple layers of adhesive may be applied between a pair of substrates.Type: ApplicationFiled: February 18, 2014Publication date: September 4, 2014Applicant: Apple Inc.Inventors: Cyrus Y. Liu, Kuo-Hua Sung, Po-Jui Chen, Silvio Grespan
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Publication number: 20140071417Abstract: Methods and devices for using liquid optically clear adhesives (LOCAs) are described. A method for detecting uncured LOCA between a first substrate and a second substrate is described. In addition, an improved method for curing a laminated stack up having LOCA between a first substrate and a second substrate is described. The method includes a pre-curing method involving variable exposure of the LOCA. In addition, an improved light emitting diode (LED) unit assembly for exposing a laminated stack up to ultraviolet (UV) light during a pre-curing process is described. A method for testing the LED unit assembly prior to a pre-curing process is described.Type: ApplicationFiled: February 13, 2013Publication date: March 13, 2014Applicant: Apple Inc.Inventors: Silvio GRESPAN, Shih-Min HSU, Heng-Hsi WU, Kuo-Hua SUNG, Cyrus Y. LIU