Abstract: A composite material that includes a layer of reinforcing fibres impregnated with a curable resin matrix and a plurality of electrically conductive composite particles positioned adjacent or in proximity to the reinforcing fibres. Each of the electrically conductive composite particles is composed of a conductive component and a polymeric component, wherein the polymeric component includes one or more polymers that are initially in a solid phase and are substantially insoluble in the curable resin, but is able to undergo at least partial phase transition to a fluid phase during a curing cycle of the composite material.

Abstract: A process for manufacturing a composite article, which include combining a nonwoven mat of extruded fibers with one or more layers of fabrics to form a preform, and injecting the preform with a liquid thermosetting resin. The extruded fibers are formed by combining and extruding a thermoplastic carrier material with a toughening material within a predetermined temperature range. The carrier material is immiscible with the toughening material, and the toughening material is encapsulated within the carrier material. The carrier material is at least partially soluble in the thermosetting resin within a predetermined temperature range, and the toughening material is insoluble in the thermosetting resin during a cure cycle. A preform having at least one nonwoven mat of extruded fibers is also disclosed.

Abstract: Disclosed herein is a method for utilizing the exothermic energy generated by a low temperature cure reaction to access a high-temperature cure reaction, which is otherwise energetically inaccessible at a chosen tool temperature, thereby producing a cured resin matrix with properties closely matching to those produced via high-temperature cure reactions but achieved via a short cure time and low cure temperature. Also disclosed is a short-cure resin composition containing: (a) at least one multifunctional epoxy resin having an epoxy functionality of greater than 1; (b) a hardener composition containing (i) at least one aliphatic or cycloaliphatic amine curing agent having one or more amino groups per molecule; (ii) at least one aromatic amine curing agent having one or more amino groups per molecule; and optionally, (iii) an imidazole as curing accelerator. The improved properties of this resin composition include being curable at a temperature of ?120° C.

Abstract: Hydrophobically modified Si-containing polyamines are useful for treating scale in industrial process streams. Preferred hydrophobically modified Si-containing polyamines are particularly useful for treating aluminosilicate scale in difficult-to-treat industrial process streams, such as in the Bayer alumina process streams, nuclear waste streams and kraft paper mill effluent streams.

Abstract: A surfacing film is formed from a curable resin composition containing an epoxy novolac resin, a tri-functional or tetra-functional epoxy resin, ceramic microspheres, an amine-based curing agent, particulate inorganic fillers; and a toughening component. The surfacing film exhibits high Tg and high cross-linked density after curing, as well as high resistance to paint stripper solutions. The surfacing film is suitable for co-curing with fiber-reinforced resin composite materials. The surfacing film may optionally contain electrically conductive additives to provide sufficient conductivity for lightning strike protection (LSP) or electromagnetic interference (EMI) shielding.

Abstract: A resin-rich peel ply that does not leave behind residual fibers after peeling and can work well with different resin-based composite substrates. The resin-rich peel ply is composed of a woven fabric impregnated with a resin matrix different from the resin matrix of the composite substrate. The peel ply is designed such that, upon manual removal of the peel ply from the composite substrate's surface, a thin film of the peel ply resin remains on the composite substrate's surface to create a bondable surface capable of bonding with another composite substrate, but no fibrous material from the woven fabric remains on the same surface.

Abstract: Embodiments of the present disclosure present electrically conductive, thermosetting compositions for use in surfacing films and adhesives. The surfacing films possess enhanced electrical conductivity, comparable to metals, without the use of embedded metal screens or foils. Such surfacing films may be incorporated into composite structures (e.g., prepregs, tapes, and fabrics), for example, by co-curing, as an outermost surface layer. In particular, compositions formed using silver flakes as conductive fillers are found to exhibit very high electrical conductivity. For example, compositions including greater than 45 wt. % silver flake exhibit resistivities less than about 55 m?/sq. In this manner, the surfacing films as an outermost conductive layer may provide lighting strike protection (LSP) and electromagnetic interference (EMI) shielding when used in applications such as aircraft components.

Abstract: Froth flotation processes that include adding a beneficiating amount of a value mineral collector composed of an organic ammonium salt of a sulfur-containing acid to at least one stage of a froth flotation process to recover value minerals from mineral ore bodies are disclosed herein.

Abstract: Formulations for value mineral collector compositions composed of at least one first collector selected from an organic ammonium salt of an organic sulfur-containing acid; and at least one second collector selected from neutral collectors and/or organic ammonium salts of an organic sulfur-containing acids, such that the second collector is different from said first collector, are provided herein, along with methods for making and using same.

Abstract: Froth flotation processes that include adding a beneficiating amount of a value mineral collector composed of an organic ammonium salt of a sulfur-containing acid to at least one stage of a froth flotation process to recover value minerals from mineral ore bodies are disclosed herein.