Patents by Inventor Cyuan-Hong SHIH

Cyuan-Hong SHIH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MANUFACTURING METHOD FOR MANUFACTURING A PACKAGE STRUCTURE
    Publication number: 20220384208
    Abstract: A manufacturing method for manufacturing a package structure is provided. The manufacturing method includes: (a) providing a carrier having a top surface and a lateral side surface, wherein the top surface includes a main portion and a flat portion connecting the lateral side surface, and a first included angle between the main portion and the flat portion is less than a second included angle between the main portion and the lateral side surface; (b) forming an under layer on the carrier to at least partially expose the flat portion; and (c) forming a dielectric layer on the under layer and covering the exposed flat portion.
    Type: Application
    Filed: May 27, 2021
    Publication date: December 1, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chia-Pin CHEN, Chia Sheng TIEN, Wan-Ting CHIU, Chi Long TSAI, Cyuan-Hong SHIH, Yen Liang CHEN