Abstract: Methods and apparatus are described for connecting a first plurality of signal lines to a second plurality of signal lines. A first assembly includes a plurality of first contact arrays. Each of the contacts in each of the first contact arrays is in electrical contact with a corresponding one of the first plurality of signal lines. Each of the first contact arrays has a first mechanical alignment feature associated therewith. A second assembly includes a plurality of contact assemblies. Each of the contact assemblies is suspended within the second assembly such that each contact assembly is operable to move independently in at least four degrees of freedom relative to the second assembly. Each contact assembly has a second contact array associated therewith. Each of the contacts in each of the second contact arrays is in electrical contact with a corresponding one of the second plurality of signal lines. Each of the contact assemblies has a second mechanical alignment feature associated therewith.

Abstract: Methods and apparatus are described for aligning a probe card with a wafer probe interface by bringing first kinematic features into contact with second kinematic features, thereby restraining relative motion between the probe card and the wafer probe interface when the probe card and the wafer probe interface are docked.

Abstract: Methods and apparatus are described for connecting a first plurality of signal lines to a second plurality of signal lines. A first assembly includes a plurality of first contact arrays. Each of the contacts in each of the first contact arrays is in electrical contact with a corresponding one of the first plurality of signal lines. Each of the first contact arrays has a first mechanical alignment feature associated therewith. A second assembly includes a plurality of contact assemblies. Each of the contact assemblies is suspended within the second assembly such that each contact assembly is operable to move independently in at least four degrees of freedom relative to the second assembly. Each contact assembly has a second contact array associated therewith. Each of the contacts in each of the second contact arrays is in electrical contact with a corresponding one of the second plurality of signal lines. Each of the contact assemblies has a second mechanical alignment feature associated therewith.

Abstract: A clamping assembly for connecting a first plurality of contacts to a second plurality of contacts on a circuit board. The circuit board has a first outer face and a second outer face. The second contacts are arranged on at least one of the first and second outer faces. The clamping assembly includes a first assembly having a first inner face, and a second assembly having a second inner face substantially parallel to the first inner face. The first plurality of contacts are arranged on at least one of the first and second inner faces. Mechanical alignment features facilitate alignment of the first contacts with the second contacts. The first and second assemblies are configured to enable relative motion therebetween to effect clamping of the first and second inner faces to the first and second outer faces of the circuit board.

Abstract: A device-under test (DUT) assembly includes a DUT board having a plurality of spine assemblies. Each spine assembly has a first outer face, a second outer face, and a first plurality of contacts on at least one of the first and second outer faces in electrical contact with a subset of the first signal lines. A connector assembly includes a plurality of clamping assemblies arranged to receive the plurality of spine assemblies. Each clamping assembly includes a first inner face, a second inner face, and a second plurality of contacts on at least one of the first and second inner faces in electrical contact with a subset of the second signal lines. Electrical connections between the first and second contacts are formed when the first and second inner faces of each clamping assembly are clamped to the first and second outer faces of the corresponding spine assembly.

Abstract: A device-under test (DUT) assembly includes a DUT board having a plurality of spine assemblies. Each spine assembly has a first outer face, a second outer face, and a first plurality of contacts on at least one of the first and second outer faces in electrical contact with a subset of the first signal lines. A connector assembly includes a plurality of clamping assemblies arranged to receive the plurality of spine assemblies. Each clamping assembly includes a first inner face, a second inner face, and a second plurality of contacts on at least one of the first and second inner faces in electrical contact with a subset of the second signal lines. Electrical connections between the first and second contacts are formed when the first and second inner faces of each clamping assembly are clamped to the first and second outer faces of the corresponding spine assembly.

Abstract: A device-under test (DUT) assembly includes a DUT board having a plurality of spine assemblies. Each spine assembly has a first outer face, a second outer face, and a first plurality of contacts on at least one of the first and second outer faces in electrical contact with a subset of the first signal lines. A connector assembly includes a plurality of clamping assemblies arranged to receive the plurality of spine assemblies. Each clamping assembly includes a first inner face, a second inner face, and a second plurality of contacts on at least one of the first and second inner faces in electrical contact with a subset of the second signal lines. Electrical connections between the first and second contacts are formed when the first and second inner faces of each clamping assembly are clamped to the first and second outer faces of the corresponding spine assembly.