Abstract: Methods for making packages and leadframes are enclosed. The package includes a die, a die pad, leads, bond wires, and an encapsulant. The lower surfaces of the die pad and leads are provided with a stepped profile by an etching step that etches partially through the thickness of a peripheral portion of the die pad, and also etches partially through the thickness of portions of the leads. Encapsulant material is applied by molding or liquid encapsulation techniques. The encapsulant material fills in beneath the recessed, substantially horizontal surfaces of the die pad and leads formed by the above-described partial etching step, and thereby prevents the die pad and leads from being pulled vertically from the package body. Other surface of the die pad and leads are not covered during the encapsulation step, but rather remain exposed at the lower surface of the package for connecting the package externally.

Abstract: Packages for an integrated circuit device and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, leads, bond wires, and an encapsulant. The lower surfaces of the die pad and leads are provided with a stepped profile by an etching step that etches partially through the thickness of a peripheral portion of the die pad, and also etches partially through the thickness of portions of the leads. Encapsulant material fills in beneath the recessed, substantially horizontal surfaces of the die pad and leads formed by the above-described etching step, and thereby prevents the die pad and leads from being pulled vertically from the package body. Other portions of the die pad and leads are exposed at the lower surface of the package for connecting the package externally. A metal leadframe for making an encapsulated package includes an outer frame. A die pad is within and connected to the frame.