Abstract: Disclosed herein are mobile electronic devices utilizing reconfigurable processing techniques to enable higher speed applications with lowered power consumption for, inter alia, increased device battery life. The techniques disclosed herein enable greatly enhanced compression/decompression as well as encryption and decryption functionality to be provided in addition to overall greater processing capability particularly in those applications wherein minimization of power consumption is desired. Package-on-package and other assembly techniques may be used to provide the reconfigurable processor in a small footprint package.

Abstract: A reconfigurable processor module comprising hybrid stacked integrated circuit (“IC”) die elements. In a particular embodiment disclosed herein, a processor module with reconfigurable capability may be constructed by stacking one or more thinned microprocessor, memory and/or field programmable gate array (“FPGA”) die elements and interconnecting the same utilizing contacts that traverse the thickness of the die. The processor module disclosed allows for a significant acceleration in the sharing of data between the microprocessor and the FPGA element while advantageously increasing final assembly yield and concomitantly reducing final assembly cost.

Abstract: A reconfigurable processor module comprising hybrid stacked integrated circuit (“IC”) die elements. In a particular embodiment disclosed herein, a processor module with reconfigurable capability may be constructed by stacking one or more thinned microprocessor, memory and/or field programmable gate array (“FPGA”) die elements and interconnecting the same utilizing contacts that traverse the thickness of the die. The processor module disclosed allows for a significant acceleration in the sharing of data between the microprocessor and the FPGA element while advantageously increasing final assembly yield and concomitantly reducing final assembly cost.

Abstract: A reconfigurable processor module comprising hybrid stacked integrated circuit (“IC”) die elements. In a particular embodiment disclosed herein, a processor module with reconfigurable capability may be constructed by stacking one or more thinned microprocessor, memory and/or field programmable gate array (“FPGA”) die elements and interconnecting the same utilizing contacts that traverse the thickness of the die. The processor module disclosed allows for a significant acceleration in the sharing of data between the microprocessor and the FPGA element while advantageously increasing final assembly yield and concomitantly reducing final assembly cost.

Abstract: A reconfigurable processor module comprising hybrid stacked integrated circuit (“IC”) die elements. In a particular embodiment disclosed herein, a processor module with reconfigurable capability may be constructed by stacking one or more thinned microprocessor, memory and/or field programmable gate array (“FPGA”) die elements and interconnecting the same utilizing contacts that traverse the thickness of the die. The processor module disclosed allows for a significant acceleration in the sharing of data between the microprocessor and the FPGA element while advantageously increasing final assembly yield and concomitantly reducing final assembly cost.

Abstract: A reconfigurable processor module comprising hybrid stacked integrated circuit (“IC”) die elements. In a particular embodiment disclosed herein, a processor module with reconfigurable capability may be constructed by stacking one or more thinned microprocessor, memory and/or field programmable gate array (“FPGA”) die elements and interconnecting the same utilizing contacts that traverse the thickness of the die. The processor module disclosed allows for a significant acceleration in the sharing of data between the microprocessor and the FPGA element while advantageously increasing final assembly yield and concomitantly reducing final assembly cost.

Abstract: A reconfigurable processor module comprising hybrid stacked integrated circuit (“IC”) die elements. In a particular embodiment disclosed herein, a processor module with reconfigurable capability may be constructed by stacking one or more thinned microprocessor, memory and/or field programmable gate array (“FPGA”) die elements and interconnecting the same utilizing contacts that traverse the thickness of the die. The processor module disclosed allows for a significant acceleration in the sharing of data between the microprocessor and the FPGA element while advantageously increasing final assembly yield and concomitantly reducing final assembly cost.

Abstract: A reconfigurable processor module comprising hybrid stacked integrated circuit (“IC”) die elements. In a particular embodiment disclosed herein, a processor module with reconfigurable capability may be constructed by stacking one or more thinned microprocessor, memory and/or field programmable gate array (“FPGA”) die elements and interconnecting the same utilizing contacts that traverse the thickness of the die. The processor module disclosed allows for a significant acceleration in the sharing of data between the microprocessor and the FPGA element while advantageously increasing final assembly yield and concomitantly reducing final assembly cost.

Abstract: A reconfigurable processor module comprising hybrid stacked integrated circuit (“IC”) die elements. In a particular embodiment disclosed herein, a processor module with reconfigurable capability may be constructed by stacking one or more thinned microprocessor, memory and/or field programmable gate array (“FPGA”) die elements and interconnecting the same utilizing contacts that traverse the thickness of the die. The processor module disclosed allows for a significant acceleration in the sharing of data between the microprocessor and the FPGA element while advantageously increasing final assembly yield and concomitantly reducing final assembly cost.

Abstract: A data communications system employing sliding window protocol where the size of the window of the sending or receiving station can be made selectable by the user according to the speed, length or error rate of the communication link or the frame size used to maximize the utilization of the communication link. The negative acknowledgements sent by the receiving station specifies the upper and lower limit of a range of identification numbers of frames unsuccessfully received to increase efficiency. Before data is transmitted, the sending and receiving stations exchange the preferred sets of link parameters and generate a modified set of link parameters to resolve potential conflicts. Either the sending or the receiving station stores a table defining the frame sizes for use with different bit error rates of the communication link. The station then evaluates the current bit error rate to select the optimum frame size from the table and adjust the frame size accordingly.

Abstract: An output driver circuit is described which can be programmed by the user into tri-state or open-collector configurations, depending on the needs of the user. The driver circuit comprises a pair of a first pull-up and a pull-down FET transistor. The source of the pull-up transistor and drain of the pull-down transistor are both connected to the output of the driver. The gates of the pair of transistors are controlled by an input signal and its complement. The driver further includes a second pull-up FET whose source is connected to the output of the driver. The channel width to channel length ratio of the second pull-up transistor is at least about an order of magnitude greater than that of the first pull-up transistor. The driver further includes a control means responsive to the input signal for applying a second signal to the gate of the second pull-up transistor for programming the driver into tri-state or open-collector modes.

Abstract: An electromagnetic compensating balance for the measurement of forces having a permanent magnet circuit assembly with an annular enclosed housing and with a central core defining a narrow annular air gap between a portion of the housing and core, and having a movable bobbin concentrically arranged around the core with a coil located in the air gap, the bobbin having end portions projecting above and below the housing which are connected to leaf support members for independent support of the bobbin from the magnet assembly, the upper end portions being connected to a weighing pan for weighing samples.

Abstract: A reconfigurable processor module comprising hybrid stacked integrated circuit (“IC”) die elements. In a particular embodiment disclosed herein, a processor module with reconfigurable capability may be constructed by stacking one or more thinned microprocessor, memory and/or field programmable gate array (“FPGA”) die elements and interconnecting the same utilizing contacts that traverse the thickness of the die. The processor module disclosed allows for a significant acceleration in the sharing of data between the microprocessor and the FPGA element while advantageously increasing final assembly yield and concomitantly reducing final assembly cost.