Patents by Inventor D. Jeffrey Lischer
D. Jeffrey Lischer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230138326Abstract: A load lock in which the pumping speed is controlled so as to minimize the possibility of condensation is disclosed. The load lock is in communication with a vacuum pump and a valve. A controller is used to control the valve such that the supersaturation ratio within the load lock does not exceed a predetermined threshold, which is less than or equal to the critical value at which vapor condenses. In certain embodiments, a computer model is used to generate a profile, which may be a pumping speed profile or a pressure profile, and the valve is controlled according to the profile. In another embodiment, the load lock comprises a temperature sensor and a pressure sensor. The controller may calculate the supersaturation ratio based on these parameters and control the valve accordingly.Type: ApplicationFiled: October 28, 2021Publication date: May 4, 2023Inventors: D. Jeffrey Lischer, Bon-Woong Koo, Dawei Sun, Chi-Yang Cheng, Paul Joseph Murphy, Frank Sinclair, Gregory Edward Stratoti, Tseh-Jen Hsieh, Wayne Chen, Guy Oteri
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Patent number: 11557496Abstract: A cassette with embedded temperature sensors that is disposed within a load lock is disclosed. The temperature sensors may be disposed in a plurality of shelves of the load lock cassette to monitor the temperature of each of a plurality of workpieces disposed in the load lock. The output of these temperature sensors may be provided to a controller, which controls when the load lock is opened. The load lock cassette may also include cooling channels to accelerate the cooling of the workpieces to improve throughput. The cooling may be controlled using closed loop control, where a controller monitors the temperature of the workpieces during the cooling operation.Type: GrantFiled: March 23, 2020Date of Patent: January 17, 2023Assignee: Applied Materials, Inc.Inventors: Michael Blanchard, Steven M. Anella, Brant S. Binns, Jordan B. Tye, D. Jeffrey Lischer
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Patent number: 11543296Abstract: A method may include heating a substrate in a first chamber to a platen temperature, the heating comprising heating the substrate on a platen; measuring the platen temperature in the first chamber using a contact temperature measurement; transferring the substrate to a second chamber after the heating; and measuring a voltage decay after transferring the substrate to the second chamber, using an optical pyrometer to measure pyrometer voltage as a function of time.Type: GrantFiled: August 26, 2019Date of Patent: January 3, 2023Assignee: Applied Materials, Inc.Inventors: Eric D. Wilson, Steven Anella, D. Jeffrey Lischer, James McLane, Bradley M. Pomerleau, Dawei Sun
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Patent number: 11545375Abstract: A system and method of heating a workpiece to a desired temperature is disclosed. This system and method consider the physical limitations of the temperature device, such as time lag, temperature offset, and calibration, in creating a hybrid approach that heats the workpiece more efficiently. First, the workpiece is heated using open loop control to heat the workpiece to a threshold temperature. After the threshold temperature is reach, a closed loop maintenance mode is utilized. In certain embodiments, an open loop maintenance mode is employed between the open loop warmup mode and the closed loop maintenance mode. Additionally, a method of calibrating a pyrometer using a contact thermocouple is also disclosed.Type: GrantFiled: June 17, 2019Date of Patent: January 3, 2023Assignee: Applied Materials, Inc.Inventors: James D. Strassner, Bradley M. Pomerleau, D. Jeffrey Lischer, Dawei Sun, Michael Paul Rohrer
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Patent number: 11473978Abstract: A temperature measurement apparatus. The temperature measurement apparatus may include a temperature sensor body, the temperature sensor body having a substrate support surface; and a heat transfer layer, disposed on the substrate support surface, the heat transfer layer comprising an array of aligned carbon nanotubes.Type: GrantFiled: September 4, 2019Date of Patent: October 18, 2022Assignee: APPLIED Materials, Inc.Inventors: Dawei Sun, D. Jeffrey Lischer, Qin Chen, Dale K. Stone, Lyudmila Stone, Steven Anella, Ron Serisky, Chi-Yang Cheng
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Publication number: 20210296146Abstract: A cassette with embedded temperature sensors that is disposed within a load lock is disclosed. The temperature sensors may be disposed in a plurality of shelves of the load lock cassette to monitor the temperature of each of a plurality of workpieces disposed in the load lock. The output of these temperature sensors may be provided to a controller, which controls when the load lock is opened. The load lock cassette may also include cooling channels to accelerate the cooling of the workpieces to improve throughput. The cooling may be controlled using closed loop control, where a controller monitors the temperature of the workpieces during the cooling operation.Type: ApplicationFiled: March 23, 2020Publication date: September 23, 2021Inventors: Michael Blanchard, Steven M. Anella, Brant S. Binns, Jordan B. Tye, D. Jeffrey Lischer
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Publication number: 20200395233Abstract: A system and method of heating a workpiece to a desired temperature is disclosed. This system and method consider the physical limitations of the temperature device, such as time lag, temperature offset, and calibration, in creating a hybrid approach that heats the workpiece more efficiently. First, the workpiece is heated using open loop control to heat the workpiece to a threshold temperature. After the threshold temperature is reach, a closed loop maintenance mode is utilized. In certain embodiments, an open loop maintenance mode is employed between the open loop warmup mode and the closed loop maintenance mode. Additionally, a method of calibrating a pyrometer using a contact thermocouple is also disclosed.Type: ApplicationFiled: June 17, 2019Publication date: December 17, 2020Inventors: James D. Strassner, Bradley M. Pomerleau, D. Jeffrey Lischer, Dawei Sun, Michael Paul Rohrer
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Publication number: 20200381271Abstract: A heating system for heating a substrate. The heating system may include a susceptor, where the susceptor has a substrate support surface. The heating system may further include a heat transfer layer, disposed on the substrate support surface, where the heat transfer layer comprising an array of aligned carbon nanotubes.Type: ApplicationFiled: September 4, 2019Publication date: December 3, 2020Applicant: APPLIED Materials, Inc.Inventors: Dawei Sun, Dale K. Stone, D. Jeffrey Lischer, Lyudmila Stone, Steven Anella, Julian G. Blake, Ron Serisky, Daniel A. Hall, Robert H. Bettencourt
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Publication number: 20200378832Abstract: A method may include heating a substrate in a first chamber to a platen temperature, the heating comprising heating the substrate on a platen; measuring the platen temperature in the first chamber using a contact temperature measurement; transferring the substrate to a second chamber after the heating; and measuring a voltage decay after transferring the substrate to the second chamber, using an optical pyrometer to measure pyrometer voltage as a function of time.Type: ApplicationFiled: August 26, 2019Publication date: December 3, 2020Applicant: Applied Materials, Inc.Inventors: Eric D. Wilson, Steven Anella, D. Jeffrey Lischer, James McLane, Bradley M. Pomerleau, Dawei Sun
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Publication number: 20200378837Abstract: A temperature measurement apparatus. The temperature measurement apparatus may include a temperature sensor body, the temperature sensor body having a substrate support surface; and a heat transfer layer, disposed on the substrate support surface, the heat transfer layer comprising an array of aligned carbon nanotubes.Type: ApplicationFiled: September 4, 2019Publication date: December 3, 2020Applicant: APPLIED Materials, Inc.Inventors: Dawei Sun, D. Jeffrey Lischer, Qin Chen, Dale K. Stone, Lyudmila Stone, Steven Anella, Ron Serisky, Chi-Yang Cheng
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Patent number: 10443934Abstract: A system for heating substrates while being transported between the load lock and the platen is disclosed. The system comprises an array of light emitting diodes (LEDs) disposed above the alignment station. The LEDs may be GaN or GaP LEDs, which emit light at a wavelength which is readily absorbed by silicon, thus efficiently and quickly heating the substrate. The LEDs may be arranged so that the rotation of the substrate during alignment results in a uniform temperature profile of the substrate. Further, heating during alignment may also increase throughput and eliminate preheating stations that are currently associated with the processing chamber.Type: GrantFiled: May 8, 2015Date of Patent: October 15, 2019Assignee: Varian Semiconductor Equipment Associates, Inc.Inventors: Morgan D. Evans, Jason M. Schaller, D. Jeffrey Lischer, Ala Moradian, William T. Weaver, Robert Brent Vopat
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Patent number: 9685303Abstract: A system and method for heating a substrate while that substrate is being processed by an ion beam is disclosed. The system comprises two arrays of light emitting diodes (LEDs) disposed above and below the ion beam. The LEDs may be GaN or GaP LEDs, which emit light at a wavelength which is readily absorbed by silicon, thus efficiently and quickly heating the substrate. The LED arrays may be arranged so that the ion beam passes between the two LED arrays and strikes the substrate. As the substrate is translated relative to the ion beam, the LEDs from the LED arrays provide heating to the substrate.Type: GrantFiled: May 8, 2015Date of Patent: June 20, 2017Assignee: Varian Semiconductor Equipment Associates, Inc.Inventors: Morgan D. Evans, Jason M. Schaller, D. Jeffrey Lischer, Ala Moradian
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Patent number: 9633875Abstract: An apparatus for improving the temperature uniformity of a workpiece during processing is disclosed. The apparatus includes a platen having a separately controlled edge heater capable to independently heating the outer edge of the platen. In this way, additional heat may be supplied near the outer edge of the platen, helping to maintain a constant temperature across the entirety of the platen. This edge heater may be disposed on an outer surface of the platen, or may, in certain embodiments, be embedded in the platen. In certain embodiments, the edge heater and the primary heating element are disposed in two different planes, where the edge heater is disposed closer to the top surface of the platen than the primary heating element.Type: GrantFiled: March 13, 2015Date of Patent: April 25, 2017Assignee: Varian Semiconductor Equipment Associates, Inc.Inventors: Dawei Sun, D. Jeffrey Lischer, Steven M. Anella, Dale K. Stone, Lyudmila Stone
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Patent number: 9633886Abstract: An electrostatic clamp having improved temperature uniformity is disclosed. The electrostatic clamp includes an LED array mounted along an annular ring so as to illuminate the outer edge of the workpiece. The LEDs in the LED array may emit light at a wavelength readily absorbed by the workpiece, such as between 0.4 ?m and 1.0 ?m. The center portion of the workpiece is heated using conductive heating provided by the heated electrostatic clamp. The outer portion of the workpiece is heated by light energy from the LED array. The LED array may be disposed on the base of the electrostatic clamp, or may be disposed on a separate ring. The diameter of the upper dielectric layer of the electrostatic clamp may be modified to accommodate the LED array.Type: GrantFiled: April 16, 2015Date of Patent: April 25, 2017Assignee: Varian Semiconductor Equipment Associates, Inc.Inventors: Morgan D. Evans, Jason M. Schaller, Ala Moradian, D. Jeffrey Lischer, Gregory D. Thronson
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Publication number: 20160329458Abstract: A system for heating substrates while being transported between the load lock and the platen is disclosed. The system comprises an array of light emitting diodes (LEDs) disposed above the alignment station. The LEDs may be GaN or GaP LEDs, which emit light at a wavelength which is readily absorbed by silicon, thus efficiently and quickly heating the substrate. The LEDs may be arranged so that the rotation of the substrate during alignment results in a uniform temperature profile of the substrate. Further, heating during alignment may also increase throughput and eliminate preheating stations that are currently associated with the processing chamber.Type: ApplicationFiled: May 8, 2015Publication date: November 10, 2016Inventors: Morgan D. Evans, Jason M. Schaller, D. Jeffrey Lischer, Ala Moradian, William T. Weaver, Robert Brent Vopat
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Publication number: 20160329190Abstract: A system and method for heating a substrate while that substrate is being processed by an ion beam is disclosed. The system comprises two arrays of light emitting diodes (LEDs) disposed above and below the ion beam. The LEDs may be GaN or GaP LEDs, which emit light at a wavelength which is readily absorbed by silicon, thus efficiently and quickly heating the substrate. The LED arrays may be arranged so that the ion beam passes between the two LED arrays and strikes the substrate. As the substrate is translated relative to the ion beam, the LEDs from the LED arrays provide heating to the substrate.Type: ApplicationFiled: May 8, 2015Publication date: November 10, 2016Inventors: Morgan D. Evans, Jason M. Schaller, D. Jeffrey Lischer, Ala Moradian
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Publication number: 20160307786Abstract: An electrostatic clamp having improved temperature uniformity is disclosed. The electrostatic clamp includes an LED array mounted along an annular ring so as to illuminate the outer edge of the workpiece. The LEDs in the LED array may emit light at a wavelength readily absorbed by the workpiece, such as between 0.4 ?m and 1.0 ?m. The center portion of the workpiece is heated using conductive heating provided by the heated electrostatic clamp. The outer portion of the workpiece is heated by light energy from the LED array. The LED array may be disposed on the base of the electrostatic clamp, or may be disposed on a separate ring. The diameter of the upper dielectric layer of the electrostatic clamp may be modified to accommodate the LED array.Type: ApplicationFiled: April 16, 2015Publication date: October 20, 2016Inventors: Morgan D. Evans, Jason M. Schaller, Ala Moradian, D. Jeffrey Lischer, Gregory D. Thronson
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Publication number: 20160268150Abstract: An apparatus for improving the temperature uniformity of a workpiece during processing is disclosed. The apparatus includes a platen having a separately controlled edge heater capable to independently heating the outer edge of the platen. In this way, additional heat may be supplied near the outer edge of the platen, helping to maintain a constant temperature across the entirety of the platen. This edge heater may be disposed on an outer surface of the platen, or may, in certain embodiments, be embedded in the platen. In certain embodiments, the edge heater and the primary heating element are disposed in two different planes, where the edge heater is disposed closer to the top surface of the platen than the primary heating element.Type: ApplicationFiled: March 13, 2015Publication date: September 15, 2016Inventors: Dawei Sun, D. Jeffrey Lischer, Steven M. Anella, Dale K. Stone, Lyudmila Stone
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Patent number: 9287148Abstract: A system and method for dynamic heating of a workpiece during processing is disclosed. The system includes an ion source and a plurality of LEDs arranged in an array, which are directed at a portion of the surface of the workpiece. The LEDs are selected so that they emit light in a frequency range that is readily absorbed by the workpiece, thus heating the workpiece. In some embodiments, the LEDs heat a portion of the workpiece just before that portion is processed by an ion beam. In another embodiment, the LEDs heat a portion of the workpiece as it is being processed. The LEDs may be arranged in an array, which may have a width that is at least as wide as the width of the ion beam. The array also has a length, perpendicular to its width, having one or more rows of LEDs.Type: GrantFiled: December 18, 2014Date of Patent: March 15, 2016Assignee: Varian Semiconductor Equipment Associates, Inc.Inventors: Morgan D. Evans, Kevin Anglin, D. Jeffrey Lischer, William T. Weaver, Jason M. Schaller, Robert Brent Vopat
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Patent number: 8933335Abstract: A current lead with a configuration to reduce heat load transfer in an alternating electrical current (AC) environment is disclosed. The current lead may comprise a conductive material having a configuration for reducing heat load transfer across the current lead when an alternating electrical current (AC) is applied to the current lead. A temperature gradient a may be exhibited along a length of the current lead.Type: GrantFiled: October 14, 2011Date of Patent: January 13, 2015Assignee: Varian Semiconductor Equipment Associates, Inc.Inventors: Gregory Citver, Frank Sinclair, D. Jeffrey Lischer, Nandishkumar Desai