Patents by Inventor D. Joseph Maurer

D. Joseph Maurer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6874377
    Abstract: A sensor package having a force sensing element and a housing. The force sensing element has an element surface, a well, a first and second shelves within the well. The housing has a housing surface. The first and second shelves of the housing are arranged to support the force sensing element so that the element surface and the housing surface are substantially coplanar and so that the element surface of the force sensing element directly senses a force without need of an actuator.
    Type: Grant
    Filed: November 10, 1999
    Date of Patent: April 5, 2005
    Assignee: Honeywell International Inc.
    Inventors: Said Karbassi, D. Joseph Maurer
  • Patent number: 6826966
    Abstract: A flow sensor package with a housing, a pressure sensing element, a restriction, and an elastomeric seal. The housing has a base, a cover, an inlet port, an outlet port, and first and second channels. The first and second channels are in parallel between the inlet port and the outlet port. The pressure sensing element is in the first channel and the restriction is the second channel. The elastomeric seal engages the pressure sensing element to prevent flow of a fluid, which may be a liquid, through the first channel. The elastomeric seal has a conductive path from the pressure sensing element to a lead, which extends outside the housing.
    Type: Grant
    Filed: August 9, 2000
    Date of Patent: December 7, 2004
    Assignee: Honeywell International Inc.
    Inventors: Said Karbassi, D. Joseph Maurer
  • Patent number: 6153070
    Abstract: An environmental sensor apparatus and method of making same is disclosed in which an environmentally sensitive silicon die is sandwiched between an elastomeric media seal and a conductive elastomeric pad contained within a housing. The conductive elastomeric pad contacts a printed circuit board (PCB) which leads from the housing. The die, elastomers and PCB are secured by a press fit plug which contacts the PCB and is heat staked to the housing to provide a substantially flush hermetic seal.
    Type: Grant
    Filed: May 7, 1998
    Date of Patent: November 28, 2000
    Assignee: Honeywell Inc
    Inventors: D. Joseph Maurer, Said Karbassi, Richard W. Gehman
  • Patent number: 5760313
    Abstract: A force sensor is provided with a two piece actuation system. A first actuator is disposed in contact with the pressure sensitive component and a second actuator is disposed in contact with the first actuator. When an external force is exerted against a distal end of the second actuator, for force is transmitted through the second actuator to the first actuator. The force is then transmitted through the first actuator to the pressure sensitive component. By using a two piece actuation system, the first actuator can be maintained at a constant location in contact with a position on the pressure sensitive component. This position will not vary even when the second actuator is moved or tilted. An elastomeric plate can be used to retain the first actuator in a constant position relative to the pressure sensitive component.
    Type: Grant
    Filed: March 5, 1997
    Date of Patent: June 2, 1998
    Assignee: Honeywell Inc.
    Inventors: Ronald E. Guentner, D. Joseph Maurer, Alan V. Sheriff
  • Patent number: 5744726
    Abstract: A pressure sensor is provided with an insert member that reduces the dead space of a fluid conduit used to provide fluid communication between a pressure sensitive component and a cavity within which a volume is contained. The insert member is provided with a channel formed in its outer surface so that continued fluid communication can be maintained between the fluid whose pressure is to be monitored and a pressure sensitive component disposed within the structure of the pressure sensor. The use of the insert member significantly facilitates the manufacture of the pressure sensor and reduces the need to utilize pins of excessively small cross sectional area during the molding process.
    Type: Grant
    Filed: February 25, 1997
    Date of Patent: April 28, 1998
    Assignee: Honeywell Inc.
    Inventor: D. Joseph Maurer
  • Patent number: 5684253
    Abstract: The present invention relates generally to a pressure sensor and, more specifically, to a pressure equalization structure that balances the forces on the pressure sensitive component in order to reduce the stress that could otherwise be imposed on its piezoresistors. The pressure sensor provides a housing in which a cavity is formed. Within the cavity, a pressure sensitive component is disposed between a first seal and a second seal in order to expose a first surface of the pressure sensitive component to a first conduit and a second surface of the pressure sensitive component to a second conduit. The pressure surrounding the pressure sensitive structure is generally equalized to one of the first and second conduits by providing a bypass conduit connected therebetween.
    Type: Grant
    Filed: January 8, 1997
    Date of Patent: November 4, 1997
    Assignee: Honeywell Inc.
    Inventors: Ulrich Bonne, D. Joseph Maurer
  • Patent number: 5644285
    Abstract: A pressure sensor die is provided with a flexible membrane and a plunger which combine to amplify a low pressure signal while also providing media isolation between a fluid being measured and the internal components of a pressure sensor. One embodiment of the pressure sensor disposes an end of the plunger in direct contact with a pressure sensor die while another embodiment disposes an elastomeric diaphragm between the plunger and the pressure sensor die. This second embodiment creates a chamber between the plunger and the pressure sensor die in which a fluid is captured by movement of the plunger. The captured fluid is decreased in volume by movement of the plunger and the resulting increase in pressure in transmitted to a pressure sensitive portion of a pressure sensor die. The device is particularly useful in conjunction with applications where media isolation is required between the fluid being measured and the components of the pressure sensor, such as kidney dialysis machines.
    Type: Grant
    Filed: February 1, 1995
    Date of Patent: July 1, 1997
    Assignee: Honeywell Inc.
    Inventor: D. Joseph Maurer
  • Patent number: 5483994
    Abstract: A pressure sensor die is provided with a flexible membrane and a plunger which combine to amplify a low pressure signal while also providing media isolation between a fluid being measured and the internal components of a pressure sensor. One embodiment of the pressure sensor disposes an end of the plunger in direct contact with a pressure sensor die while another embodiment disposes an elastomeric diaphragm between the plunger and the pressure sensor die. This second embodiment creates a chamber between the plunger and the pressure sensor die in which a fluid is captured by movement of the plunger. The captured fluid is decreased in volume by movement of the plunger and the resulting increase in pressure in transmitted to a pressure sensitive portion of a pressure sensor die. The device is particularly useful in conjunction with applications where media isolation is required between the fluid being measured and the components of the pressure sensor, such as kidney dialysis machines.
    Type: Grant
    Filed: February 1, 1995
    Date of Patent: January 16, 1996
    Assignee: Honeywell, Inc.
    Inventor: D. Joseph Maurer
  • Patent number: 5412994
    Abstract: A pressure sensor is provided in which the pressure sensing components are isolated from a portion of an attached buffer member which is connected to a fluid conduit. The offset characteristic of the pressure sensor isolates stress from being transmitted between an attached external fluid conduit and the sensitive components of the pressure sensor. One embodiment of the pressure sensor solders a fluid conduit structure to a buffer member that is attached to a pressure sensor die. An alternative embodiment of the present invention avoids the need for making solder connections between the sensor structure and external components by utilizing elastomeric conductors and pressure seals in association with the pressure sensor composite structure and first and second housing structures. These elastomeric conductors also provide improved stress isolation. The housing structures are used to compress to the seal and the elastomeric conductor against selected portions of the composite sensor.
    Type: Grant
    Filed: June 14, 1994
    Date of Patent: May 9, 1995
    Inventors: James D. Cook, Albert W. Drabowicz, D. Joseph Maurer, Mark R. Plagens, Uppili Sridhar, Carl E. Stewart
  • Patent number: 5327785
    Abstract: A pressure sensor is provided with a means for efficiently removing heat from a circuit portion of a sensor die by providing an elastomeric member between a first surface of the sensor die and electrical leads. A thermally conductive, but electrically insulative, portion of the elastomeric member is disposed between the circuit portion of the sensor die and the leads and a means is provided for urging the first surface of the sensor die into thermal communicating contact with the thermally conductive portion of the elastomeric member. In addition, a selectively conductive portion of the elastomeric member is disposed between contact pads on the first surface of the sensor die and electrical leads encapsulated within a portion of the sensor housing. The elastomeric member is also provided with an opening formed therethrough and aligned with the diaphragm portion of the sensor die to permit the media to be in fluid communication with the diaphragm of the sensor die.
    Type: Grant
    Filed: March 9, 1993
    Date of Patent: July 12, 1994
    Assignee: Honeywell Inc.
    Inventor: D. Joseph Maurer
  • Patent number: D460009
    Type: Grant
    Filed: June 1, 2001
    Date of Patent: July 9, 2002
    Assignee: Honeywell International Inc.
    Inventor: D. Joseph Maurer
  • Patent number: D468683
    Type: Grant
    Filed: June 1, 2001
    Date of Patent: January 14, 2003
    Assignee: Honeywell International Inc.
    Inventor: D. Joseph Maurer
  • Patent number: D348042
    Type: Grant
    Filed: December 17, 1992
    Date of Patent: June 21, 1994
    Assignee: Honeywell, Inc.
    Inventors: James D. Cook, D. Joseph Maurer
  • Patent number: D382822
    Type: Grant
    Filed: July 18, 1996
    Date of Patent: August 26, 1997
    Inventor: D. Joseph Maurer
  • Patent number: D400812
    Type: Grant
    Filed: August 29, 1997
    Date of Patent: November 10, 1998
    Assignee: Honeywell Inc.
    Inventor: D. Joseph Maurer