Patents by Inventor D. Lawrence Boughter

D. Lawrence Boughter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package for electrical components having a molded structure with a port extending into the molded structure
    Patent number: 5686698
    Abstract: A package for mounting electrical components and a method for making the package. A mold structure (50) is formed by encapsulating a portion of a leadframe (10) with a molding compound. Leads (23) project from one side of the mold structure and a portion of a tab (27) projects from another side of the mold structure, which has a cavity (57) between the leads (23) and the tab (27). In addition, the mold structure has vent holes (76) between the leads (23) and an aperture (62) extending to the cavity. After mounting a semiconductor chip (64) in the cavity (57), it is covered by a lid (53) and a portion (24) of the leads (23) and a portion (29) of the tab (27) are formed. The tab (27) provides structural rigidity to the mold structure (50) and permits surface mounting the mold structure (50).
    Type: Grant
    Filed: June 30, 1994
    Date of Patent: November 11, 1997
    Assignee: Motorola, Inc.
    Inventors: Dave S. Mahadevan, D. Lawrence Boughter