Patents by Inventor D. Matthew Odhner

D. Matthew Odhner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods of operating a wire bonding machine, including methods of monitoring an accuracy of bond force on a wire bonding machine, and related methods
    Patent number: 11865633
    Abstract: A method of operating a wire bonding machine is provided. The method includes: (a) operating a wire bonding machine during at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation, wherein a bonding force is applied during the operation of the wire bonding machine; and (b) monitoring an accuracy of the bonding force of the wire bonding machine during the at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation.
    Type: Grant
    Filed: February 1, 2023
    Date of Patent: January 9, 2024
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Hui Xu, Wei Qin, D. Matthew Odhner
  • METHODS OF OPERATING A WIRE BONDING MACHINE, INCLUDING METHODS OF MONITORING AN ACCURACY OF BOND FORCE ON A WIRE BONDING MACHINE, AND RELATED METHODS
    Publication number: 20230166348
    Abstract: A method of operating a wire bonding machine is provided. The method includes: (a) operating a wire bonding machine during at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation, wherein a bonding force is applied during the operation of the wire bonding machine; and (b) monitoring an accuracy of the bonding force of the wire bonding machine during the at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation.
    Type: Application
    Filed: February 1, 2023
    Publication date: June 1, 2023
    Inventors: Hui Xu, Wei Qin, D. Matthew Odhner
  • Methods of operating a wire bonding machine, including methods of monitoring an accuracy of bond force on a wire bonding machine, and related methods
    Patent number: 11597031
    Abstract: A method of operating a wire bonding machine is provided. The method includes: (a) operating a wire bonding machine during at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation, wherein a bonding force is applied during the operation of the wire bonding machine; and (b) monitoring an accuracy of the bonding force of the wire bonding machine during the at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation.
    Type: Grant
    Filed: November 3, 2021
    Date of Patent: March 7, 2023
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Hui Xu, Wei Qin, D. Matthew Odhner
  • METHODS OF OPERATING A WIRE BONDING MACHINE, INCLUDING METHODS OF MONITORING AN ACCURACY OF BOND FORCE ON A WIRE BONDING MACHINE, AND RELATED METHODS
    Publication number: 20220134469
    Abstract: A method of operating a wire bonding machine is provided. The method includes: (a) operating a wire bonding machine during at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation, wherein a bonding force is applied during the operation of the wire bonding machine; and (b) monitoring an accuracy of the bonding force of the wire bonding machine during the at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation.
    Type: Application
    Filed: November 3, 2021
    Publication date: May 5, 2022
    Inventors: Hui Xu, Wei Qin, D. Matthew Odhner