Abstract: A hardcoat composition includes one or more multifunctional (meth)acrylate monomers, and a nanoparticle mixture dispersed within the one or more multifunctional (meth)acrylate monomers. The nanoparticle mixture includes a first population of reactive nanoparticles. The first population of reactive nanoparticles have an average particle diameter in a range from 5 nm to 60 nm, and a second population of non-reactive nanoparticles. The second population of non-reactive nanoparticles have an average particle diameter in a range from 5 nm to 60 nm.

Abstract: Nanocomposite blends include metal oxide nanoparticles and at least two (meth)acrylic acid polymers where the nanoparticles are surface modified with a carboxylic acid silane and where the (meth)acrylic acid polymers are at least partially neutralized. The compositions are transparent, with high transmission and low haze up to very high nanoparticle loading. The compositions also exhibit improved mechanical properties of impact resistance and tensile modulus.

Abstract: A hardcoat composition includes one or more multifunctional (meth)acrylate monomers, and a nanoparticle mixture dispersed within the one or more multifunctional (meth)acrylate monomers. The nanoparticle mixture includes a first population of reactive nanoparticles. The first population of reactive nanoparticles have an average particle diameter in a range from 5 nm to 60 nm, and a second population of non-reactive nanoparticles. The second population of non-reactive nanoparticles have an average particle diameter in a range from 5 nm to 60 mn.

Abstract: Molded optical articles and methods of making them are disclosed herein. Optical articles comprise a photopolymerizable composition disposed on a major surface of a substrate. The photopolymerizable composition comprises: a silicon-containing resin comprising silicon-bonded hydrogen and aliphatic unsaturation, and a platinum catalyst providing from about 0.5 to about 30 parts per million of platinum. The major surface imparts a positive or negative lens to the photopolymerizable composition. Optical articles also include those that have been photopolymerized using actinic radiation having a wavelength of 700 nm or less.

Abstract: A light emitting device comprises an LED die, a dome lens encapsulating the LED die, the dome lens having a first outer curved surface, and a photopolymerizable composition disposed on the dome lens. The photopolymerizable composition forms a meniscus lens defined by a second outer curved surface and an inner curved surface, the inner curved surface being in contact with only a portion of the first outer curved surface. The dome lens and the meniscus lens in combination form an elongated dome lens.

Abstract: A light emitting device that includes a light emitting diode and a multilayer encapsulant is disclosed. The multilayer encapsulant includes a first encapsulant in contact with the light emitting diode and a photopolymerizable composition in contact with the first encapsulant. The first encapsulant may be a silicone gel, silicone gum, silicone fluid, organosiloxane, polysiloxane, polyimide, polyphosphazene, sol-gel composition, or another photopolymerizable composition. The photopolymerizable compositions include a silicon-containing resin and a metal-containing catalyst, the silicon-containing resin comprising silicon-bonded hydrogen and aliphatic unsaturation. Actinic radiation having a wavelength of 700 nm or less can be applied to initiate hydrosilylation within the silicon-containing resins.

Abstract: Disclosed herein are LED devices having lenses and methods of making the devices. The LED devices are made using an optical layer comprising a plurality of lens features. The optical layer is disposed relative to the LED die such that at least one LED die is optically coupled to at least one lens feature. A lens can then be made from the lens feature and excess optical layer removed to provide the device.

Abstract: Disclosed herein is a method of making a light emitting device having an LED die and a molded encapsulant made by polymerizing at least two polymerizable compositions. The method includes: (a) providing an LED package having an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated; (b) providing a mold having a cavity filled with a second polymerizable composition; (c) contacting the first and second polymerizable compositions; (d) polymerizing the first and second polymerizable compositions to form first and second polymerized compositions, respectively, wherein the first and second polymerized compositions are bonded together; and (e) optionally separating the mold from the second polymerized composition. Light emitting devices prepared according to the method are also described.

Abstract: A light emitting device comprises an LED die, a dome lens encapsulating the LED die, the dome lens having a first outer curved surface, and a photopolymerizable composition disposed on the dome lens. The photopolymerizable composition forms a meniscus lens defined by a second outer curved surface and an inner curved surface, the inner curved surface being in contact with only a portion of the first outer curved surface. The dome lens and the meniscus lens in combination form an elongated dome lens.

Abstract: Disclosed herein is a method of making a light emitting device having an LED die and a molded encapsulant made by polymerizing at least two polymerizable compositions. The method includes: (a) providing an LED package having an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated; (b) providing a mold having a cavity filled with a second polymerizable composition; (c) contacting the first and second polymerizable compositions; (d) polymerizing the first and second polymerizable compositions to form first and second polymerized compositions, respectively, wherein the first and second polymerized compositions are bonded together; and (e) optionally separating the mold from the second polymerized composition. Light emitting devices prepared according to the method are also described.

Abstract: Disclosed herein is a method of making a light emitting device having an LED die and a molded encapsulant made by polymerizing at least two polymerizable compositions. The method includes: (a) providing an LED package having an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated; (b) providing a mold having a cavity filled with a second polymerizable composition; (c) contacting the first and second polymerizable compositions; (d) polymerizing the first and second polymerizable compositions to form first and second polymerized compositions, respectively, wherein the first and second polymerized compositions are bonded together; and (e) optionally separating the mold from the second polymerized composition. Light emitting devices prepared according to the method are also described.

Abstract: Disclosed herein is an optical bonding composition that may be used in optical applications. An LED light source that utilizes the composition is also disclosed, as well as a method of making it. The LED light source may comprise: an LED die; an optical element optically coupled to the LED die; and a bonding layer comprising surface-modified metal oxide nanoparticles in an amorphous silicate network, the bonding layer bonding the LED die and the optical element together. Efficiency of the LED light source may be increased when using an optical extractor as the optical element.

Abstract: An optical bonding composition and LED light source comprising the composition are disclosed, as well as a method of making the LED light source. The LED light source may comprise: an LED die; an optical element optically coupled to the LED die; and a bonding layer comprising an amorphous organopolysiloxane network, the organopolysiloxane network comprising a silsesquioxane portion derived from (R1SiO1.5)n wherein R1 is an organic group and n is an integer of at least 10; the bonding layer bonding the LED die and the optical element together. Efficiency of the LED light source may be increased when using an optical extractor as the optical element.

Abstract: A three-dimensional shaped structure is prepared from a multi-photon reactive composition including: (a) at least one reactive species; (b) a multi-photon photoinitiator system; and (c) a plurality of substantially inorganic particles, wherein the particles have an average particle size of less than about 10 microns in diameter.

Abstract: A light emitting device that includes a light emitting diode and a multilayer encapsulant is disclosed. The multilayer encapsulant includes a first encapsulant in contact with the light emitting diode and a photopolymerizable composition in contact with the first encapsulant. The first encapsulant may be a silicone gel, silicone gum, silicone fluid, organosiloxane, polysiloxane, polyimide, polyphosphazene, sol-gel composition, or another photopolymerizable composition. The photopolymerizable compositions include a silicon-containing resin and a metal-containing catalyst, the silicon-containing resin comprising silicon-bonded hydrogen and aliphatic unsaturation. Actinic radiation having a wavelength of 700 nm or less can be applied to initiate hydrosilylation within the silicon-containing resins.

Abstract: Illumination assemblies and systems using same are disclosed. The illumination assembly can include a reflective substrate, and a light source unit including one or more light sources capable of producing illumination light. The assembly can further include a first light extraction surface including an azimuthal beam widening topography, where the first light extraction surface is positioned such that the light source unit is between the first light extraction surface and the reflective substrate. The first light extraction surface can face the light source unit.

Abstract: Disclosed herein is an optical bonding composition that may be used in optical applications. An LED light source that utilizes the composition is also disclosed, as well as a method of making it. The LED light source may comprise: an LED die; an optical element optically coupled to the LED die; and a bonding layer comprising surface-modified metal oxide nanoparticles in an amorphous silicate network, the bonding layer bonding the LED die and the optical element together. Efficiency of the LED light source may be increased when using an optical extractor as the optical element.

Abstract: An optical bonding composition and LED light source comprising the composition are disclosed, as well as a method of making the LED light source. The LED light source may comprise: an LED die; an optical element optically coupled to the LED die; and a bonding layer comprising an amorphous organopolysiloxane network, the organopolysiloxane network comprising a silsesquioxane portion derived from (R1SiO1.5)n wherein R1 is an organic group and n is an integer of at least 10; the bonding layer bonding the LED die and the optical element together. Efficiency of the LED light source may be increased when using an optical extractor as the optical element.

Abstract: A process comprises (a) providing a substantially inorganic photoreactive composition comprising (1) at least one cationically reactive species, (2) a multi-photon photoinitiator system, and 10 (3) a plurality of precondensed, inorganic nanoparticles; (b) exposing, using a multibeam interference technique involving at least three beams, at least a portion of the photoreactive composition to radiation of appropriate wavelength, spatial distribution, and intensity to produce a two-dimensional or three-dimensional periodic pattern of reacted and non-reacted portions of the photoreactive composition; (c) exposing at least a portion of the non-reacted portion of the photoreactive composition to radiation of appropriate wavelength and intensity to cause multi-photon absorption and photoreaction to form additional reacted portion; (d) removing the non-reacted portion or the reacted portion of the photoreactive composition to form interstitial void space; and (e) at least partially filling the interstitial void space

Abstract: A method of making an LED light emitting device is disclosed. The method includes forming a multilayer encapsulant in contact with an LED by contacting the LED with a first encapsulant that is a silicone gel, silicone gum, silicone fluid, organosiloxane, polysiloxane, polyimide, polyphosphazene, sol-gel composition, or a first photopolymerizable composition, and then contacting the first encapsulant with a second photopolymerizable composition. Each photopolymerizable composition includes a silicon-containing resin and a metal-containing catalyst, the silicon-containing resin comprising silicon-bonded hydrogen and aliphatic unsaturation. Actinic radiation having a wavelength of 700 nm or less is applied to initiate hydrosilylation within the silicon-containing resins.