Abstract: Disclosed herein is a method of making a light emitting device having an LED die and a molded encapsulant made by polymerizing at least two polymerizable compositions. The method includes: (a) providing an LED package having an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated; (b) providing a mold having a cavity filled with a second polymerizable composition; (c) contacting the first and second polymerizable compositions; (d) polymerizing the first and second polymerizable compositions to form first and second polymerized compositions, respectively, wherein the first and second polymerized compositions are bonded together; and (e) optionally separating the mold from the second polymerized composition. Light emitting devices prepared according to the method are also described.

Abstract: A multi-photon reactive composition including: (a) at least one reactive species; and (b) multi-photon photoinitiator system; and (c) a plurality of substantially inorganic particles, wherein the particles have an average particle size of less than about 10 microns in diameter.

Abstract: A printable composition for forming an insulating layer is disclosed, the insulating layer typically being a dielectric layer. The printable composition is particularly well suited for making cured insulating layers on touch screens, but is also suitable for a variety of other applications. In certain embodiments the composition is suitable for application using digital printing technology such as ink jet printing to precisely apply the printable composition it to a substrate. In addition, the present invention is directed to insulating layers and made using the composition, as well as to methods of applying the composition and articles incorporating insulating layers made using the composition.

Abstract: A method for making an inorganic structure including: (a) applying a photoreactive composition to a substrate, wherein the composition includes: a reactive species, a photoinitiator system, and a plurality of substantially inorganic colloidal particles, wherein the particles have an average particle size of less than about 300 nm; (b) photopatterning the composition to define a structure; and (c) subjecting the structure to elevated temperature for a time sufficient to pyrolyze the reactive species and to at least partially fuse the particles.

Abstract: Disclosed herein is a method of making a light emitting device comprising an LED and a molded silicon-containing encapsulant. The method includes contacting the LED with a photopolymerizable composition containing a silicon-containing resin having silicon-bonded hydrogen and aliphatic unsaturation and two metal-containing catalysts. One catalyst may be activated by actinic radiation, and the second by heat but not the actinic radiation. Polymerization of the photopolymerizable composition to form the encapsulant may be carried out by selectively activating the different catalysts. At some point before polymerization is complete, a mold is used to impart a predetermined shape to the encapsulant.

Abstract: A method of making a light emitting device is disclosed herein, the method including the steps of (A) providing a light emitting diode; and (B) contacting the light emitting diode with a photopolymerizable composition comprising: a silicon-containing resin comprising silicon-bonded hydrogen and aliphatic unsaturation; a first metal-containing catalyst that may be activated by actinic radiation; and a second metal-containing catalyst that may be activated by heat but not the actinic radiation; and (C) heating the photopolymerizable composition to a temperature of less than 150° C. to initiate hydrosilylation, thereby forming a first encapsulant.

Abstract: Disclosed herein is a method of making a light emitting device comprising an LED and a molded silicon-containing encapsulant. The method includes contacting the LED with a photopolymerizable composition containing a silicon-containing resin having silicon-bonded hydrogen and aliphatic unsaturation and a metal-containing catalyst that may be activated by actinic radiation. Photopolymerization of the photopolymerizable composition is then carried out to form the encapsulant. At some point before polymerization is complete, a mold is used to impart a predetermined shape to the encapsulant.

Abstract: A method of making a light emitting device is disclosed herein. The method includes the steps of: (A) providing a light emitting diode; and (B) contacting the light emitting diode with a photopolymerizable composition having: a silicon-containing resin comprising silicon-bonded hydrogen and aliphatic unsaturation; a first metal-containing catalyst that may be activated by actinic radiation; and a second metal-containing catalyst that may be activated by heat but not the actinic radiation. The method may further include the step of: (C) applying actinic radiation of 700 nm or less to initiate hydrosilylation within the silicon-containing resin. The method may also include the step of: (D) heating the photopolymerizable composition to less than 150° C. to further initiate hydrosilylation, or (D) simultaneously applying actinic radiation and heat.

Abstract: An edge-lit backlight having a light recycling cavity with concave transflector is disclosed. The edge-lit backlight has an output area and includes a back reflector facing the output area of the backlight. The backlight further includes a transflector that partially transmits and partially reflects incident light, the transflector being shaped to form a concave structure facing the back reflector to provide one or more recycling cavities therebetween, where the one or more recycling cavities substantially fill the output area of the backlight. The backlight further includes at least one light source positioned adjacent a first edge of the backlight. The at least one light source is operable to inject light into the one or more recycling cavities through an input surface of the one or more recycling cavities, where the input surface is substantially orthogonal to the output area, and where the at least one concave structure converges with the back reflector in a direction distal from the input surface.

Abstract: Direct-lit backlights and associated methods and components are disclosed In one embodiment, a method of forming a direct-lit backlight having an output area includes providing a transflector that partially transmits and partially reflects incident light. The method further includes forming one or more recycling cavities that substantially fill the output area of the backlight, where forming the one or more recycling cavities includes forming the transflector into at least one concave structure that faces a back reflector of the backlight. The method further includes positioning at least one light source behind the output area to inject light into the one or more recycling cavities.

Abstract: Illumination assemblies and systems using same are disclosed. The illumination assembly can include a reflective substrate, and a light source unit including one or more light sources capable of producing illumination light. The assembly can further include a first light extraction surface including an azimuthal beam widening topography, where the first light extraction surface is positioned such that the light source unit is between the first light extraction surface and the reflective substrate. The first light extraction surface can face the light source unit.

Abstract: Disclosed herein is a coated optical fiber comprising: a siliceous optical fiber including a core inside a cladding; and a cured coating comprising: a thermally cured polyorganosilsesquioxane; and an oxide powder dispersed in said cured polyorganosilsesquioxane, wherein said oxide powder has a refractive index from about 1.2 to about 2.7 and includes a plurality of particles having a particle size less than about 100 nanometers, said cured coating having adhesion to said siliceous optical fiber and further having transparency to ultraviolet radiation. Also disclosed herein is a fiber optic device comprising the optical fiber.

Abstract: A method of making a light emitting device is disclosed. The method includes providing a light emitting diode and forming an encapsulant in contact with the light emitting diode; wherein forming the encapsulant includes contacting the light emitting diode with a photopolymerizable composition comprising a silicon-containing resin, a metal-containing catalyst, and surface treated particles, the silicon-containing resin comprises silicon-bonded hydrogen and aliphatic unsaturation, the surface treated particles comprising nonabsorbing metal oxide particles, semiconductor particles, or combinations thereof, and applying actinic radiation having a wavelength of 700 nm or less to initiate hydrosilylation within the silicon-containing resin.

Abstract: A method of making a light emitting device is disclosed. The method includes providing a light emitting diode and forming an encapsulant in contact with the light emitting diode; wherein forming the encapsulant includes contacting the light emitting diode with a photopolymerizable composition consisting of a silicon-containing resin and a metal-containing catalyst, wherein the silicon-containing resin consists of silicon-bonded hydrogen and aliphatic unsaturation, and applying actinic radiation having a wavelength of 700 nm or less to initiate hydrosilylation within the silicon-containing resin.

Abstract: A method of making a light emitting device is disclosed. The method includes the steps of providing a light emitting diode and forming an encapsulant in contact with the light emitting diode; wherein forming the encapsulant includes contacting the light emitting diode with a photopolymerizable composition consisting of a silicon-containing resin and a metal-containing catalyst, wherein the silicon-containing resin consists of silicon-bonded hydrogen and aliphatic unsaturation, and applying actinic radiation having a wavelength of 700 nm or less to initiate hydrosilylation within the silicon-containing resin.

Abstract: A process for producing photonic crystals comprises (a) providing a substantially inorganic photoreactive composition; (b) exposing, using a multibeam interference technique involving at least three beams, at least a portion of the photoreactive composition to radiation of appropriate wavelength, spatial distribution, and intensity to produce a two-dimensional or three-dimensional periodic pattern of reacted and non-reacted portions of the photoreactive composition; and (c) removing the non-reacted portion or the reacted portion of the photoreactive composition to form interstitial void space.

Abstract: A printable composition for forming an insulating layer is disclosed, the insulating layer typically being a dielectric layer. The printable composition is particularly well suited for making cured insulating layers on touch screens, but is also suitable for a variety of other applications. In certain embodiments the composition is suitable for application using digital printing technology such as ink jet printing to precisely apply the printable composition it to a substrate. In addition, the present invention is directed to insulating layers and made using the composition, as well as to methods of applying the composition and articles incorporating insulating layers made using the composition.