Patents by Inventor D. Williams

D. Williams has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230109436
    Abstract: Techniques for self-checkout alert reduction based on packaging detection. A deflection in a first bag reservoir associated with a self-checkout kiosk is determined. The first bag reservoir is positioned adjacent to a packing area and includes a first type of bags. The self-checkout kiosk includes a terminal scale and further includes a platform scale in the packing area. That an empty bag is retrieved from the first bag reservoir is determined based on the deflection in the first bag reservoir. A bag type and a weight range are identified for the empty bag. An allowed weight range of a combination of the empty bag and a desired item is then determined. Presence of the empty bag on the platform scale is prevented from causing a loss prevention alert to be generated when the desired item has been placed in the empty bag on the platform scale.
    Type: Application
    Filed: December 8, 2022
    Publication date: April 6, 2023
    Applicant: Toshiba Global Commerce Solutions Holdings Corporation
    Inventors: Paul WILSON, Tong YU, Duane MILLER, Timothy CROCKETT, Jose FIGUEROA, Craig COMPTON, Paul KOKKELENBERG, Scott GRAHAM, Suzanne BLEAKLEY, John HIBBARD, Charles KURTZ, Craig TURNER, Edna NOVIDO, Ashley TRIMPEY, D. WILLIAMS, Sally IERSTON
  • Publication number: 20050264311
    Abstract: A clamping assembly is described for connecting a first plurality of contacts to a second plurality of contacts on a circuit board. The circuit board has a first outer face at an end and on one side of the circuit board, and a second outer face at the end and on the other side of the circuit board. The second contacts are arranged on at least one of the first and second outer faces. The circuit board also includes at least one first mechanical alignment feature. The clamping assembly includes a first assembly having a first inner face, and a second assembly having a second inner face substantially parallel to the first inner face. The first plurality of contacts are arranged on at least one of the first and second inner faces. At least one second mechanical alignment feature is operable in conjunction with the at least one first mechanical alignment feature on the circuit board to facilitate alignment of the first contacts with the second contacts.
    Type: Application
    Filed: July 25, 2005
    Publication date: December 1, 2005
    Inventors: Roger Sinsheimer, D. Williams
  • Publication number: 20050046411
    Abstract: A device-under test (DUT) assembly includes a DUT board having a plurality of spine assemblies. Each spine assembly has a first outer face, a second outer face, and a first plurality of contacts on at least one of the first and second outer faces in electrical contact with a subset of the first signal lines. A connector assembly includes a plurality of clamping assemblies arranged to receive the plurality of spine assemblies. Each clamping assembly includes a first inner face, a second inner face, and a second plurality of contacts on at least one of the first and second inner faces in electrical contact with a subset of the second signal lines. Electrical connections between the first and second contacts are formed when the first and second inner faces of each clamping assembly are clamped to the first and second outer faces of the corresponding spine assembly.
    Type: Application
    Filed: October 13, 2004
    Publication date: March 3, 2005
    Inventors: Roger Sinsheimer, D. Williams