Patents by Inventor Da-Chen Pang

Da-Chen Pang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9313578
    Abstract: A manufacturing method of a sensor device integrated with ultrasonic transducer and microphone is to form a first support structure, a back plate, a second support structure, a membrane and electrodes on a substrate. The substrate is divided into a first region and a second region. The first electrode, the third electrode, a part of the back plate, a part of the second support structure and a part of the membrane that are above the first region form the ultrasonic transducer. The first support structure, the second electrode, the fourth electrode, a part of the back plate, a part of the second support structure and a part of the membrane that are above the second region form the microphone. The ultrasonic transducer and the microphone are simultaneously manufactured.
    Type: Grant
    Filed: August 8, 2014
    Date of Patent: April 12, 2016
    Assignee: National Kaosiung University of Applied Sciences
    Inventor: Da-Chen Pang
  • Publication number: 20150281845
    Abstract: A manufacturing method of a sensor device integrated with ultrasonic transducer and microphone is to form a first support structure, a back plate, a second support structure, a membrane and electrodes on a substrate. The substrate is divided into a first region and a second region. The first electrode, the third electrode, a part of the back plate, a part of the second support structure and a part of the membrane that are above the first region form the ultrasonic transducer. The first support structure, the second electrode, the fourth electrode, a part of the back plate, a part of the second support structure and a part of the membrane that are above the second region form the microphone. The ultrasonic transducer and the microphone are simultaneously manufactured.
    Type: Application
    Filed: August 8, 2014
    Publication date: October 1, 2015
    Inventor: DA-CHEN PANG
  • Patent number: 7721397
    Abstract: A capacitive ultrasonic transducer includes a flexible layer, a first conductive layer on the flexible layer, a support frame on the first conductive layer, the support frame including a flexible material, a membrane over the support frame being spaced apart from the first conductive layer by the support frame, the membrane including the flexible material, a cavity defined by the first conductive layer, the support frame and the membrane, and a second conductive layer on the membrane.
    Type: Grant
    Filed: February 7, 2007
    Date of Patent: May 25, 2010
    Assignee: Industrial Technology Research Institute
    Inventors: Ming-Wei Chang, Tse-Min Deng, Te-I Chiu, Mu-Yue Chen, Da-Chen Pang, Ping-Ta Tai
  • Patent number: 7673375
    Abstract: A method of fabricating a polymer-based capacitive ultrasonic transducer, which comprises the steps of: (a) providing a substrate; (b) forming a first conductor on the substrate; (c) coating a sacrificial layer on the substrate while covering the first conductor by the same; (d) etching the sacrificial layer for forming an island while maintaining the island to contact with the first conductor; (e) coating a first polymer-based material on the substrate while covering the island by the same; (f) forming a second conductor on the first polymer-based material; (g) forming a via hole on the first polymer-based material while enabling the via hole to be channeled to the island; and (h) utilizing the via hole to etch and remove the island for forming a cavity.
    Type: Grant
    Filed: August 29, 2005
    Date of Patent: March 9, 2010
    Assignee: Industrial Technology Research Institute
    Inventors: Ming-Wei Chang, Da-Chen Pang, Chao-Sheng Tseng
  • Publication number: 20090126183
    Abstract: A method of fabricating a polymer-based capacitive ultrasonic transducer, which comprises the steps of: (a) providing a substrate; (b) forming a first conductor on the substrate; (c) coating a sacrificial layer on the substrate while covering the first conductor by the same; (d) etching the sacrificial layer for forming an island while maintaining the island to contact with the first conductor; (e) coating a first polymer-based material on the substrate while covering the island by the same; (f) forming a second conductor on the first polymer-based material; (g) forming a via hole on the first polymer-based material while enabling the via hole to be channeled to the island; and (h) utilizing the via hole to etch and remove the island for forming a cavity.
    Type: Application
    Filed: January 5, 2009
    Publication date: May 21, 2009
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ming-Wei Chang, Da-Chen Pang, Chao-Sheng Tseng
  • Publication number: 20080188753
    Abstract: A capacitive ultrasonic transducer includes a flexible layer, a first conductive layer on the flexible layer, a support frame on the first conductive layer, the support frame including a flexible material, a membrane over the support frame being spaced apart from the first conductive layer by the support frame, the membrane including the flexible material, a cavity defined by the first conductive layer, the support frame and the membrane, and a second conductive layer on the membrane.
    Type: Application
    Filed: February 7, 2007
    Publication date: August 7, 2008
    Inventors: Ming-Wei Chang, Tse-Min Deng, Te-I Chiu, Mu-Yue Chen, Da-Chen Pang, Ping-Ta Tai
  • Publication number: 20070013266
    Abstract: A method of fabricating a polymer-based capacitive ultrasonic transducer, which comprises the steps of: (a) providing a substrate; (b) forming a first conductor on the substrate; (c) coating a sacrificial layer on the substrate while covering the first conductor by the same; (d) etching the sacrificial layer for forming an island while maintaining the island to contact with the first conductor; (e) coating a first polymer-based material on the substrate while covering the island by the same; (f) forming a second conductor on the first polymer-based material; (g) forming a via hole on the first polymer-based material while enabling the via hole to be channeled to the island; and (h) utilizing the via hole to etch and remove the island for forming a cavity.
    Type: Application
    Filed: August 29, 2005
    Publication date: January 18, 2007
    Inventors: Ming-Wei Chang, Da-Chen Pang, Chao-Sheng Tseng