Abstract: An optical fingerprint recognition sensor package, which comprises a carrier, at least one image sensor, at least one light emitting diode, a first molding compound and at least one second molding compound is provided. The image sensor is disposed on the carrier and being electrically connected thereto. The at least one light emitting diode is peripherally surrounding the image sensor for providing at least one light source. The first molding compound made of infrared material is configured to be adjacent to the image sensor to hinder ambient lights from interfering with the image sensor. The second molding compound made of colored silicone is disposed over the light emitting diode to provide lighting path for the light source. By employing the proposed present invention, interferences from the ambient lights with the image sensor can be effectively avoided, thus increasing the accuracy and precision of the sensing results.

Abstract: The present invention provides an optical fingerprint sensor module and its package thereof, which comprises a carrier, at least one light emitting diode, at least one image sensor and a molding compound. When a user's fingerprint is generated for recognition, the light emitting diode provides enough light sources for lighting and helping the image sensor to capture and sense an image of the fingerprint. A top emitting surface of the light emitting diode is higher than a top of the image sensor, such that interferences from the side light of the light emitting diode with the image sensor can be effectively avoided. Besides, the molding compound comprises a caved portion corresponding to the image sensor on a vertical plane. By designing above, it successfully achieves the purpose of reducing a thickness of the optical fingerprint sensor package.

Abstract: An optical fingerprint recognition sensor package, which comprises a carrier, at least one image sensor, at least one light emitting diode, a first molding compound and at least one second molding compound is provided. The image sensor is disposed on the carrier and being electrically connected thereto. The at least one light emitting diode is peripherally surrounding the image sensor for providing at least one light source. The first molding compound made of infrared material is configured to be adjacent to the image sensor to hinder ambient lights from interfering with the image sensor. The second molding compound made of colored silicone is disposed over the light emitting diode to provide lighting path for the light source. By employing the proposed present invention, interferences from the ambient lights with the image sensor can be effectively avoided, thus increasing the accuracy and precision of the sensing results.

Abstract: An optical fingerprint sensor package includes a carrier, an image sensor, at least one LED (light emitting diode), and a molding compound. The carrier is penetrated with a first cavity. The carrier has a peripheral region surrounding the first cavity. The peripheral region is provided with first conductive pads thereon. The image sensor is mounted in the first cavity and electrically connected to the first conductive pads by conductive wire bonding. The LED is mounted to correspond to the peripheral region of the carrier. The molding compound covers the peripheral region of the carrier, the image sensor, and the at least one LED, and fills the first cavity to fix the image sensor in the first cavity and expose the bottom of the image sensor to an external space.