Patents by Inventor Da-Cyuan Yu

Da-Cyuan Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal interface material having different thicknesses in packages
    Patent number: 11916023
    Abstract: A package includes a package component, a device die over and bonded to the package component, a metal cap having a top portion over the device die, and a thermal interface material between and contacting the device die and the metal cap. The thermal interface material includes a first portion directly over an inner portion of the device die, and a second portion extending directly over a corner region of the device die. The first portion has a first thickness. The second portion has a second thickness greater than the first thickness.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sung-Hui Huang, Da-Cyuan Yu, Kuan-Yu Huang, Pai Yuan Li, Hsiang-Fan Lee
  • Thermal Interface Material Having Different Thicknesses in Packages
    Publication number: 20200402926
    Abstract: A package includes a package component, a device die over and bonded to the package component, a metal cap having a top portion over the device die, and a thermal interface material between and contacting the device die and the metal cap. The thermal interface material includes a first portion directly over an inner portion of the device die, and a second portion extending directly over a corner region of the device die. The first portion has a first thickness. The second portion has a second thickness greater than the first thickness.
    Type: Application
    Filed: September 4, 2020
    Publication date: December 24, 2020
    Inventors: Sung-Hui Huang, Da-Cyuan Yu, Kuan-Yu Huang, Pai Yuan Li, Hsiang-Fan Lee
  • Thermal interface material having different thicknesses in packages
    Patent number: 10770405
    Abstract: A package includes a package component, a device die over and bonded to the package component, a metal cap having a top portion over the device die, and a thermal interface material between and contacting the device die and the metal cap. The thermal interface material includes a first portion directly over an inner portion of the device die, and a second portion extending directly over a corner region of the device die. The first portion has a first thickness. The second portion has a second thickness greater than the first thickness.
    Type: Grant
    Filed: May 31, 2017
    Date of Patent: September 8, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sung-Hui Huang, Da-Cyuan Yu, Kuan-Yu Huang, Pai Yuan Li, Hsiang-Fan Lee
  • Thermal interface material having different thicknesses in packages
    Patent number: 10707177
    Abstract: A package includes a package component, a device die over and bonded to the package component, a metal cap having a top portion over the device die, and a thermal interface material between and contacting the device die and the metal cap. The thermal interface material includes a first portion directly over an inner portion of the device die, and a second portion extending directly over a corner region of the device die. The first portion has a first thickness. The second portion has a second thickness greater than the first thickness.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: July 7, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sung-Hui Huang, Da-Cyuan Yu, Kuan-Yu Huang, Pai Yuan Li, Hsiang-Fan Lee
  • Thermal Interface Material Having Different Thicknesses In Packages
    Publication number: 20180350754
    Abstract: A package includes a package component, a device die over and bonded to the package component, a metal cap having a top portion over the device die, and a thermal interface material between and contacting the device die and the metal cap. The thermal interface material includes a first portion directly over an inner portion of the device die, and a second portion extending directly over a corner region of the device die. The first portion has a first thickness. The second portion has a second thickness greater than the first thickness.
    Type: Application
    Filed: May 31, 2017
    Publication date: December 6, 2018
    Inventors: Sung-Hui Huang, Da-Cyuan Yu, Kuan-Yu Huang, Pai Yuan Li, Hsiang-Fan Lee
  • Thermal Interface Material Having Different Thicknesses in Packages
    Publication number: 20180350755
    Abstract: A package includes a package component, a device die over and bonded to the package component, a metal cap having a top portion over the device die, and a thermal interface material between and contacting the device die and the metal cap. The thermal interface material includes a first portion directly over an inner portion of the device die, and a second portion extending directly over a corner region of the device die. The first portion has a first thickness. The second portion has a second thickness greater than the first thickness.
    Type: Application
    Filed: July 30, 2018
    Publication date: December 6, 2018
    Inventors: Sung-Hui Huang, Da-Cyuan Yu, Kuan-Yu Huang, Pai Yuan Li, Hsiang-Fan Lee