Patents by Inventor Da-Hsiang Chen

Da-Hsiang Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System for cleaning a wafer
    Patent number: 7823241
    Abstract: A system for cleaning a wafer. At least one first chuck roller is connected to a first roller base and includes a first annular groove. A second roller base opposes the first roller base. At least one second chuck roller is connected to the second roller base and includes a second annular groove. A sensing chuck roller is connected to the second roller base and includes a third annular groove corresponding to the first and second annular grooves. A cleaning member covers the third annular groove. A circumferential edge of the wafer is positioned in the first and second annular grooves and abuts the cleaning member. The first and second chuck rollers rotate the wafer, enabling the circumferential edge thereof to rub against the cleaning member.
    Type: Grant
    Filed: March 22, 2007
    Date of Patent: November 2, 2010
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tien-Chen Hu, Chih-Ming Hsieh, Chien-Chang Lai, Wen-Jin Lee, Da-Hsiang Chen
  • System for cleaning a wafer
    Publication number: 20080229526
    Abstract: A system for cleaning a wafer. At least one first chuck roller is connected to a first roller base and includes a first annular groove. A second roller base opposes the first roller base. At least one second chuck roller is connected to the second roller base and includes a second annular groove. A sensing chuck roller is connected to the second roller base and includes a third annular groove corresponding to the first and second annular grooves. A cleaning member covers the third annular groove. A circumferential edge of the wafer is positioned in the first and second annular grooves and abuts the cleaning member. The first and second chuck rollers rotate the wafer, enabling the circumferential edge thereof to rub against the cleaning member.
    Type: Application
    Filed: March 22, 2007
    Publication date: September 25, 2008
    Inventors: Tien-Chen Hu, Chih-Ming Hsieh, Chien-Chang Lai, Wen-Jin Lee, Da-Hsiang Chen