Patents by Inventor Da-hye CHOE

Da-hye CHOE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Array printed circuit board, method of replacing defective single printed circuit board of the same, and method of manufacturing electronic apparatus using the same
    Patent number: 9451691
    Abstract: An array printed circuit board (PCB) is provided in which a defective single PCB may be easily replaced. A method of replacing a defective single PCB and a method of manufacturing an electronic apparatus are also provided. The array PCB may include a plurality of single PCBs. A rail portion may surround the single PCBs. A plurality of tab route portions connect the single PCBs to the rail portion, each of the tab route portions including at least one pair of via electrodes. A test terminal portion may be formed at one side of the rail portion and may include a plurality of test terminals. The at least one pair of via electrodes may include a first via electrode, arranged adjacent to the rail portion and electrically connected to a corresponding test terminal, and a second via electrode arranged adjacent to and electrically connected to a corresponding single PCB.
    Type: Grant
    Filed: August 12, 2014
    Date of Patent: September 20, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young-hoon Kim, Hyun-seok Choi, Joo-han Lee, Da-hye Choe
  • ARRAY PRINTED CIRCUIT BOARD, METHOD OF REPLACING DEFECTIVE SINGLE PRINTED CIRCUIT BOARD OF THE SAME, AND METHOD OF MANUFACTURING ELECTRONIC APPARATUS USING THE SAME
    Publication number: 20150075844
    Abstract: An array printed circuit board (PCB) is provided in which a defective single PCB may be easily replaced. A method of replacing a defective single PCB and a method of manufacturing an electronic apparatus are also provided. The array PCB may include a plurality of single PCBs. A rail portion may surround the single PCBs. A plurality of tab route portions connect the single PCBs to the rail portion, each of the tab route portions including at least one pair of via electrodes. A test terminal portion may be formed at one side of the rail portion and may include a plurality of test terminals. The at least one pair of via electrodes may include a first via electrode, arranged adjacent to the rail portion and electrically connected to a corresponding test terminal, and a second via electrode arranged adjacent to and electrically connected to a corresponding single PCB.
    Type: Application
    Filed: August 12, 2014
    Publication date: March 19, 2015
    Inventors: Young-hoon KIM, Hyun-seok CHOI, Joo-han LEE, Da-hye CHOE