Patents by Inventor Da-Hye MIN

Da-Hye MIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package substrate and semiconductor package including the same
    Patent number: 10347576
    Abstract: A semiconductor package includes a package substrate, the package substrate including a conductive plate, an insulating plate on the conductive plate, the insulating plate including a mounting region and a peripheral region surrounding the mounting region, and at least one capillary channel in the peripheral region, a semiconductor chip on the mounting region of the insulating plate, and a molding member on the insulating plate to cover the semiconductor chip, a portion of the molding member being in the at least one capillary channel.
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: July 9, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kwang-Won Choi, Sang-Woo Pae, Seong-Won Jeong, Min-Jae Kwon, Da-Hye Min, Jin-Chul Park, Jae-Won Chang
  • PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
    Publication number: 20180090430
    Abstract: A semiconductor package includes a package substrate, the package substrate including a conductive plate, an insulating plate on the conductive plate, the insulating plate including a mounting region and a peripheral region surrounding the mounting region, and at least one capillary channel in the peripheral region, a semiconductor chip on the mounting region of the insulating plate, and a molding member on the insulating plate to cover the semiconductor chip, a portion of the molding member being in the at least one capillary channel.
    Type: Application
    Filed: September 20, 2017
    Publication date: March 29, 2018
    Inventors: Kwang-Won CHOI, Sang-Woo PAE, Seong-Won JEONG, Min-Jae KWON, Da-Hye MIN, Jin-Chul PARK, Jae-Won CHANG