Abstract: Disclosed are novel compounds of Chemical Formula 1, optical isomers of the compounds, and pharmaceutically acceptable salts of the compounds or the optical isomers. The compounds, isomers, and salts exhibit excellent activity as GLP-1 receptor agonists. In particular, they, as GLP-1 receptor agonists, exhibit excellent glucose tolerance, thus having a great potential to be used as therapeutic agents for metabolic diseases. Moreover, they exhibit excellent pharmacological safety for cardiovascular systems.

Abstract: The present invention relates to an apparatus for detecting a skew of banknotes in an automated teller machine (ATM), and particularly, to an apparatus for detecting a skew of banknotes in an ATM capable of more effectively and accurately detecting a defective conveying state of the banknotes passing through a conveying route by including sensors on the conveying route, where the banknotes put into the ATM are conveyed, at regular intervals from each other along a direction crossing the conveying route and detect tips of the banknotes passing through the conveying route to separately detect skew angles for each sector of the banknotes passing through the conveying route based on banknote tip detection signals detected from each detection sensor and support detection of various types of skews of the banknotes, including one-way skew of the banknotes and V-shaped skew at both ends inclined in different directions.

Abstract: The present disclosure relates to a method of operating a bill transport path switching device in an automated teller machine (ATM), which increases the transfer speed of bills by narrowing a transfer interval between the bills and improves efficiency of a bill deposit and counting process, in a way to accurately calculate timing at which each bill enters the bill transport path switching device so that the bills are transferred without an error regardless of whether a transparent part is included in the bill even in a situation in which paper bills and polymer bills are transferred together, by controlling switching timing of the bill transport path switching device that is provided in the transport path of bills within an ATM for handling polymer bills based on a sensor signal of a bill detection sensor that is provided in a discrimination part of the ATM.

Abstract: A semiconductor device includes a conductive structure on a substrate, an etch stop layer on the conductive structure, an insulation layer on the etch stop layer, and a contact plug extending through the etch stop layer and the insulation layer and contacting the conductive structure. The contact plug may include first and second conductive pattern structures sequentially stacked and contacting with each other. A width of an upper surface of the first conductive pattern structure may be greater than that of a lower surface of the second conductive pattern structure. At least an upper portion of the first conductive pattern structure may have a sidewall not perpendicular but inclined to an upper surface of the substrate.

Abstract: A semiconductor device includes a lower insulating layer on a substrate, a lower wiring layer extending on the lower insulating layer, a lower surface of at least a part of the lower wiring layer being covered by the lower insulating layer, a plurality of via plugs extending in a first direction on the lower wiring layer, the plurality of via plugs including a real via plug and a first dummy via plug connected to the part of the lower wiring layer covered by the lower insulating layer, and an upper wiring layer overlapping the lower wiring layer and extending in a second direction different from the first direction on the real via plug, the upper wiring layer not overlapping the dummy via plug.

Abstract: A semiconductor device includes a lower insulating layer on a substrate, a lower wiring layer extending on the lower insulating layer, a lower surface of at least a part of the lower wiring layer being covered by the lower insulating layer, a plurality of via plugs extending in a first direction on the lower wiring layer, the plurality of via plugs including a real via plug and a first dummy via plug connected to the part of the lower wiring layer covered by the lower insulating layer, and an upper wiring layer overlapping the lower wiring layer and extending in a second direction different from the first direction on the real via plug, the upper wiring layer not overlapping the dummy via plug.