Patents by Inventor Da-Hyeon Lee

Da-Hyeon Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11984264
    Abstract: A multilayer electronic component includes: a body including a capacitance forming portion in which dielectric layers and internal electrodes are alternately disposed in a first direction, and cover portions disposed on an upper surface and a lower surface of the capacitance forming portion, respectively, in the first direction; and external electrodes disposed on the body, wherein the cover portion includes a plurality of dielectric grains and a plurality of pores, and Gn/Pn is more than 10 and less than 30, in which Gn is the number of dielectric grains included in the cover portion and Pn is the number of pores included in the cover portion.
    Type: Grant
    Filed: October 27, 2021
    Date of Patent: May 14, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Bok Shin, Yu Ra Shin, Seung Yong Lee, Jung Hyun An, Yong Hwa Lee, Da Hyeon Go, Choong Seop Jeon, Min Soo Kim
  • Patent number: D767628
    Type: Grant
    Filed: June 8, 2015
    Date of Patent: September 27, 2016
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Gyu-Chual Kim, Da-Hyeon Lee