Abstract: A test method and system of testing a semiconductor device is provided. The method includes placing a packaged semiconductor device on a tester and engaging a thermal management component with an upper surface of the packaged semiconductor device. The packaged semiconductor device is tested using the tester, and during the testing a first thermal condition is delivered to a first region of the thermal management component while delivering a second thermal condition is delivered to a second region of the thermal management component. The first thermal condition is different than the second thermal condition.

Abstract: A dual lens inspection device, having a low power lens group satisfies the condition value of 3.0?magnification?1.0; a high power lens group, satisfies the condition value of 25.0?magnification?15.0; a light source module projecting an illumination light source to the low power lens group and the high power lens group; a beam splitter arranged on the optical path of the illumination light source, so as to generate a first optical path passing through the low power lens group and a second optical path passing through the high power lens group, and projected on an object located on the same plane; a first luminous flux module and a second luminous flux module control the luminous flux of the first and second optical path, and then achieve the effect of dark field illumination; a camera using the beam splitter to achieve a beam steering effect, and then captures the image of the object.

Abstract: A method of manufacturing a device includes bonding a first die and a second die to a first side of a substrate, forming a stress buffer structure over the first die and the second die, where the stress buffer structure includes a first portion of a first via extending through a first insulating layer, a second portion of the first via extending through a second insulating layer, and a third portion of the first via extending through a third insulating layer, where the second portion of the first via is disposed between the first portion of the first via and the third portion of the first via, and where a diameter of the second portion of the first via is smaller than diameters of the first portion of the first via and the third portion of the first via, and depositing a metal layer over the stress buffer structure.

Abstract: Provided are integrated circuit systems and methods for fabricating semiconductor packages. An integrated circuit system includes a circuit board having a top side and a bottom side and defining an opening from the top side to the bottom side; a bottom boiling plate having a recessed portion and having a projection with a terminal surface, wherein the recessed portion is located below the bottom side of the circuit board, wherein the projection extends through the opening, and wherein the terminal surface is located above the top side of the circuit board; a semiconductor substrate located over the top side of the circuit board and including semiconductor devices; and a top boiling plate located over the semiconductor substrate, wherein the bottom boiling plate and the top boiling plate are configured to dissipate heat away from the integrated circuit system.

Abstract: A dual lens inspection device, having a low power lens group satisfies the condition value of 3.0?magnification?1.0; a high power lens group, satisfies the condition value of 25.0?magnification?15.0; a light source module projecting an illumination light source to the low power lens group and the high power lens group; a beam splitter arranged on the optical path of the illumination light source, so as to generate a first optical path passing through the low power lens group and a second optical path passing through the high power lens group, and projected on an object located on the same plane; a first luminous flux module and a second luminous flux module control the luminous flux of the first and second optical path, and then achieve the effect of dark field illumination; a camera using the beam splitter to achieve a beam steering effect, and then captures the image of the object.

Abstract: A method for searching a path by using a 3D reconstructed map includes: receiving 3D point-cloud map information and 3D material map information; clustering the 3D point-cloud map information with a clustering algorithm to obtain clustering information, and identifying material attributes of objects in the 3D point-cloud map information with a material neural network model to obtain material attribute information; fusing the those map information based on their coordinate information, thereby outputting fused map information; identifying obstacle areas and non-obstacle areas in the fused map information based on an obstacle neural network model, the clustering information, and the material attribute information; and generating 3D path information according to the non-obstacle areas. Since the 3D path information is generated based on those map information, the obstacle areas and flight spaces are effectively determined to generate an accurate flight path.

Abstract: A semiconductor device package provides for thermal considerations of a semiconductor die(s) through providing a thermal module. A substrate including an IC die disposed on the substrate is positioned between an upper plate and a lower plate of the thermal module. Heat pipes connect the upper plate and the lower plate. The thermal module allows for heat dissipation paths from the lower as well as upper plate. In some implementations, a liquid cooling plate is positioned between the substrate and the upper pate of the thermal module.

Abstract: An Integrated Circuit (IC) structure includes a bottom level IC die and one or more top level IC dies. A first side of the one or more top level IC dies is bonded to the bottom IC die. A supporting substrate is coupled to a second side of the one or more top level IC dies. A plurality of conductive through-substrate vias (TSVs) each extend vertically through the supporting substrate. A metallic lid structure is disposed over the supporting substrate. The metallic lid structure is thermally coupled to the conductive TSVs.

Abstract: This application provide a synthetic audio output method and apparatus, a storage medium, and an electronic device. The method includes: inputting input text and a specified target identity identifier into an audio output model; extracting an identity feature sequence of a target identity by an identity recognition model; extracting a phoneme feature sequence corresponding to the input text by an encoding layer of a speech synthesis model; superimposing and inputting the identity feature sequence of the target identity and the phoneme feature sequence into a variable adapter of the speech synthesis model; and after duration prediction and alignment, energy prediction, and pitch prediction are performed on the phoneme feature sequence by the variable adapter, outputting a target Mel-frequency spectrum feature corresponding to the input text through a decoding layer of the speech synthesis model; and inputting the target Mel-frequency spectrum feature into a vocoder to output synthetic audio.

Abstract: A method for searching a path by using a 3D reconstructed map includes: receiving 3D point-cloud map information and 3D material map information; clustering the 3D point-cloud map information with a clustering algorithm to obtain clustering information, and identifying material attributes of objects in the 3D point-cloud map information with a material neural network model to obtain material attribute information; fusing the those map information based on their coordinate information, thereby outputting fused map information; identifying obstacle areas and non-obstacle areas in the fused map information based on an obstacle neural network model, the clustering information, and the material attribute information; and generating 3D path information according to the non-obstacle areas. Since the 3D path information is generated based on those map information, the obstacle areas and flight spaces are effectively determined to generate an accurate flight path.

Abstract: An optical lens, comprising: an enlarging side and a shrinking side, between the enlarging side and the shrinking side sequentially having a first group lens, a light diaphragm, and a second group lens, wherein the light diaphragm is for separating the first group lens and the second group lens; the first group lens having multiple lenses, and the second lens is an aspheric lens; the second group lens having at least four lenses, wherein at least one lens is an aspheric lens and a positive diopter lens is an aspheric lens; the first group lens and the second group lens having two set of doublet lens.

Abstract: A swing/rotating gas metal arc welding torch, include a hollow shaft motor and a feeder panel. An upper extending shaft of the feeder panel penetrates through a brush mechanism, and is fixedly connected to a lower extension shaft of the hollow shaft by means of a coupling, and a lower extending shaft of the feeder panel penetrates through a support bearing mounted in a brush base and is then connected to an eccentric or bent conductive rod mechanism; the motor base is fixedly connected to the brush base by means of connecting screws, and a welding shielding gas is provided and welding torch cooling is achieved by means of inner holes of the connecting screws as well as a built-in gas passage and a cooling water passage of the brush base; the length of the conductive rod mechanism is adjusted by means of modulation or extension and retraction.

Abstract: A swing/rotating gas metal arc welding torch, include a hollow shaft motor and a feeder panel. An upper extending shaft of the feeder panel penetrates through a brush mechanism, and is fixedly connected to a lower extension shaft of the hollow shaft by means of a coupling, and a lower extending shaft of the feeder panel penetrates through a support bearing mounted in a brush base and is then connected to an eccentric or bent conductive rod mechanism; the motor base is fixedly connected to the brush base by means of connecting screws, and a welding shielding gas is provided and welding torch cooling is achieved by means of inner holes of the connecting screws as well as a built-in gas passage and a cooling water passage of the brush base; the length of the conductive rod mechanism is adjusted by means of modulation or extension and retraction.

Abstract: An optical lens includes a first lens group and a second lens group. The first lens group is disposed between a magnified side and a minified side and has a negative refractive power. The second lens group is disposed between the first lens group and the minified side and has a positive refractive power. The optical lens is capable of forming an image at the magnified side. 0.52>F/H>0.46, where F is an effective focal length, and H is an image height.

Abstract: A lens including a first lens group and a second lens group is provided. The first lens group is disposed between a magnified side and a minified side. The second lens group is disposed between the first lens group and the minified side. The lens includes six or less lens elements, and at least four of the six or less lens elements are aspheric lenses. A field of view of the lens is in a range between 100 degrees and 165 degrees, and the second lens group has at least one spherical lens.

Abstract: An optical lens includes a first lens group with a negative refractive power, a second lens group with a positive refractive power, and an aperture stop disposed between the first lens group and the second lens group. The second lens group is disposed between the first lens group and the second side. The optical lens satisfies the conditions: 2.1<D1/D3<3.0 and 1.9<D1/DL<3.2, where D1 is a diameter of a surface of the first lens facing the first side, D3 is a diameter of a surface of the third lens facing the first side, DL is a diameter of a surface of a last lens facing the second side, and the last lens is nearest the second side as compared with any other lens of the optical lens.

Abstract: An optical lens includes a first lens group with a negative refractive power, an aperture stop, and a second lens group with a positive refractive power. The first lens group includes a first aspheric lens and a second aspheric lens. The optical lens satisfies the conditions: 3.5>RT1>2.5 and 3.5>RT2>2.6, where RT1 is a ratio of a maximum axial thickness to a minimum axial thickness within a clear aperture of the first aspheric lens, and RT2 is a ratio of a maximum axial thickness to a minimum axial thickness within a clear aperture of the second aspheric lens.

Abstract: An optical lens includes a first lens group with a negative refractive power, a second lens group with a positive refractive power, and an aperture stop disposed between the first lens group and the second lens group. The second lens group is disposed between the first lens group and the second side. The optical lens satisfies the conditions: 2.1<D1/D3<3.0 and 1.9<D1/DL<3.2, where D1 is a diameter of a surface of the first lens facing the first side, D3 is a diameter of a surface of the third lens facing the first side, DL is a diameter of a surface of a last lens facing the second side, and the last lens is nearest the second side as compared with any other lens of the optical lens.

Abstract: A method of generating a key for D2D communication between a first user equipment and a second user equipment in a first radio access node is disclosed.

Abstract: A lens including a first lens group and a second lens group is provided. The first lens group is disposed between a magnified side and a minified side. The second lens group is disposed between the first lens group and the minified side. The lens includes six or less lens elements, and at least four of the six or less lens elements are aspheric lenses. A field of view of the lens is in a range between 100 degrees and 165 degrees, and the second lens group has at least one spherical lens.