Abstract: A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes a semiconductor substrate, active devices and transparent conductive patterns. The active devices are formed on the semiconductor substrate. The transparent conductive patterns are formed over the active devices and electrically connected to the active devices. The transparent conductive patterns are made of a metal oxide material. The metal oxide material has a first crystalline phase with a prefer growth plane rich in oxygen vacancy, and has a second crystalline phase with a prefer growth plane poor in oxygen vacancy.

Abstract: Provided is an antibacterial composition comprising at least one compound including a quaternary ammonium structure having an acrylate group or a methacrylate group, and having an antibacterial strength A of 90% or more against at least one strain selected from Gram-positive bacteria and Gram-negative bacteria, and an acute oral toxicity dose LD50 of 300 mg/Kg or more, where the antibacterial strength A equals (1?Asample/AReference)×100, where Asample equals an absorbance of an inoculated medium solution incubated with the antibacterial composition, and AReference equals an absorbance of an inoculated medium solution incubated without addition of the antibacterial composition.

Abstract: A semiconductor device is provided. The semiconductor device includes a substrate having a surface. The semiconductor device includes a conductive pad over a portion of the surface. The conductive pad has a curved top surface, and a width of the conductive pad increases toward the substrate. The semiconductor device includes a device over the conductive pad. The semiconductor device includes a solder layer between the device and the conductive pad. The solder layer covers the curved top surface of the conductive pad, and the conductive pad extends into the solder layer.

Abstract: A micro electro mechanical system (MEMS) includes a circuit substrate comprising electronic circuitry, a support substrate having a recess, a bonding layer disposed between the circuit substrate and the support substrate, through holes passing through the circuit substrate to the recess, a first conductive layer disposed on a front side of the circuit substrate, and a second conductive layer disposed on an inner wall of the recess. The first conductive layer extends into the through holes and the second conductive layer extends into the through holes and coupled to the first conductive layer.

Abstract: An apparatus for detecting a processing tool defect is provided. The apparatus includes a processing tool having a processing chamber configured to process a semiconductor wafer. The processing chamber includes a gas inlet and a gas outlet. An exhaust pipe is connected to the gas outlet of the processing chamber. A particle counter is configured to real-time measure a parameter of particles in the exhaust pipe. A method for detecting a processing tool defect is also provided in the present disclosure.

Abstract: Apparatus and methods for determining wafer characters are disclosed. In one example, an apparatus is disclosed. The apparatus includes: a processing tool configured to process a semiconductor wafer; a device configured to read an optical character disposed on the semiconductor wafer while the semiconductor wafer is located at the apparatus for wafer fabrication; and a controller configured to determine whether the optical character matches a predetermined character corresponding to the semiconductor wafer based on the optical character read in real-time at the apparatus.

Abstract: Various embodiments of the present invention relate to a method and a device for controlling the operation of an external device on the basis of various states of an electronic device when the external device having a cooling function is connected in the electronic device. The electronic device according to various embodiments of the present invention comprises: an interface for connection with the external device; and a processer electrically connected to the interface. The processor can detect connection of the external device by means of the interface, determine the state of the electronic device on the basis of at least the detection of the connection with the external device, and transmit a control signal relating to fan operation control of the external device to the external device by means of the interface on the basis of at least the state of the electronic device. Various embodiments are possible.

Abstract: Apparatus and methods for determining wafer characters are disclosed. In one example, an apparatus is disclosed. The apparatus includes: a processing tool configured to process a semiconductor wafer; a device configured to read an optical character disposed on the semiconductor wafer while the semiconductor wafer is located at the apparatus for wafer fabrication; and a controller configured to determine whether the optical character matches a predetermined character corresponding to the semiconductor wafer based on the optical character read in real-time at the apparatus.

Abstract: Apparatus and methods for determining wafer characters are disclosed. In one example, an apparatus is disclosed. The apparatus includes: a processing tool configured to process a semiconductor wafer; a device configured to read an optical character disposed on the semiconductor wafer while the semiconductor wafer is located at the apparatus for wafer fabrication; and a controller configured to determine whether the optical character matches a predetermined character corresponding to the semiconductor wafer based on the optical character read in real-time at the apparatus.

Abstract: Apparatus and methods for determining wafer characters are disclosed. In one example, an apparatus is disclosed. The apparatus includes: a processing tool configured to process a semiconductor wafer; a device configured to read an optical character disposed on the semiconductor wafer while the semiconductor wafer is located at the apparatus for wafer fabrication; and a controller configured to determine whether the optical character matches a predetermined character corresponding to the semiconductor wafer based on the optical character read in real-time at the apparatus.

Abstract: Various embodiments of the present invention relate to a method and a device for controlling the operation of an external device on the basis of various states of an electronic device when the external device having a cooling function is connected in the electronic device. The electronic device according to various embodiments of the present invention comprises: an interface for connection with the external device; and a processer electrically connected to the interface. The processor can detect connection of the external device by means of the interface, determine the state of the electronic device on the basis of at least the detection of the connection with the external device, and transmit a control signal relating to fan operation control of the external device to the external device by means of the interface on the basis of at least the state of the electronic device. Various embodiments are possible.

Abstract: An electronic device and method are provided. The electronic device includes a first connector including first conductive pins arranged according to a first protocol, a second connector including second conductive pins arranged according to a second protocol and different in number, and a control circuit operatively coupled to the first and second connector. The control circuit detects coupling to an external device through the first connector by at least one of the first conductive pins, receives profile information including at least one of: a power supply device operatively coupled to the second connector and identification information for an external device, and sets a charging path within the electronic device between the first connector and the second connector using at least one of the first conductive pins and the at least one of the second conductive pins coupled to the power supply device.

Abstract: Apparatus and methods for determining wafer characters are disclosed. In one example, an apparatus is disclosed. The apparatus includes: a processing tool configured to process a semiconductor wafer; a device configured to read an optical character disposed on the semiconductor wafer while the semiconductor wafer is located at the apparatus for wafer fabrication; and a controller configured to determine whether the optical character matches a predetermined character corresponding to the semiconductor wafer based on the optical character read in real-time at the apparatus.

Abstract: An electronic device and method are provided. The electronic device includes a first connector including first conductive pins arranged according to a first protocol, a second connector including second conductive pins arranged according to a second protocol and different in number, and a control circuit operatively coupled to the first and second connector. The control circuit detects coupling to an external device through the first connector by at least one of the first conductive pins, receives profile information including at least one of: a power supply device operatively coupled to the second connector and identification information for an external device, and sets a charging path within the electronic device between the first connector and the second connector using at least one of the first conductive pins and the at least one of the second conductive pins coupled to the power supply device.

Abstract: An electronic device comprising: a first interface configured to connect to an external power supply device; a second interface configured to connect to a first external electronic device; and a control circuit operatively coupled to the first interface and the second interface, configured to: establish a first electrical path between the first interface and the second interface, when the first interface is connected to the external power supply device and the second interface is connected to the first external electronic device; disconnect the first electrical path; and provide a data signal to the first external electronic device while the first external device with power that is supplied by the external power supply device, wherein the data signal and the power are provided to the first external electronic device via the second interface.

Abstract: A cab of a passenger boarding bridge comprises: an active floor body having a back end connected to the front end of a cabin and a front end provided with a notch that accommodates a downwards or upwards opened door of an aircraft; a flap disposed corresponding to the notch and movably connected to the active floor body, the flap being turnable relative to the active floor body between a first position in which the flap closes the notch and a second position in which the flap exposes the notch; and an actuating device for driving the flap to turn. The cab is mounted to a front end of a cabin such that it serves not only aircraft having doors to be opened leftwards or rightwards but also those having doors to be opened downwards. Also disclosed are a passenger boarding bridge having the cab and a docking method thereof.

Abstract: A cab of a passenger boarding bridge comprises: an active floor body having a back end connected to the front end of a cabin and a front end provided with a notch that accommodates a downwards or upwards opened door of an aircraft; a flap disposed corresponding to the notch and movably connected to the active floor body, the flap being turnable relative to the active floor body between a first position in which the flap closes the notch and a second position in which the flap exposes the notch; and an actuating device for driving the flap to turn. The cab is mounted to a front end of a cabin such that it serves not only aircraft having doors to be opened leftwards or rightwards but also those having doors to be opened downwards. Also disclosed are a passenger boarding bridge having the cab and a docking method thereof.

Abstract: The present disclosure is directed to methods of non-invasively imaging cell nuclei. More particularly, the present disclosure is directed to methods of imaging cell nuclei in vivo using ultraviolet photoacoustic microscopy (UV-PAM), in which ultraviolet light is used to excite unlabeled DNA and RNA in cell nuclei to produce photoacoustic waves.

Abstract: An electronic device including a housing, a main circuit substrate disposed in one side of the housing; a connector unit which is disposed in an other side of the housing and is electrically connected to the main circuit substrate, and a discharging sheet disposed in the one side of the housing and is conductively connected to the connector unit to discharge static electricity generated in the connector unit is provided.