Patents by Inventor Da-Peng Lyu

Da-Peng Lyu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200355357
    Abstract: A light source package structure is provided. The light source package structure includes a substrate, an upper electrode layer and a lower electrode layer respectively disposed on two sides of the substrate, a light emitting unit mounted on the upper electrode layer, a surrounding wall disposed on the substrate and arranged to surround the light emitting unit, a conductive unit disposed on the surrounding wall and electrically connected to the lower electrode layer, a light permeable element disposed on the surrounding wall, a detection circuit formed on the light permeable element, and at least one conductive adhesive. The conductive adhesive includes a colloid and a plurality of fillers mixed with the colloid. The colloid and the fillers of the conductive adhesive are partially filled within the gap.
    Type: Application
    Filed: May 7, 2020
    Publication date: November 12, 2020
    Inventors: WEN LEE, HSIANG-CHIH HUNG, DA-PENG LYU, SHU-HUA YANG, YU-HUNG SU
  • Patent number: 10816176
    Abstract: A light source package structure is provided. The light source package structure includes a substrate, an upper electrode layer and a lower electrode layer respectively disposed on two sides of the substrate, a light emitting unit mounted on the upper electrode layer, a surrounding wall disposed on the substrate and arranged to surround the light emitting unit, a conductive unit disposed on the surrounding wall and electrically connected to the lower electrode layer, a light permeable element disposed on the surrounding wall, a detection circuit formed on the light permeable element, and at least one conductive adhesive. The conductive adhesive includes a colloid and a plurality of fillers mixed with the colloid. The colloid and the fillers of the conductive adhesive are partially filled within the gap.
    Type: Grant
    Filed: May 7, 2020
    Date of Patent: October 27, 2020
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Wen Lee, Hsiang-Chih Hung, Da-Peng Lyu, Shu-Hua Yang, Yu-Hung Su