Patents by Inventor Da Shih

Da Shih has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for chip cooling using a liquid metal thermal interface
    Publication number: 20060131738
    Abstract: In one embodiment, the present invention is a method and apparatus for chip cooling using a liquid metal thermal interface. One embodiment of an inventive thermal interface for facilitating thermal contact between opposing surfaces of an integrated circuit chip and a heat sink the thermal interface includes a liquid metal layer comprising a thermally conductive liquid metal material. A first barrier layer bonds the liquid metal layer to the surface of the integrated circuit chip, and a second barrier layer bonds the liquid metal layer to the surface of the heat sink.
    Type: Application
    Filed: September 6, 2005
    Publication date: June 22, 2006
    Inventors: Bruce Furman, Jeffrey Gelorme, Nancy LaBianca, Yves Martin, Da Shih, Theodore Van Kessel