Patents by Inventor Da Tian

Da Tian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160303600
    Abstract: The present invention is directed to a dispensing pump for dispensing material from a container comprising a chaplet comprising a rotating ring and a stationary ring, wherein the rotating ring is connected to an actuator and the stationary ring is connected to an actuator assembly; a rotating ring affixed to the actuator wherein the rotating ring comprises a cut-out arc having an angle between about 45 degrees to about 345 degrees, wherein the remaining portion of the rotating ring is an uncut portion; a stationary ring attached to the actuator assembly a key protruding from the stationary ring which fits along the cut-out arc of the rotating ring; wherein the actuator rotates with the rotating ring until the uncut portion of the rotating ring is stopped by the key wherein the actuator starts to unscrew from the rotating ring until the actuator is released.
    Type: Application
    Filed: April 17, 2015
    Publication date: October 20, 2016
    Inventors: Huberto Miel DALISAY, Kenneth Eugene LAMB, Robert Keith MORRISSEY, William Peter WURZELBACHER, Da Tian LIN
  • Patent number: 8536028
    Abstract: The present invention relates to a self alignment and assembly fabrication method for stacking multiple material layers, wherein a variety of homogeneous/heterogeneous materials can be stacked on a substrate by this self alignment and assembly fabrication method, without using any epitaxial buffer layers or gradient buffer layers; Moreover, these stacked materials can be single crystal, polycrystalline or non-crystalline phase materials. So that, by applying this self alignment and assembly fabrication method to fabricate a multi-layer device, not only the material cost can be effectively reduced, but the wafer alignment problem existing in the conventional wafer bonding process can also be solved. In addition, in the present invention, rapid melting growth (RMG) is used for growing the multiple crystallized materials laterally and rapidly from the substrate surface by liquid phase epitaxy, therefore the thermal budget can be largely reduced when fabricating the multi-layer device.
    Type: Grant
    Filed: January 10, 2013
    Date of Patent: September 17, 2013
    Assignee: National Tsing Hua University
    Inventors: Ming-Chang Lee, Chih-Kuo Tseng, Zhong-Da Tian
  • Patent number: 7696927
    Abstract: The present invention seeks to provide an antenna having multiple radiating bands, including a ground plane, a feed plate extending generally parallel to and being spaced from the ground plane by a first distance and having a feed connection extending between the feed plate and the ground plane, at least one radiating element extending generally parallel to and being spaced from the feed plate by a second distance and at least one galvanic connector connecting the at least one radiating element at a first location on the at least one radiating element to the ground plane at a first location on the ground plane, the first location on the ground plane being separated from the feed connection by a third distance, the first, second and third distances being selected to achieve desired impedance matching of the feed plate, and the feed plate feeding the at least one radiating element at a location corresponding to an impedance substantially greater than 50 Ohm at least one band.
    Type: Grant
    Filed: March 12, 2006
    Date of Patent: April 13, 2010
    Assignee: Galtronics Ltd.
    Inventors: Charlie Bae, Haim Yona, Snir Azulay, Stefan Quantz, Xiujuan Xu, Xiao Da Tian
  • Publication number: 20080291111
    Abstract: The present invention seeks to provide an antenna having multiple radiating bands, including a ground plane, a feed plate extending generally parallel to and being spaced from the ground plane by a first distance and having a feed connection extending between the feed plate and the ground plane, at least one radiating element extending generally parallel to and being spaced from the feed plate by a second distance and at least one galvanic connector connecting the at least one radiating element at a first location on the at least one radiating element to the ground plane at a first location on the ground plane, the first location on the ground plane being separated from the feed connection by a third distance, the first, second and third distances being selected to achieve desired impedance matching of the feed plate, and the feed plate feeding the at least one radiating element at a location corresponding to an impedance substantially greater than 50 Ohm at least one band.
    Type: Application
    Filed: March 12, 2006
    Publication date: November 27, 2008
    Applicant: GALTRONICS LTD.
    Inventors: Charlie Bae, Haim Yona, Snir Azulay, Stefan Quantz, Xiujuan Xu, Xiao Da Tian
  • Patent number: D974496
    Type: Grant
    Filed: May 12, 2021
    Date of Patent: January 3, 2023
    Assignees: REALME CHONGQING MOBILE TELECOMMUNICATIONS CORP., LTD., Realme Mobile Telecommunications (Shenzhen) Co., Ltd.
    Inventor: Da Tian