Patents by Inventor Da-Tung Wen

Da-Tung Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for cutting wafer
    Publication number: 20060024922
    Abstract: A method for cutting wafer according to the invention includes a roller disposed below a pressing and grinding mechanism, and separates a piece of wafer into a plurality of small chips or dies by pressing and grinding scribe lines of the wafer, thereby optimizing efficiency of wafer cutting operations.
    Type: Application
    Filed: July 27, 2004
    Publication date: February 2, 2006
    Inventors: Da-Tung Wen, Da-Ming Wen