Abstract: An electronic component module includes: a substrate; an electronic element disposed on a first surface of the substrate; an encapsulant disposed on the first surface of the substrate and configured to seal the electronic element; a first pad disposed on an outermost region of a second surface of the substrate; a second pad disposed inward of the first pad on the second surface of the substrate, and positioned parallel to the first pad; and a shielding layer connected to the first pad, and at least partially surrounding a side surface of the encapsulant and a side surface of the substrate. The first and second pads are electrically connected by a connection pad.

Abstract: An electronic component module includes: a substrate; an electronic element disposed on a first surface of the substrate; an encapsulant disposed on the first surface of the substrate and configured to seal the electronic element; a first pad disposed on an outermost region of a second surface of the substrate; a second pad disposed inward of the first pad on the second surface of the substrate, and positioned parallel to the first pad; and a shielding layer connected to the first pad, and at least partially surrounding a side surface of the encapsulant and a side surface of the substrate. The first and second pads are electrically connected by a connection pad.

Abstract: A communications apparatus includes: a communications IC including a first RF pin, a second RF pin, and a third RF pin; a first front-end module connected between the first RF pin and a first RF terminal to provide a first signal path for wireless Tx and Rx, a second signal path for a first wireless LAN Rx, and a third signal path for a first wireless LAN Tx; a second front-end module connected between the third RF pin and a second RF terminal to provide a fourth signal path for a second wireless LAN Tx and a fifth signal path for a second wireless LAN Rx; and a duplexer configured to provide a first wireless LAN Tx signal to the first front-end module through the second RF pin, and provide a second wireless LAN Tx signal to the second front-end module through the second RF pin.

Abstract: A communications apparatus includes: a communications IC including a first RF pin, a second RF pin, and a third RF pin; a first front-end module connected between the first RF pin and a first RF terminal to provide a first signal path for wireless Tx and Rx, a second signal path for a first wireless LAN Rx, and a third signal path for a first wireless LAN Tx; a second front-end module connected between the third RF pin and a second RF terminal to provide a fourth signal path for a second wireless LAN Tx and a fifth signal path for a second wireless LAN Rx; and a duplexer configured to provide a first wireless LAN Tx signal to the first front-end module through the second RF pin, and provide a second wireless LAN Tx signal to the second front-end module through the second RF pin.