Abstract: In accordance with described techniques for read gate training and tracking, a computing device includes a memory system (e.g., dynamic random access memory (DRAM)) that receives a memory read operation which includes a memory clock that correlates to a physical layer (PHY) clock. The computing device includes a PHY that receives a return data signal from the memory system, where the return data signal includes a returned data strobe that is out-of-phase with respect to the PHY clock. The computing device includes training logic that utilizes edge detection to determine an unknown clocking phase of the returned data strobe with respect to the PHY clock. The computing device also includes tracking logic that utilizes the edge detection to detect a signal drift of the delay signal with respect to the returned data strobe and compensate for the drift.

Abstract: A signal processing circuit includes an analog front-end circuit and a digital delay circuit. The analog circuit receives a clock signal and provides a compensated clock signal. The digital delay circuit is coupled to the analog front-end circuit and provides a compensated sample clock signal in response to delaying the compensated clock signal. The analog circuit measures a variation of a power supply voltage and adjusts a gain through the analog circuit according to a measured variation of the power supply voltage.

Abstract: A semiconductor structure includes a via in contact with a conductive line and extending through a first etch stop layer, a first inter-metal dielectric layer, and a second etch stop layer. The second etch stop layer is disposed over the first inter-metal dielectric layer, and the first inter-metal dielectric layer is disposed over the first etch stop layer. The semiconductor structure also includes a trench in contact with the via and extending through an insulating layer and a second inter-metal dielectric layer. The second inter-metal dielectric layer is disposed over the insulating layer which is disposed over the second etch stop layer.

Abstract: A semiconductor interconnect structure includes a conductive line electrically coupled to an active semiconductor device, a first etch stop layer formed over the conductive line, a first dielectric layer formed over the first etch stop layer, a second etch stop layer formed over the first dielectric layer, a second dielectric layer formed over the second etch stop layer, and an interconnect structure electrically coupled to the via and extending through the first etch stop layer, the first dielectric layer, the second etch stop layer, and the second dielectric layer. The interconnect structure includes a via extending through the first etch stop layer, the second etch stop layer, and the first dielectric layer and a trench extending through the second dielectric layer.

Abstract: A sensing and controlling module of airflow for an active aerosol suction device has a tube, a sensing membrane, a sensing coil, a controlling membrane, a controlling coil, and a magnetic unit. The sensing membrane is mounted in the tube. The controlling membrane is disposed at an air inlet of the tube. The sensing membrane and the controlling membrane are capable of bending deformation. The sensing coil is adhered to and spread on the surface of the sensing membrane, and the controlling coil is adhered to and spread on the surface of the controlling membrane. The magnetic unit is disposed at a spaced interval from the sensing membrane and the controlling membrane. With the sensing membrane and the controlling membrane, the sensing and controlling module is capable of sensing and controlling airflow rate.

Abstract: A semiconductor interconnect structure includes a conductive line electrically coupled to an active semiconductor device, a first etch stop layer formed over the conductive line, a first dielectric layer formed over the first etch stop layer, a second etch stop layer formed over the first dielectric layer, a second dielectric layer formed over the second etch stop layer, and an interconnect structure electrically coupled to the via and extending through the first etch stop layer, the first dielectric layer, the second etch stop layer, and the second dielectric layer. The interconnect structure includes a via extending through the first etch stop layer, the second etch stop layer, and the first dielectric layer and a trench extending through the second dielectric layer.

Abstract: Clock domain phase adjustment techniques and systems for memory operations are described. In one example, a physical memory is communicatively coupled to a physical layer via a first clock domain and a memory controller is communicatively coupled to the physical layer via a second clock domain that is different than the first clock domain. A buffer is implemented in the physical layer. The buffer is configured to set a phase adjustment for a latency setting between the first and second clock domains. The phase adjustment is based on whether a mismatch has occurred in data output by the buffer to the memory controller based on a comparison to the latency setting.

Abstract: A sensing and controlling module of airflow for an active aerosol suction device has a tube, a sensing membrane, a sensing coil, a controlling membrane, a controlling coil, and a magnetic unit. The sensing membrane is mounted in the tube. The controlling membrane is disposed at an air inlet of the tube. The sensing membrane and the controlling membrane are capable of bending deformation. The sensing coil is adhered to and spread on the surface of the sensing membrane, and the controlling coil is adhered to and spread on the surface of the controlling membrane. The magnetic unit is disposed at a spaced interval from the sensing membrane and the controlling membrane. With the sensing membrane and the controlling membrane, the sensing and controlling module is capable of sensing and controlling airflow rate.

Abstract: The invention discloses a method and a device for producing a medicine particle flow, belonging to medical health care instruments. The device is characterized by comprising a water mist production device equipped with an ultrasonic atomization device and a fan, and a first closed channel equipped with a heating device, wherein a water mist guide outlet of the water mist production device is connected with a water mist inlet of the first closed channel. Compared with the prior art, the method and the device of the invention have the advantage that effective components of Chinese herbal medicines without volatility can reach the skin together with steam in the form of fine particles, or even molecules, so as to be conveniently absorbed by the skin.

Abstract: A constant power control device of an active vaporization suction apparatus includes a power unit, a first load matching unit, a matching control unit, a second load matching unit, and a constant current generation unit. To replace a medication box along with a liquefied medication within, a new medication box is mounted on the constant power control device, and the first load matching unit is electrically connected to a load unit of the replaced medication box. The first load matching unit determines a load value of the load unit. The second load matching unit and the constant current generation unit generate a constant current signal according to the load value, and transmit the constant current signal to the load unit, thus allowing the load unit to vaporize the liquefied medication with a constant power. The present invention prevents the constant power from changing due to medication box replacements.

Abstract: The present invention is an active vaporization suction system and a controlling method thereof. The system includes a medication device and an active suction device. The medication device is detachably mounted on the active suction device. When a suction module is suctioned, a flow module outputs a launching signal to a control module. The control module outputs a vaporization current control signal to a power supply module according to the launching signal. The power supply module generates and outputs a Joule vaporization current to a Joule vaporizer of the medication device according to the vaporization current control signal, so that the Joule vaporizer vaporizes a liquefied medication in a vaporization chamber into a vapor medication. In this way, when the user actively sucks the suction module, the user can take the vapor medication for medical treatment, which increases an absorption rate of the vapor medication.

Abstract: A semiconductor interconnect structure includes a conductive line electrically coupled to an active semiconductor device, a first etch stop layer formed over the conductive line, a first dielectric layer formed over the first etch stop layer, a second etch stop layer formed over the first dielectric layer, a second dielectric layer formed over the second etch stop layer, and an interconnect structure electrically coupled to the conductive line and extending through the first etch stop layer, the first dielectric layer, the second etch stop layer, and the second dielectric layer. The interconnect structure includes a via extending through the first etch stop layer, the second etch stop layer, and the first dielectric layer and a trench extending through the second dielectric layer.

Abstract: Duty cycle adjustment circuitry includes a first stage, a second stage, and decoder circuitry. The first stage includes a first strength tuning circuit having first inverter branches, and a first fine tuning circuit having second inverter branches. The first strength tuning circuit and the first fine tuning circuit are coupled in parallel. The second stage includes a second strength tuning circuit having third inverter branches, and a second fine tuning circuit having fourth inverter branches. The second strength tuning circuit and the second fine tuning circuit are coupled in parallel. Further, the second stage is electrically coupled to the first stage. The decoder circuitry is electrically coupled to the first stage and the second stage. The decoder circuitry controls the first strength tuning circuit independently from the first fine tuning circuit to adjust the duty cycle of an input signal received by the duty cycle adjustment circuitry.

Abstract: A method for forming an interconnect structure is described. In some embodiments, the method includes forming a mask structure on a dielectric layer, and the mask structure includes a first layer, a second layer disposed on the first layer, and a third layer disposed on the second layer. The method further includes forming first openings having first dimensions in the first layer and forming a multilayer structure over the first layer. The multilayer structure includes a bottom layer disposed in the first openings and over the first layer, a middle layer disposed on the bottom layer, and a photoresist layer disposed on the middle layer. The method further includes forming second openings having second dimensions in the bottom layer to expose portions of the dielectric layer, and the second dimensions are smaller than the first dimensions. The method further includes extending the second openings into the dielectric layer.

Abstract: Systems and methods of write deskew training for ×4 mode memory control interface configurations. Write leveling logic in the memory controller is adjusted to obtain a write leveling setting for delaying both first and second strobe signals associated with a byte. The adjustment is based on feedback of first set of bits of a byte and irrespective of the feedback of the second set of bits of the byte. The write leveling logic is then anchored at the write leveling setting, and a deskew delay line for the second strobe signal is adjusted to obtain a first deskew setting based on the feedback of the second set of bits. Thus, in write operations, the write leveling setting can be common within the byte even the two strobe signals are transmitted to or received from two different memory storage devices.

Abstract: Duty cycle adjustment circuitry includes a first stage, a second stage, and decoder circuitry. The first stage includes a first strength tuning circuit having first inverter branches, and a first fine tuning circuit having second inverter branches. The first strength tuning circuit and the first fine tuning circuit are coupled in parallel. The second stage includes a second strength tuning circuit having third inverter branches, and a second fine tuning circuit having fourth inverter branches. The second strength tuning circuit and the second fine tuning circuit are coupled in parallel. Further, the second stage is electrically coupled to the first stage. The decoder circuitry is electrically coupled to the first stage and the second stage. The decoder circuitry controls the first strength tuning circuit independently from the first fine tuning circuit to adjust the duty cycle of an input signal received by the duty cycle adjustment circuitry.

Abstract: A semiconductor interconnect structure includes a conductive line electrically coupled to an active semiconductor device, a first etch stop layer formed over the conductive line, a first dielectric layer formed over the first etch stop layer, a second etch stop layer formed over the first dielectric layer, a second dielectric layer formed over the second etch stop layer, and an interconnect structure electrically coupled to the via and extending through the first etch stop layer, the first dielectric layer, the second etch stop layer, and the second dielectric layer. The interconnect structure includes a via extending through the first etch stop layer, the second etch stop layer, and the first dielectric layer and a trench extending through the second dielectric layer.

Abstract: System and method of write deskew training for ×4 mode memory control interface configurations. Write leveling logic in the memory controller is adjusted to obtain a write leveling setting for delaying both first and second strobe signals associated with a byte. The adjustment is based on feedback of first set of bits of a byte and irrespective of the feedback of the second set of bits of the byte. The write leveling logic is then anchored at the write leveling setting, and a deskew delay line for the second strobe signal is adjusted to obtain a first deskew setting based on the feedback of the second set of bits. Thus, in write operations, the write leveling setting can be common within the byte even the two strobe signals are transmitted to or received from two different memory storage devices.

Abstract: A byte lane of an integrated circuit including two data strobe loopback paths that allow external test signals to flow in and out of the integrated circuit through data strobe pins in two opposite directions. The integrated circuit includes a Feed Forward Equalization (FFE) path configured to send FFE signals output from the FFE logic via a transmitter set to a first data strobe interface during a normal operation. In a loopback test mode operation, a test signal can be supplied from a second data strobe interface and output to the first data strobe interface by reusing the FFE path. The second loopback path conversely allows a test signal to be routed from the first data strobe interface to the second.

Abstract: System and method of read deskew training for ×4 mode memory control interface configurations. A read deskew training process includes aligning the two strobe signals serving one byte before deskewing the data bits against their corresponding strobe signals. A deskew setting of a variable delay line associated with the second strobe signal is adjusted to align the second strobe signal with reference to the first strobe signal. By aligning the two strobe signals with respect to each other, the read leveling settings can be common within the byte even the two DQS signals are transmitted to or received from two different memory storage devices.