Abstract: The present invention provides a dehumidification and water collection structure disposed on one side of a temperature control device. The temperature control device is used for converting a temperature to a first temperature. The temperature is greater than the first temperature. The temperature control device includes a temperature conduction device. The temperature conduction device covers one side of the temperature control device. A hydrophilic structure is formed on the surface of the mesh member and used for condensing the vapor in the air. A first side of the mesh member is disposed on the other side of the temperature conduction device. A capillary structure layer is formed between the mesh member and the temperature conduction device. After thermal equilibrium between the air and the mesh member, an air temperature of the air is lowered to a dew temperature and condensing the vapor in the air on the mesh member.

Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.

Abstract: A method of manufacturing a bump structure includes forming a passivation layer over a substrate. A metal pad structure is formed over the substrate, wherein the passivation layer surrounds the metal pad structure. A polyimide layer including a polyimide is formed over the passivation layer and the metal pad structure. A metal bump is formed over the metal pad structure and the polyimide layer. The polyimide is a reaction product of a dianhydride and a diamine, wherein at least one of the dianhydride and the diamine comprises one selected from the group consisting of a cycloalkane, a fused ring, a bicycloalkane, a tricycloalkane, a bicycloalkene, a tricycloalkene, a spiroalkane, and a heterocyclic ring.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: A power adjustment circuit, an adjustable power supply system and an adjustable power supply method are provided. The adjustable power supply system includes a power module, a device power supply, and a control circuit. The device power supply provides a supplied power to a device to be tested according to an operating voltage. The control circuit outputs an adjustment signal to the power module according to a power consumption status of the device to be tested. The power module generates the operating voltage according to the adjustment signal, and allows a first power dissipation generated by the device power supply to be less than a predetermined power.

Abstract: A power adjustment circuit, an adjustable power supply system and an adjustable power supply method are provided. The adjustable power supply system includes a power module, a device power supply, and a control circuit. The device power supply provides a supplied power to a device to be tested according to an operating voltage. The control circuit outputs an adjustment signal to the power module according to a power consumption status of the device to be tested. The power module generates the operating voltage according to the adjustment signal, and allows a first power dissipation generated by the device power supply to be less than a predetermined power.

Abstract: A method of detecting the type of network address translator utilizes the SIP standard structure and protocol between a user agent and a call manager; wherein after receiving a request message sent from the user agent, the call manager uses different step to reply, and then detects the network type of NAT according to the reply message sent by the user agent.

Abstract: A constant-on-time power-supply controller includes an adder and a control circuit. The adder generates a sum of a sense voltage and a regulated output voltage generated by a filter inductor. The sense voltage is generated by a sense circuit that sources a current to the filter inductor while the inductor is uncoupled from an input voltage, and the sense voltage is related to the current. The control circuit couples the filter inductor to the input voltage for a predetermined time in response to the sum having a predetermined relationship to a reference voltage. Such a power-supply controller may yield a relatively tight regulation of the output voltage even with a power supply having with a low-ESR filter capacitor, and may do so with little or no additional compensation circuitry as compared to prior controllers and with no additional pin on the power-supply-controller chip.

Abstract: A switching capacitor network auxiliary voltage source for IC chip solution is provided. The solution can convert the high DC bus voltage into the low DC voltage in low cost and in high efficiency. The auxiliary voltage is independent of the power converter system duty-cycle.

Abstract: A quasi average current mode control scheme is provided. The control scheme allows only detecting one part of the inductor current of the switching converter to control the inductor current and make the average current of the inductor follow the reference current. The control scheme is noise insensitive and makes the whole controlled system cost effective.

Abstract: A method of detecting the type of network address translator utilizes the SIP standard structure and protocol between a user agent and a call manager; wherein after receiving a request message sent from the user agent, the call manager uses different step to reply, and then detects the network type of NAT according to the reply message sent by the user agent.