Abstract: A processing chamber includes a chamber body assembly and a chamber door assembly. The chamber body assembly includes a chamber body. The chamber door assembly includes a spray plate and a chamber door. The spray plate is disposed on the chamber door. When the chamber door assembly is closed, the spray plate covers an end of the chamber body. The chamber body and the spray plate define a processing space. The spray plate is configured to introduce a processing gas into the processing space. A substrate processing method and a processing device are further provided.

Abstract: A carrier boat includes a boat body and a front flow homogenizing plate. The boat body defines a placement chamber with openings at two opposite ends, and the placement chamber is configured to accommodate a plurality of to-be-processed components that are spaced apart. The front flow homogenizing plate is disposed in an opening of an end of the placement chamber of the boat body, so as to fill the opening of the placement chamber of the boat body. The front flow homogenizing plate includes a plurality of first blocking members that are spaced apart, and a first gap between two adjacent first blocking members is communicated with a second gap between two adjacent to-be-processed components. A processing apparatus and a method for controlling pressure drop in the carrier boat are further provided.

Abstract: A loading and unloading system, a carrying boat, and a suction cup assembly are provided. The loading and unloading system includes a carrying boat, a cassette, and a suction cup assembly. The suction cup assembly is configured to transfer wafers between the carrying boat and the cassette. The carrying boat includes multiple stations defined along a first direction. Each station is configured to accommodate M wafers. The cassette is configured to accommodate N wafers. M and N are not equal.

Abstract: The present invention discloses heat and cold sources of a THIC air conditioning system, comprising: a compressor (1), a first condenser (2) and a second condenser (3), which are connected successively; a first expansion valve (4) and a second expansion valve (5) respectively connected to the second condenser (3); a first evaporator (6) and a second evaporator (7) respectively connected to the compressor (1); the first evaporator (6) is connected to the first expansion valve (4) to form a first cycle branch; the second evaporator (7) is connected to the second expansion valve (5) to form a second cycle branch; the first cycle branch and the second cycle branch which are connected in parallel connect the second condenser (3) and the compressor (1). The heat and cold sources of the THIC air conditioning system of the present invention have a relatively high refrigeration efficiency so as to significantly reduce energy consumption and protect atmospheric environment.