Patents by Inventor Da Yeon Lee

Da Yeon Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11261475
    Abstract: A method of assessing neurotoxicity of nanoparticles, includes: preparing a tissue or cell sample of mammal exposed to the nanoparticles; analyzing at least one polyamine metabolite selected from the group consisting of putrescine, N1-acetylspermidine, N8-acetylspermidine, N1-acetylspermine and spermine in the sample; and comparing expression degree of the polyamine metabolite with that of a control.
    Type: Grant
    Filed: May 12, 2017
    Date of Patent: March 1, 2022
    Inventors: Tae Hwan Shin, Geetika Phukan, Man Jeong Paik, Hyeon-Seong Lee, Hyung-Jin Park, Da Yeon Lee, Gwang Lee
  • Publication number: 20210242554
    Abstract: The present invention relates to a transmission line having improved bending durability, which includes a strip structure or a micro-strip structure that is divided into a base part and a bending part that is bent and unfolded based on the base part, wherein the base part and the bending part include a signal line configured to extend in a length direction so as to transmit a high frequency signal, a first dielectric of which an upper surface or a lower surface is provided with the signal line formed thereon, and a second dielectric formed above the first dielectric; and the second dielectric is coupled to the first dielectric in the base part and separated from the first dielectric in the bending part.
    Type: Application
    Filed: July 18, 2019
    Publication date: August 5, 2021
    Inventors: Sang Pil KIM, Byung Hoon JO, Da Yeon LEE, Byung Yeol KIM, Hee seok JUNG
  • Patent number: 10912809
    Abstract: The present invention relates to an enhancer for catechin uptake enhancer in enterocytes, wherein, by mixing a green tea extract containing catechin as an active ingredient, a Dendropanax morbifera extract, and an onion extract at a proper ratio, the stability in the digestive organ can be improved and, eventually, the catechin uptake in enterocytes can be enhanced.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: February 9, 2021
    Assignee: AMOREPACIFIC CORPORATION
    Inventors: Su Kyung Kim, Jin Oh Chung, Wan Gi Kim, Jeong Kee Kim, Song Seok Shin, Soon Mi Shim, Da Yeon Lee, Sang Ryun Yim, Eun Hye Choi
  • Patent number: 10750612
    Abstract: A flexible circuit board having enhanced bending durability and a method for preparing same are provided. The method comprises: forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on a bottom side of the first dielectric body; preparing a second dielectric body; preparing a first bonding sheet and a first protective sheet which is connected to one end of the first bonding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; forming a via hole such that the first ground layer and the second ground layer are conducted; and cutting in a width direction the second dielectric body placed on the first protective sheet.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: August 18, 2020
    Assignee: GIGALANE CO., LTD.
    Inventors: Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Patent number: 10624209
    Abstract: A flexible printed circuit board is introduced. The flexible printed circuit board of the present invention has a first substrate part, comprising a first signal line, and a second substrate part, comprising a second signal line that is parallel to the first signal line, arranged on the same plane while having a shielding part interposed therebetween.
    Type: Grant
    Filed: February 6, 2017
    Date of Patent: April 14, 2020
    Assignee: GIGALANE CO., LTD.
    Inventors: Ik Soo Kim, Byung Yeol Kim, Sang Pil Kim, Byung Hoon Jo, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Patent number: 10561015
    Abstract: A flexible circuit board having enhanced bending durability and a method for preparing same are provided. The method comprises: forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on a bottom side of the first dielectric body; preparing a second dielectric body; preparing a first bonding sheet and a first protective sheet which is connected to one end of the first bonding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; forming a via hole such that the first ground layer and the second ground layer are conducted; and cutting in a width direction the second dielectric body placed on the first protective sheet.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: February 11, 2020
    Assignee: GigaLane Co., Ltd.
    Inventors: Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Publication number: 20200016224
    Abstract: The present invention relates to an enhancer for catechin uptake enhancer in enterocytes, wherein, by mixing a green tea extract containing catechin as an active ingredient, a Dendropanax morbifera extract, and an onion extract at a proper ratio, the stability in the digestive organ can be improved and, eventually, the catechin uptake in enterocytes can be enhanced.
    Type: Application
    Filed: November 21, 2017
    Publication date: January 16, 2020
    Applicant: AMOREPACIFIC CORPORATION
    Inventors: Su Kyung KIM, Jin Oh CHUNG, Wan Gi KIM, Jeong Kee KIM, Song Seok SHIN, Soon Mi SHIM, Da Yeon LEE, Sang Ryun YIM, Eun Hye CHOI
  • Patent number: 10477690
    Abstract: A flexible circuit board is disclosed. The flexible circuit board of the present invention comprises: a substrate part; and a transmission part formed to extend from the substrate part, and having two or more lines, which are aligned in parallel in a thickness direction, for transmitting a high frequency.
    Type: Grant
    Filed: February 8, 2017
    Date of Patent: November 12, 2019
    Assignee: GIGALANE CO., LTD.
    Inventors: Ik Soo Kim, Byung Yeol Kim, Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Patent number: 10448499
    Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; and via holes formed by filling a plurality of holes, which are formed in a vertical direction such that the first ground and the second ground are electrically connected, with conductors, wherein the signal line is laterally bent so as to be spaced apart from positions where the via holes are formed.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: October 15, 2019
    Assignee: GigaLane Co., Ltd.
    Inventors: Sang Pil Kim, Byung Hoon Jo, Da Yeon Lee, Byung Yeol Kim, Hee seok Jung
  • Publication number: 20190239343
    Abstract: A flexible circuit board having enhanced bending durability and a method for preparing same are provided. The method comprises: forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on a bottom side of the first dielectric body; preparing a second dielectric body; preparing a first bonding sheet and a first protective sheet which is connected to one end of the first bonding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; forming a via hole such that the first ground layer and the second ground layer are conducted; and cutting in a width direction the second dielectric body placed on the first protective sheet.
    Type: Application
    Filed: April 5, 2019
    Publication date: August 1, 2019
    Inventors: Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Publication number: 20190239344
    Abstract: A flexible circuit board having enhanced bending durability and a method for preparing same are provided. The method comprises: forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on a bottom side of the first dielectric body; preparing a second dielectric body; preparing a first bonding sheet and a first protective sheet which is connected to one end of the first bonding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; forming a via hole such that the first ground layer and the second ground layer are conducted; and cutting in a width direction the second dielectric body placed on the first protective sheet.
    Type: Application
    Filed: April 5, 2019
    Publication date: August 1, 2019
    Inventors: Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Patent number: 10365687
    Abstract: A laptop computer, according to the present invention, comprises: a main body part comprising a mainboard and a coaxial cable, one end of which is connected to the mainboard; and a display part hinge-coupled with the main body part and comprising a flexible printed circuit board which is installed on the back of the display part and has one end thereof coupled with the other end of the coaxial cable.
    Type: Grant
    Filed: July 5, 2016
    Date of Patent: July 30, 2019
    Assignee: GIGALANE CO., LTD.
    Inventors: Ik Soo Kim, Byung Yeol Kim, Sang Pil Kim, Byung Hoon Jo, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Publication number: 20190230785
    Abstract: In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; and via holes formed by filling a plurality of holes, which are formed in a vertical direction such that the first ground and the second ground are electrically connected, with conductors, wherein the signal line is laterally bent so as to be spaced apart from positions where the via holes are formed.
    Type: Application
    Filed: December 19, 2018
    Publication date: July 25, 2019
    Inventors: Sang Pil Kim, Byung Hoon Jo, Da Yeon Lee, Byung Yeol Kim, Hee seok Jung
  • Patent number: 10362675
    Abstract: Disclosed is a flexible circuit board having a three-layer dielectric body and four-layer ground layer structure. A flexible circuit board having a three-layer dielectric body and four-layer ground layer structure, according to the present invention, comprises: a first dielectric body; a second dielectric body facing the flat surface of the first dielectric body; a third dielectric body facing the bottom side of the first dielectric body; a signal line formed on the flat surface of the first dielectric body; a pair of first ground layers laminated on the flat surface of the first dielectric body and having the signal line therebetween; second ground layers laminated on the bottom side of the first dielectric body so as to correspond to the first ground layers; a third ground layer laminated on the flat surface of the second dielectric body; and a fourth ground layer laminated on the bottom side of the third dielectric body.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: July 23, 2019
    Assignee: GIGALANE CO., LTD.
    Inventors: Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Patent number: 10356895
    Abstract: A flexible circuit board having enhanced bending durability and a method for preparing same are provided. The method comprises: forming a signal line and a first ground layer on a first dielectric body and forming a second ground layer on a bottom side of the first dielectric body; preparing a second dielectric body; preparing a first bonding sheet and a first protective sheet which is connected to one end of the first bonding sheet or of which one or more parts are overlapped on one end of the first bonding sheet; bonding the second dielectric body onto the first dielectric body by means of the first bonding sheet; forming a via hole such that the first ground layer and the second ground layer are conducted; and cutting in a width direction the second dielectric body placed on the first protective sheet.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: July 16, 2019
    Assignee: GIGALANE CO., LTD.
    Inventors: Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Publication number: 20190194715
    Abstract: A method of assessing neurotoxicity of nanoparticles, includes: preparing a tissue or cell sample of mammal exposed to the nanoparticles; analyzing at least one polyamine metabolite selected from the group consisting of putrescine, N1-acetylspermidine, N8-acetylspermidine, N1-acetylspermine and spermine in the sample; and comparing expression degree of the polyamine metabolite with that of a control.
    Type: Application
    Filed: May 12, 2017
    Publication date: June 27, 2019
    Applicant: AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Tae Hwan SHIN, Geetika PHUKAN, Man Jeong PAIK, Hyeon-Seong LEE, Hyung-Jin PARK, Da Yeon LEE, Gwang LEE
  • Patent number: 10299375
    Abstract: The present invention provides a flexible circuit board having enhanced bending durability. The flexible circuit board comprises: a first board part; a second board part which extends from one side of the first board part and is thinner than the first board part so as to be bendable; and a third board part which extends from one side of the second board part and is thinner than the second board part so as to be bendable.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: May 21, 2019
    Assignee: GigaLane Co., Ltd.
    Inventors: Sang Pil Kim, Da Yeon Lee, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Publication number: 20190053379
    Abstract: A flexible circuit board is disclosed. The flexible circuit board of the present invention comprises: a substrate part; and a transmission part formed to extend from the substrate part, and having two or more lines, which are aligned in parallel in a thickness direction, for transmitting a high frequency.
    Type: Application
    Filed: February 8, 2017
    Publication date: February 14, 2019
    Inventors: Ik Soo KIM, Byung Yeol KIM, Sang Pil KIM, Da Yeon LEE, Hwang Sub KOO, Hyun Je KIM, Hee Seok JUNG
  • Publication number: 20190041907
    Abstract: A laptop computer, according to the present invention, comprises: a main body part comprising a mainboard and a coaxial cable, one end of which is connected to the mainboard; and a display part hinge-coupled with the main body part and comprising a flexible printed circuit board which is installed on the back of the display part and has one end thereof coupled with the other end of the coaxial cable.
    Type: Application
    Filed: July 5, 2016
    Publication date: February 7, 2019
    Inventors: Ik Soo KIM, Byung Yeol KIM, Sang Pil KIM, Byung Hoon JO, Da Yeon LEE, Hwang Sub KOO, Hyun Je KIM, Hee Seok JUNG
  • Publication number: 20190045630
    Abstract: A flexible printed circuit board is introduced. The flexible printed circuit board of the present invention has a first substrate part, comprising a first signal line, and a second substrate part, comprising a second signal line that is parallel to the first signal line, arranged on the same plane while having a shielding part interposed therebetween.
    Type: Application
    Filed: February 6, 2017
    Publication date: February 7, 2019
    Inventors: Ik Soo KIM, Byung Yeol KIM, Sang Pil KIM, Byung Hoon JO, Da Yeon LEE, Hwang Sub KOO, Hyun Je KIM, Hee Seok JUNG