Abstract: A hybrid deposition system includes a chamber, a pump, a gas source, a cathodic arc source, a high power impulse magnetron sputtering source and a substrate. The pump is connected with an interior of the chamber for changing a pressure of the interior of the chamber. The gas source is connected with the interior of the chamber for providing a gas into the interior of the chamber. The cathodic arc source is connected with the chamber and includes a first target disposed in the interior of the chamber. The high power impulse magnetron sputtering source is connected with the chamber and includes a second target disposed in the interior of the chamber. The substrate is disposed in the interior of the chamber and corresponded to the first target and the second target.

Abstract: A deposition system includes a chamber, an electrical power module, a first detection module and a second detection module. The chamber includes a target, a substrate, and a plasma. The substrate is spaced apart with the target and corresponded to the target. The plasma is generated between the target and the substrate. The target, the substrate and the plasma are in an interior of the chamber. The electrical power module is electrically connected with the target so as to generate a potential difference between the target and the substrate. The first detection module is connected with the interior of the chamber for detecting a composition of the plasma so as to generate a first detection result. The second detection module is connected with the first detection module, and includes an avalanche photodiode detector for analyzing the first detection result so as to generate a second detection result.

Abstract: A high-hardness and corrosion-tolerant integrated circuit packing mold comprises a package mold including at least one filling channel, at least one mold cavity, and at least one channel between the mold cavities; a protecting layer deposited upon surfaces of the package mold and the protecting layer being an amorphous coating layer. In one case, the protecting layer is a graded layer including an amorphous coating layer and a middle layer. In a second case, the protecting layer is a multiplayer structure formed by at least one amorphous coating layer and at least one polycrystal coating layer. In the third case, the protecting layer is a compound structure formed by distributing polycrystal material into an amorphous coating layer.

Abstract: The invention relates to a method for removing and recoating of diamond-like carbon films and its products thereof. The method is to immerse the units that are coated with diamond-like carbon films into the hydrogen chloride solution to come off the coating, which was located on the units' surface. In addition, the method can effectively improve the past fault of poor adhesion, resulting from excessive residual stress and damaged unit surface due to the conventional sandblasting film removing process.

Abstract: In accordance with the present invention, there is provided a process for depositing diamond-like carbon (DLC) films by cathodic arc evaporation (CAE), wherein the high energy of CAE metal ions causes the cracking reaction of the hydrocarbon gases fed into the vacuum reaction chamber and then results in the deposition of DLC films having high hardness and lubrication. Due to the metallic constituents doped in the DLC films, the films also have good toughness. Moreover, prior to the feeding of hydrocarbon gases for the DLC deposition, the same metal arc source may deposits one or more interlayers of metal, metal nitride, or metal carbide on the substrate so as to further enhance the adhesion of the DLC films to be deposited.