Abstract: There are provided a multilayer ceramic electronic component and a board for mounting the same. The multilayer ceramic electronic component includes a hexahedral ceramic body including dielectric layers and satisfying T/W>1.0 when a width thereof is defined as W and a thickness thereof is defined as T; an active layer in which capacitance is formed, by including a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body, having the dielectric layer interposed therebetween, an upper cover layer formed above the active layer; a lower cover layer formed below the active layer and having a greater thickness than the upper cover layer; and first and second external electrodes covering the end surfaces of the ceramic body, wherein when a thickness of the lower cover layer is defined as Tb, 0.03?Tb/T?0.25 is satisfied.

Abstract: There are provided a multilayer ceramic electronic component and a mounting board therefor, the multilayer ceramic electronic component including a ceramic body having a hexahedral shape, including dielectric layers, and satisfying T/W>1.0 when a length of the ceramic body is defined as L, a width of a lower surface of the ceramic body is defined as W, and a thickness of the ceramic body is defined as T, and first and second internal electrodes stacked in the ceramic body so as to face each other, having the respective dielectric layers interposed therebetween, wherein when a width of an upper surface of the ceramic body is defined as Wa, 0.800?Wa/W?0.985 is satisfied.

Abstract: There is provided a multilayer ceramic electronic component includes: a ceramic body including dielectric layers stacked therein and satisfying T(thickness)/W(width)>1.0; first and second internal electrodes disposed to face each other in the ceramic body, having the dielectric layer disposed therebetween, and alternately exposed through end surfaces of the ceramic body; and first and second external electrodes extended from the end surfaces of the ceramic body to upper and lower main surfaces of the ceramic body wherein, when a height of the ceramic body is defined as a, and a distance from an upper end of the first or second external electrode formed on the upper main surface of the ceramic body to a lower end of the first or second external electrode formed on the lower main surface of the ceramic body is defined as b, 0.990?a/b<1 is satisfied.

Abstract: A multilayer ceramic electronic component includes a ceramic main body including dielectric layers and satisfying T/W>1.0 when W and T are width and thickness, respectively; and first and second internal electrodes stacked in the ceramic main body and facing each other with the dielectric layer interposed therebetween, the ceramic main body including an active layer corresponding to a capacitance forming portion contributing to capacitance formation and a cover layer corresponding to a non-capacitance forming portion provided on at least one of uppermost and lowermost surfaces of the active layer, and when the active layer is divided into three regions in a direction in which the first and second internal electrodes are stacked, an average width of internal electrodes in a central region of the three regions is Wa, and an average width of internal electrodes in upper and lower regions of the three regions is Wb, 0.920?Wb/Wa?0.998 is satisfied.

Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers stacked in a thickness direction and satisfying T/W>1.0 when a width thereof is W and a thickness thereof is T; first and second internal electrodes; and first and second external electrodes, wherein when the ceramic body is divided into five regions in a width direction and a central region among the five regions is CW1 and regions adjacent to the central region CW1 are CW2 and CW3, a difference between electrode connectivity of the central region CW1 and electrode connectivity of the region CW2 or CW3 satisfies 0.02?(CW2 or CW3)?CW1?0.10.

Abstract: There is provided a multilayer ceramic electronic component including, a ceramic body including a plurality of dielectric layers stacked in a thickness direction, satisfying T/W>1.0 when a width and a thickness thereof are defined as W and T, respectively, and having a groove portion inwardly recessed in a length direction in at least one main surface thereof, a plurality of first and second internal electrodes disposed in the ceramic body to face each other, having the dielectric layers interposed therebetween, and alternately exposed through both end surfaces of the ceramic body, and first and second external electrodes formed to extend from the both end surfaces of the ceramic body to the at least one main surface having the groove portion formed therein.

Abstract: There are provided a multilayer ceramic electronic component and a mounting board therefor, the multilayer ceramic electronic component, including a ceramic body having a hexahedral shape, including dielectric layers, and satisfying T/W1.0 when a length of the ceramic body is defined as L, a width of the ceramic body is defined as W, and a thickness of the ceramic body is defined as T, and first and second internal electrodes stacked in the ceramic body to face each other, having the respective dielectric layers interposed therebetween.

Abstract: There are disclosed a multilayer ceramic capacitor and a method of manufacturing the same. The multilayer ceramic capacitor includes: a ceramic body having a first side and a second side opposed to each other and having a third side and a fourth side connecting the first side to the second side, a plurality of inner electrodes formed within the ceramic body, and outer electrodes formed on the third side and the fourth side and electrically connected to the inner electrodes. A distance from distal edges of the inner electrodes to the first side or the second side of the ceramic body is 30 ?m or less.

Abstract: There is provided a ceramic electronic component, including: a ceramic body including a plurality of internal electrodes; a first external electrode layer electrically connected to the internal electrodes and formed on external surfaces of the ceramic body; a second external electrode layer including nickel (Ni), formed on the first external electrode layer; a metal coating layer including tin (Sn), formed on external surfaces of the first external electrode layer and the second external electrode layer; and a diffusion layer formed between the first and second external electrode layers and the metal coating layer.

Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body including dielectric layers and internal electrodes stacked between the dielectric layers; and a pair of external electrodes each fixed to first and second surfaces of the ceramic body, facing each other, and connected to the internal electrodes, wherein the ceramic body has a third surface facing a printed circuit board and each of the pair of external electrodes includes mounting parts extended onto the third surface and having a preset length by which they are mounted on the printed circuit board and wherein connection parts between the pair of external electrodes and the mounting parts have a convexly curved shape having a size equal to or smaller than a preset corner radius.

Abstract: There is provided a multilayer ceramic capacitor capable of controlling equivalent series resistance (ESR) characteristics. The multilayer ceramic capacitor includes: a ceramic laminate including dielectric layers and a plurality of internal electrodes having different polarities and alternately stacked between the dielectric layers; and external electrodes formed on both sides of the ceramic laminate, wherein each of the internal electrodes includes a main electrode and a lead for connecting the main electrode to the external electrode, and an equivalent series resistance (ESR) value is determined by adjusting a ratio of a width to a length of the lead, whereby the ESR characteristics of the multilayer ceramic capacitor may be controlled.

Abstract: There is provided a multilayer ceramic capacitor capable of controlling equivalent series resistance (ESR) characteristics. The multilayer ceramic capacitor includes: a ceramic laminate including dielectric layers and a plurality of internal electrodes having different polarities and alternately stacked between the dielectric layers; and external electrodes formed on both sides of the ceramic laminate, wherein each of the internal electrodes includes a main electrode and a lead for connecting the main electrode to the external electrode, and an equivalent series resistance (ESR) value is determined by adjusting a ratio of a width to a length of the lead, whereby the ESR characteristics of the multilayer ceramic capacitor may be controlled.

Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body including dielectric layers and internal electrodes stacked between the dielectric layers; and a pair of external electrodes each fixed to first and second surfaces of the ceramic body, facing each other, and connected to the internal electrodes, wherein the ceramic body has a third surface facing a printed circuit board and each of the pair of external electrodes includes mounting parts extended onto the third surface and having a preset length by which they are mounted on the printed circuit board and wherein connection parts between the pair of external electrodes and the mounting parts have a convexly curved shape having a size equal to or smaller than a preset corner radius.

Abstract: There are disclosed a multilayer ceramic capacitor and a method of manufacturing the same. The multilayer ceramic capacitor includes: a ceramic body having a first side and a second side opposed to each other and having a third side and a fourth side connecting the first side to the second side, a plurality of inner electrodes formed within the ceramic body, and outer electrodes formed on the third side and the fourth side and electrically connected to the inner electrodes. A distance from distal edges of the inner electrodes to the first side or the second side of the ceramic body is 30 ?m or less.

Abstract: Disclosed are a multilayer ceramic condenser and a method of manufacturing the same. The method includes printing a plurality of stripe-type inner electrode patterns in parallel on ceramic green sheets; forming a laminate by staking the ceramic green sheets having the plurality of stripe-type inner electrode patterns printed thereon; cutting the laminate in order to have a structure in which first and second inner electrode patterns are alternately stacked; and forming a first side part and a second side part by applying ceramic slurry in order to cover the sides of the laminate to which the first and second inner electrode patterns are exposed.

Abstract: There is provided a method of fabricating a ceramic green sheet, the method including: forming a ceramic green sheet by applying ceramic slurry onto a support substrate; and drying the ceramic green sheet by allowing the ceramic green sheet to pass through a plurality of drying zones, wherein positive internal differential pressure is applied to at least one of drying zones disposed at a front end of the plurality of drying zones, the internal differential pressure being defined as a pressure value obtained by subtracting a discharging pressure (Pout) of each drying zone from an introducing pressure (Pin) thereof.

Abstract: In a multilayered ceramic capacitor, the width of an exposed portion of an internal electrode is reduced to be narrower than that of a non-exposed portion thereof. A dummy electrode that is not electrically connected to the internal electrode is formed to be connected to an external electrode. Deterioration of reliability due to penetration of the plating solution thereby is prevented and reduction in adhesion of the external electrode due to reduction in width of the exposed portion of the internal electrode is supplemented through mechanical connection between the external electrode and the dummy electrode.

Abstract: There is provided a method of measuring deformation of a laminated body, the method including: laminating and pressurizing a plurality of green sheets each having a plurality of inner electrodes arranged therein to form a laminated body having a plurality of unit chips arranged therein; marking location information of each of the unit chips on an XY plane of the laminated body on a surface of the unit chip; cutting the laminated body into the plurality of unit chips; measuring a deformation level of each of the cut unit chips; and storing the deformation level measured from the each of the cut unit chips to correspond to the location information of the unit chip.

Abstract: There is provided a method of measuring deformation of a laminated body, the method including: laminating and pressurizing a plurality of green sheets each having a plurality of inner electrodes arranged therein to form a laminated body having a plurality of unit chips arranged therein; marking location information of each of the unit chips on an XY plane of the laminated body on a surface of the unit chip; cutting the laminated body into the plurality of unit chips; measuring a deformation level of each of the cut unit chips; and storing the deformation level measured from the each of the cut unit chips to correspond to the location information of the unit chip.