Abstract: Disclosed are a key input apparatus in an electronic oven and a control method thereof enabling to reduce a size of a circuit as well as provide a simple design of the key input control part. A key input apparatus in an electronic oven includes a signal level producing part receiving input signals having a uniform level and producing signals having various levels, and a control part receiving the signals having the various levels through one input port and carrying out operations corresponding the signals having the various levels.

Abstract: A method is disclosed for manufacturing chip-scale semiconductor packages at a wafer-scale level using wafer mapping techniques. In the method, a semiconductor wafer and/or a circuit substrate, each respectively comprising a plurality of individual chips and circuit pattern units, is/are pre-tested and discriminated in terms of the quality and/or grade of each individual chip unit and/or circuit pattern unit contained therein. The test results are marked on the lower surface of each chip unit and/or on each pattern unit. The substrate is laminated to the wafer to form a laminated assembly prior to performing the packaging process, which typically includes a wire bonding step, an encapsulation step and a solder ball welding step. A plurality of connected package units are thereby formed in the laminated substrate-wafer assembly. The package units are then singulated from each other and the laminated assembly by a cutting process.

Abstract: A circuit pattern tape for the wafer-scale production of chip size semiconductor packages is adapted to be laminated onto a semiconductor wafer and includes a flexible insulating layer, a plurality of identical circuit pattern units arrayed thereon, and a solder mask covering the circuit patterns. Each circuit pattern unit includes a central opening, a plurality of bond fingers arranged on opposite sides of the opening and electrically connected through the opening to associated die pads on an underlying semiconductor chip in the wafer, a plurality of solder ball lands, each having a solder ball attached thereto, and a plurality of conductive traces electrically connecting respective ones of the bond fingers and the solder ball lands to each other.

Abstract: Disclosed are a key input apparatus in an electronic oven and a control method thereof enabling to reduce a size of a circuit as well as provide a simple design of the key input control part. A key input apparatus in an electronic oven includes a signal level producing part receiving input signals having a uniform level and producing signals having various levels, and a control part receiving the signals having the various levels through one input port and carrying out operations corresponding the signals having the various levels.

Abstract: A method for compensating cooking time of a microwave oven which sets an exact reference voltage and automatically controls cooking time in accordance with variation of an input voltage, includes the steps of: setting the reference voltage based on the input voltage regulated to a rated voltage in a state that power is applied or a load is driven and storing the reference voltage in a memory; checking a level of a currently input voltage; and calculating compensating time in accordance with a difference value between the currently input voltage and the reference voltage. Thus, it is possible to minimize dissatisfaction of a user due to voltage variation.