Abstract: A method of correcting a position of a prober, the method including obtaining a first image of a pad, the pad having a predetermined reference contact position, contacting the prober to the pad after obtaining the first image of the pad, obtaining a second image of the pad after contacting the prober to the pad, determining an actual contact position of an actual contact mark on the pad, the actual contact mark being produced by the contacting of the prober to the pad, comparing the second image to the first image to obtain an offset data, the offset data relating the actual contact position to the reference contact position, and correcting the position of the prober by aligning the actual contact position with the reference contact position based on the offset data.

Abstract: A method of correcting a position of a prober, the method including obtaining a first image of a pad, the pad having a predetermined reference contact position, contacting the prober to the pad after obtaining the first image of the pad, obtaining a second image of the pad after contacting the prober to the pad, determining an actual contact position of an actual contact mark on the pad, the actual contact mark being produced by the contacting of the prober to the pad, comparing the second image to the first image to obtain an offset data, the offset data relating the actual contact position to the reference contact position, and correcting the position of the prober by aligning the actual contact position with the reference contact position based on the offset data.

Abstract: A test system of a semiconductor device for a handler remote control is provided. The system includes: a tester for testing the semiconductor device; a handler connected to the tester through a GPIB (General Purpose Instruction Bus) communication cable; a tester server connected to the tester to download a test program, handler remote control program and a handler state check program to the tester; and communication data transmitted and received through the GPIB communication cable between the tester and the handler, wherein the communication data has basic communication data for an electrical test of the semiconductor device, communication data for the handler remote control, and communication data for a handler state check.

Abstract: A test system of a semiconductor device for a handler remote control is provided. The system includes: a tester for testing the semiconductor device; a handler connected to the tester through a GPIB (General Purpose Instruction Bus) communication cable; a tester server connected to the tester to download a test program, handler remote control program and a handler state check program to the tester; and communication data transmitted and received through the GPIB communication cable between the tester and the handler, wherein the communication data has basic communication data for an electrical test of the semiconductor device, communication data for the handler remote control, and communication data for a handler state check.

Abstract: A test system of a semiconductor device for a handler remote control is provided. The system includes: a tester for testing the semiconductor device; a handler connected to the tester through a GPIB (General Purpose Instruction Bus) communication cable; a tester server connected to the tester to download a test program, handler remote control program and a handler state check program to the tester; and communication data transmitted and received through the GPIB communication cable between the tester and the handler, wherein the communication data has basic communication data for an electrical test of the semiconductor device, communication data for the handler remote control, and communication data for a handler state check.

Abstract: A test system of a semiconductor device for a handler remote control is provided. The system includes: a tester for testing the semiconductor device; a handler connected to the tester through a GPIB (General Purpose Instruction Bus) communication cable; a tester server connected to the tester to download a test program, handler remote control program and a handler state check program to the tester; and communication data transmitted and received through the GPIB communication cable between the tester and the handler, wherein the communication data has basic communication data for an electrical test of the semiconductor device, communication data for the handler remote control, and communication data for a handler state check.

Abstract: An electrical testing method for a semiconductor package for detecting defects of sockets mounted on a device under test (DUT) board is provided. A tester performs electrical test, accumulates electrical test results, and compares the accumulated results to reference values. The result of the comparison decides whether a plurality of sockets mounted on the DUT board can be used or not. The decision results are transmitted to a handler so that the socket having the defects is not used on the DUT board.

Abstract: A method for testing semiconductor devices includes loading a customer tray with semiconductor devices to be tested. Groups of devices are transferred from the customer tray to buffer trays for testing. The number of devices in the customer tray is checked after each transfer. If the customer tray is empty, the number of semiconductor devices in the buffer trays is counted and compared with the number of semiconductor devices that can be tested simultaneously, typically either 64 or 128. If the number of semiconductor devices in the buffer trays is greater than the tester capacity, the semiconductor devices in at least one buffer tray are tested. If the number of semiconductor devices in the buffer trays is smaller than the tester capacity, semiconductor devices that were determined to be low quality in a prior test are loaded into a buffer tray, thus testing both untested and low quality devices together.

Abstract: A method for testing semiconductor devices includes loading a customer tray with semiconductor devices to be tested in a loader. The devices are moved from the customer tray into a test tray via a buffer tray of a loader buffer. The tested semiconductor devices are classified into high and low quality semiconductor devices. The classified semiconductor devices are unloaded from the test tray to the customer tray of an unloader via an unloader buffer. If the customer tray is not empty, the semiconductor devices are tested. If the customer tray is empty, the number of semiconductor devices in the buffer tray buffer is counted and compared with the number of semiconductor devices that can be tested simultaneously, typically either 64 or 128. If the number of semiconductor devices in the buffer tray is greater than the tester capacity, the semiconductor devices in the buffer tray are tested.

Abstract: An electrical testing method for a semiconductor package for detecting defects of sockets mounted on a device under test (DUT) board is provided. A tester performs electrical test, accumulates electrical test results, and compares the accumulated results to reference values. The result of the comparison decides whether a plurality of sockets mounted on the DUT board can be used or not. The decision results are transmitted to a handler so that the socket having the defects is not used on the DUT board.