Abstract: Disclosed herein are a distributed cloud system, a data processing method of the distributed cloud system, a storage medium. The data processing method of the distributed cloud system includes running an application of an edge computing system requested by a user device, generating a snapshot image of the application, and storing the generated snapshot image and transmitting the stored image during migration.

Abstract: A method of operating a memory system, which includes a memory controller and at least one non-volatile memory, includes storing, in the memory system, temperature-dependent performance level information received from a host disposed external to the memory system, setting an operation performance level of the memory system to a first performance level, operating the memory controller and the at least one non-volatile memory device according to the first performance level, detecting an internal temperature of the memory system, and changing the operation performance level of the memory system to a second performance level that is different from the first performance level. The operation performance level is changed by the memory controller of the memory system, and changing the operation performance level is based on the temperature-dependent performance level information and the detected internal temperature.

Abstract: A method of operating a memory system, which includes a memory controller and at least one non-volatile memory, includes storing, in the memory system, temperature-dependent performance level information received from a host disposed external to the memory system, setting an operation performance level of the memory system to a first performance level, operating the memory controller and the at least one non-volatile memory device according to the first performance level, detecting an internal temperature of the memory system, and changing the operation performance level of the memory system to a second performance level that is different from the first performance level. The operation performance level is changed by the memory controller of the memory system, and changing the operation performance level is based on the temperature-dependent performance level information and the detected internal temperature.

Abstract: A display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.

Abstract: A self-cleaning device comprises at least one first electrode disposed on a solid material layer, a first dielectric layer disposed on the first electrode, a hydrophobic layer disposed on the first dielectric layer, and at least one mechanical oscillation unit. Electrical oscillation for oscillating a droplet in a horizontal direction is generated by applying a first electric signal to the first electrode, thereby merging droplets formed on the hydrophobic layer, the mechanical oscillation unit moves the merged droplets in a specific direction or atomizes the merged droplets to remove the merged droplets by generating mechanical oscillation for oscillating the droplet in a vertical direction, and each of the droplets has a volume smaller than 3 ?l, and new droplet having a volume more than 3 ?l is generated by the merging.

Abstract: Disclosed herein is a multi-cloud edge system. The multi-cloud edge system includes a core cloud, a multi-cluster-based first edge node system, and a multi-cluster-based near edge node system, wherein the multi-cluster-based first edge node system includes multiple worker nodes, and a master node including a scheduler.

Abstract: An embodiment of the present invention discloses a camera module including a light output unit configured to output an optical signal to an object; an optical unit configured to pass the optical signal reflected from the object; a sensor configured to receive the optical signal passed by the optical unit; and a control unit configured to acquire depth information of the object using the optical signal received by the sensor, wherein the sensor includes an effective area in which a light receiving element is disposed and an ineffective area other than the effective area and includes a first row region, in which the effective area and the ineffective area are alternately disposed in a row direction, and a second row region, in which the effective area and the ineffective area are alternately disposed in the row direction and the effective area is disposed at a position not overlapping the effective area of the first row region in a column direction, light that reaches the effective area of the first row region

Abstract: Self-cleaning device and method using electrical oscillation and mechanical oscillation are disclosed. The self-cleaning device comprises at least one first electrode disposed on a solid material layer, a first dielectric layer disposed on the first electrode, a hydrophobic layer disposed on the first dielectric layer and at least one mechanical oscillation unit. Here, electrical oscillation for oscillating a droplet in a horizontal direction is generated by applying a first electric signal to the first electrode, thereby merging the droplets formed on the hydrophobic layer, and the mechanical oscillation unit moves the merged droplets in a specific direction or atomizes the merged droplets to remove the merged droplets by generating mechanical oscillation for oscillating the droplet in a vertical direction.

Abstract: A camera module includes an image acquisition unit configured to acquire a plurality of image frames having a spatial phase difference therebetween, an image generation unit configured to generate image data having a resolution higher than a resolution of each of the plurality of image frames using the plurality of image frames, and a depth information extraction unit configured to extract depth information about an object using the image data.

Abstract: A camera module includes an image acquisition unit configured to acquire a plurality of image frames having a spatial phase difference therebetween, an image generation unit configured to generate image data having a resolution higher than a resolution of each of the plurality of image frames using the plurality of image frames, and a depth information extraction unit configured to extract depth information about an object using the image data.

Abstract: A camera module includes an image acquisition unit configured to acquire a plurality of image frames having a spatial phase difference therebetween, an image generation unit configured to generate image data having a resolution higher than a resolution of each of the plurality of image frames using the plurality of image frames, and a depth information extraction unit configured to extract depth information about an object using the image data.

Abstract: Self-cleaning device and method using electrical oscillation and mechanical oscillation are disclosed. The self-cleaning device comprises at least one first electrode disposed on a solid material layer, a first dielectric layer disposed on the first electrode, a hydrophobic layer disposed on the first dielectric layer and at least one mechanical oscillation unit. Here, electrical oscillation for oscillating a droplet in a horizontal direction is generated by applying a first electric signal to the first electrode, thereby merging the droplets formed on the hydrophobic layer, and the mechanical oscillation unit moves the merged droplets in a specific direction or atomizes the merged droplets to remove the merged droplets by generating mechanical oscillation for oscillating the droplet in a vertical direction.

Abstract: A camera module includes an image acquisition unit configured to acquire a plurality of image frames having a spatial phase difference therebetween, an image generation unit configured to generate image data having a resolution higher than a resolution of each of the plurality of image frames using the plurality of image frames, and a depth information extraction unit configured to extract depth information about an object using the image data.

Abstract: An embodiment of the present invention discloses a camera module including a light output unit configured to output an optical signal to an object; an optical unit configured to pass the optical signal reflected from the object; a sensor configured to receive the optical signal passed by the optical unit; and a control unit configured to acquire depth information of the object using the optical signal received by the sensor, wherein the sensor includes an effective area in which a light receiving element is disposed and an ineffective area other than the effective area and includes a first row region, in which the effective area and the ineffective area are alternately disposed in a row direction, and a second row region, in which the effective area and the ineffective area are alternately disposed in the row direction and the effective area is disposed at a position not overlapping the effective area of the first row region in a column direction, light that reaches the effective area of the first row region

Abstract: A camera module includes an image acquisition unit configured to acquire a plurality of image frames having a spatial phase difference therebetween, an image generation unit configured to generate image data having a resolution higher than a resolution of each of the plurality of image frames using the plurality of image frames, and a depth information extraction unit configured to extract depth information about an object using the image data.

Abstract: A semiconductor device is provided. The semiconductor device includes a fin type pattern, a field insulating film on a part of a sidewall of the fin-type pattern, and a gate electrode intersecting with the fin-type pattern, on the fin-type pattern and the field insulating film. The gate electrode on the field insulating film includes a first portion, a second portion, and a third portion on the field insulating film. A first width of the first portion increases as a first distance from the field insulating film, increases width of the second portion decreases as a second distance from the field insulating film increases, and a third width of the third portion increases or is substantially constant as a third distance from the field insulating film increases.

Abstract: An embodiment comprises: a substrate having a chip mounting region; first and second wiring layers disposed on the substrate around the chip mounting region so as to be spaced apart from each other; and a plurality of light emitting chips disposed on the chip mounting region, wherein the first wiring layer comprises a first wiring pattern disposed at one side of a reference line and having a first concave part, and a first extending pattern extending from the first wiring pattern to the other side of the reference line, the second wiring layer comprises a second wiring pattern disposed at the other side of the reference line and having a second concave part, and a second extending pattern extending from the second wiring pattern to one side of the reference line, and the reference line is a straight line passing through the center of the chip mounting region.

Abstract: A semiconductor device is provided. The semiconductor device includes a fin type pattern, a field insulating film on a part of a sidewall of the fin-type pattern, and a gate electrode intersecting with the fin-type pattern, on the fin-type pattern and the field insulating film. The gate electrode on the field insulating film includes a first portion, a second portion, and a third portion on the field insulating film. A first width of the first portion increases as a first distance from the field insulating film, increases width of the second portion decreases as a second distance from the field insulating film increases, and a third width of the third portion increases or is substantially constant as a third distance from the field insulating film increases.

Abstract: An embodiment comprises: a substrate having a chip mounting region; first and second wiring layers disposed on the substrate around the chip mounting region so as to be spaced apart from each other; and a plurality of light emitting chips disposed on the chip mounting region, wherein the first wiring layer comprises a first wiring pattern disposed at one side of a reference line and having a first concave part, and a first extending pattern extending from the first wiring pattern to the other side of the reference line, the second wiring layer comprises a second wiring pattern disposed at the other side of the reference line and having a second concave part, and a second extending pattern extending from the second wiring pattern to one side of the reference line, and the reference line is a straight line passing through the center of the chip mounting region.

Abstract: A battery pack includes a bare cell that includes an electrode assembly, a case for accommodating the electrode assembly, and a cap plate arranged at one side of the case, a protection circuit board assembly for controlling charge/discharge of the bare cell, a battery protection device electrically connected to the protection circuit board assembly, and a first adhesive member. At least a part of the first adhesive member is disposed on the case. The first adhesive member crosses the battery protection device in a lengthwise direction of the battery protection device.