Abstract: An array substrate including a display area and a non-display area surrounding the display area. The non-display area includes a pad portion including one or more first pads that each have a parallelogram shape.

Abstract: A conductive particle comprising a polyhedral shape in which two neighboring sides among a plurality of sides form an intersection line, and two sides meeting on the intersection line form an angle.

Abstract: An array substrate including a display area and a non-display area surrounding the display area. The non-display area includes a pad portion including one or more first pads that each have a parallelogram shape.

Abstract: A display device includes a substrate including a wiring portion, a pad unit provided on the substrate and extended from the wiring portion, an integrated circuit chip electrically connected to the pad unit and mounted on the substrate, and an anisotropic conductive film configured to electrically connect the pad unit and the integrated chip to each other. The anisotropic conductive film includes an adhesive layer provided between the pad unit and the integrated circuit chip and at least one conductive ball scattered in the adhesive layer. A heat generator is also provided on the substrate. The heat generator is configured to come into contact with the anisotropic conductive film to supply heat to the anisotropic conductive film.

Abstract: A conductive particle comprising a polyhedral shape in which two neighboring sides among a plurality of sides form an intersection line, and two sides meeting on the intersection line form an angle.

Abstract: A method for manufacturing a flexible display device by forming a flexible base substrate on a carrier substrate, the flexible base substrate having a display region and a non-display region, forming a display unit comprising a plurality of pixels at the display region, separating the flexible base substrate from the carrier substrate, forming an adhesive layer under the flexible base substrate, forming a flexible carrier film under the adhesive layer, forming a pressed region of the adhesive layer by partially pressing the adhesive layer, and mounting a driving circuit at a portion of the non-display region overlapping the pressed region.

Abstract: A conductive particle comprising a polyhedral shape in which two neighboring sides among a plurality of sides form an intersection line, and two sides meeting on the intersection line form an angle.

Abstract: A display device includes a substrate including a wiring portion, a pad unit provided on the substrate and extended from the wiring portion, an integrated circuit chip electrically connected to the pad unit and mounted on the substrate, and an anisotropic conductive film configured to electrically connect the pad unit and the integrated chip to each other. The anisotropic conductive film includes an adhesive layer provided between the pad unit and the integrated circuit chip and at least one conductive ball scattered in the adhesive layer. A heat generator is also provided on the substrate. The heat generator is configured to come into contact with the anisotropic conductive film to supply heat to the anisotropic conductive film.

Abstract: A chip on glass substrate includes a substrate, first, second, and third pads that are arranged on the substrate and that are electrically connected to an IC device, and first to fourth conductive patterns. A first conductive pattern is arranged on the substrate, has one end electrically connected to the first pad, and has another end that is electrically floated. Second and third conductive patterns are arranged on the substrate, each have one end electrically connected to the second pad, and each have another end that is electrically floated. A fourth conductive pattern is arranged on the substrate, has one end electrically connected to the third pad, and has another end that is electrically floated.

Abstract: A conductive particle comprising a polyhedral shape in which two neighboring sides among a plurality of sides form an intersection line, and two sides meeting on the intersection line form an angle.

Abstract: A chip on glass substrate includes a substrate, first, second, and third pads that are arranged on the substrate and that are electrically connected to an IC device, and first to fourth conductive patterns. A first conductive pattern is arranged on the substrate, has one end electrically connected to the first pad, and has another end that is electrically floated. Second and third conductive patterns are arranged on the substrate, each have one end electrically connected to the second pad, and each have another end that is electrically floated. A fourth conductive pattern is arranged on the substrate, has one end electrically connected to the third pad, and has another end that is electrically floated.