Abstract: There is provide a method for manufacturing analytical semiconductor samples by using an apparatus for manufacturing analytical semiconductor samples, which minimizes a feedback time by manufacturing a viewing surface that is environment-friendly and has a large area. The method comprising mounting the analytical semiconductor samples to a holder; discharging deionized (DI) water to an upper surface of a polishing plate through a DI water nozzle; grinding the analytical semiconductor samples with the upper surface of the polishing plat; determining whether a desired viewing surface of the analytical semiconductor samples has been acquired after the grinding of the analytical semiconductor samples; and transferring the analytical semiconductor samples to analyze the viewing surface of the ground analytical semiconductor samples based on a determination that the desired viewing surface of the analytical semiconductor samples has been acquired.

Abstract: A soldering inspection apparatus is configured to allow focus areas of vertical and lateral images to coincide with each other. The apparatus includes an illumination module provided with a plurality of light emitting devices and provided at a top thereof with an opening through which light reflected by the subject passes. The apparatus also includes a first photographing unit to photograph a vertical image of the subject through the opening, a plurality of second photographing units to photograph lateral images of the subject through the opening, and a light path unit disposed between the illumination module and the first and second photographing units, and designed to control a progressing path of the light passed through the opening.