Abstract: A method and apparatus for regulating the temperature a wafer is provided. The apparatus may include a temperature controlling unit provided within the chamber and regulating the temperature of the wafer; a wafer support pin for adjusting the position of the wafer with respect to the temperature controlling unit; and/or a positioning assembly for adjusting the wafer support pin by which the position of the wafer is controlled. The temperature of a wafer baked at a high temperature may be regulated by performing a series of temperature controlling operation in order to reduce the possibility of fracturing the wafer due to a change in temperature.