Abstract: The present invention presents a single wafer-type wafer cleaning device and a single wafer-type method for controlling the surface roughness of a wafer, in which, in a wafer cleaning process, mutually different cleaning processes are carried out on the respective two sides of a wafer, and also, mutually different chemicals are used depending on the side of the wafer being cleaned, thereby enabling the respective roughness of the two sides to differ. The single wafer-type wafer cleaning device comprises a spin chamber, a first chemical supply device, a second chemical supply device and a third chemical supply device.

Abstract: A display device includes a display unit including pixels connected to data lines and scan lines, first and second temperature sensors for sensing first and second temperatures of the display unit, a data driver configured to generate a data signal configured to be supplied to the data lines using output data, and attached to a first printed circuit board configured to be fixed to a rear surface of the display unit, a timing controller configured to generate the output data using input data, and attached to a second printed circuit board configured to be fixed to the rear surface of the display unit, and a storage having a temperature weight table including a weight corresponding to the first and second temperatures and a plurality of temperature tables including temperature information of the display unit corresponding to an attachment position of the second printed circuit board.

Abstract: An embodiment of the present invention relates to a cylindrical secondary battery, and the cylindrical secondary battery may comprise: a cylindrical can; an electrode assembly which includes a first electrode plate, a second electrode plate, and a separator wound together and is accommodated in the can; and a cap assembly which is insulated from the can, is electrically connected to the electrode assembly, and has a hole formed therethrough to communicate with the inside of the can. According to the embodiment of the present invention, a degassing function is applied so that gas generated before product delivery can be removed and thus deformation of the can and the cap assembly can be reduced. In addition, the occurrence of swelling of the electrode assembly due to internal gas generation can be prevented and thus performance degradation of the secondary battery can be reduced.

Abstract: An adhesive film for semiconductor devices, the adhesive film including a base film having a coefficient of linear expansion of about 50 to about 150 ?m/m•° C. at 0 to 5° C.

Abstract: An adhesive film for semiconductor devices, the adhesive film including a base film having a coefficient of linear expansion of about 50 to about 150 ?m/m·° C. at 0 to 5° C.

Abstract: Provided is a photovoltaic cell assembly that effectively collects light and dissipates heat to improve electricity generating efficiency. The photovoltaic cell assembly includes a light collecting unit configured to collect sunlight incident from a Fresnel lens, a cell receiver configured to convert the sunlight collected by the light collecting unit to an electrical signal, a heat dissipation plate configured to support the light collecting unit and the cell receiver and fixed to an inner surface of a housing, and a heat dissipation block disposed on an outer surface of the housing and coupled to the heat dissipation plate with the housing interposed between the heat dissipation plate and the heat dissipation block.