Patents by Inventor Dae-Hong Lee

Dae-Hong Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240133642
    Abstract: The present invention relates to an integrated connector and a heat exchanger including the same, in which a connector main body is formed by pressing one pipe, a cap is press-fitted into the connector main body, such that the integrated connector is formed so that an interior of the connector main body is blocked by the cap. Therefore, the number of components used to manufacture a connector, which connects and securely couples a header tank and a gas-liquid separator, may be reduced, the integrated connector may be easily manufactured, and a brazing defect may be reduced at portions where the integrated connector is joined to the header tank and the gas-liquid separator of the heat exchanger.
    Type: Application
    Filed: September 26, 2023
    Publication date: April 25, 2024
    Inventors: Seung Hark SHIN, Woon Sik KIM, Dae Sung NOH, Hyunwoo CHO, Min Won SEO, Sung Hong SHIN, Jong Du LEE, Jung Hyun CHO, Uk HUH
  • Publication number: 20240090121
    Abstract: A printed circuit board includes a first substrate portion including a plurality of first insulating layers, a plurality of first wiring layers respectively disposed on the plurality of first insulating layers, and a plurality of first adhesive layers respectively disposed between the plurality of first insulating layers to respectively cover the plurality of first wiring layers; and a second substrate portion disposed on the first substrate portion, and including a plurality of second insulating layers, a plurality of second wiring layers respectively disposed on the plurality of second insulating layers, and a plurality of second adhesive layers respectively disposed between the plurality of second insulating layers to respectively cover the plurality of second wiring layers.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 14, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dae Jung BYUN, Jung Soo KIM, Sang Hyun SIM, Chang Min HA, Tae Hong MIN, Jin Won LEE
  • Patent number: 8351550
    Abstract: A correlation apparatus and method for frequency synchronization are provided. A frequency synchronization method of a receiver in a broadband wireless access communication system includes acquiring a highest correlation value by conducting a differential correlation of a variable interval between a received signal and a reference signal and performing a frequency synchronization according to the highest correlation value.
    Type: Grant
    Filed: January 30, 2009
    Date of Patent: January 8, 2013
    Assignees: Samsung Electronics Co., Ltd., Sungkyunkwan University Foundation for Corporate Collaboration
    Inventors: Hee-Jin Roh, Jeoung-Gil Lee, Su-Jin Yoon, Hoon Kang, Chang-Hyun Baik, Jun-Kyu Kang, Hyung-Jin Choi, Se-Bin Im, Dae-Hong Lee
  • Publication number: 20090196383
    Abstract: A correlation apparatus and method for frequency synchronization are provided. A frequency synchronization method of a receiver in a broadband wireless access communication system includes acquiring a highest correlation value by conducting a differential correlation of a variable interval between a received signal and a reference signal and performing a frequency synchronization according to the highest correlation value.
    Type: Application
    Filed: January 30, 2009
    Publication date: August 6, 2009
    Applicants: SAMSUNG ELECTRONICS CO. LTD., SUNGKYUNKWAN UNIVERSITY Foundation for Corporate Collaboration
    Inventors: Hee-Jin ROH, Jeoung-Gil LEE, Su-Jin YOON, Hoon KANG, Chang-Hyun BAIK, Jun-Kyu KANG, Hyung-Jin CHOI, Se-Bin IM, Dae-Hong LEE