Abstract: The present invention relates to a multifunctional chair which is configured to train, rehabilitate, and correct the back spine, pelvis and knee joints of the user. The angle of inclination of a seat member can be adjusted arbitrarily to the front, rear, left and right, thereby preventing back injury due to a sharp angle of inclination from the outset, while at the same time completely preventing rocking of the seat member when back exercises are not being carried out and thus allowing the chair to be used as a general chair. A rolling member provided in a lower part of the seat is improved, thereby imparting a cushioned feel to the seat while restricting the range of tilting movement of the seat to only front-and-back, left-and-right and multidirectional and preventing rotation in such a way as to limit excessive rocking of the seat overall and hence prevent side effects from seated exercises.

Abstract: A semiconductor package mainly includes a leadframe and a first semiconductor chip such as an application specific integrated circuit (ASIC) encapsulated in a first package body having a cavity for receiving a second semiconductor chip such as a pressure sensor chip, and a cover disposed over the cavity of the first package body. At least a portion of the first package body is formed between the second semiconductor chip and the die pad such that the second semiconductor chip is directly disposed on the portion of the first package body instead of the die pad.

Abstract: A semiconductor package mainly includes a leadframe and a first semiconductor chip such as an application specific integrated circuit (ASIC) encapsulated in a first package body having a cavity for receiving a second semiconductor chip such as a pressure sensor chip, and a cover disposed over the cavity of the first package body. At least a portion of the first package body is formed between the second semiconductor chip and the die pad such that the second semiconductor chip is directly disposed on the portion of the first package body instead of the die pad.