Abstract: A storage system includes a memory controller providing a clock signal; a buffer having a first duty cycle corrector to receive the clock signal and a chip selection signal from the memory controller, perform a first duty correction operation on the clock signal using a first data code and output a first corrected clock signal, a register to store the first data code regarding the chip selection signal, and a sampler to receive a data signal and a data strobe signal regarding the data signal and output a data stream; and a nonvolatile memory having a second duty cycle corrector to receive the first corrected clock signal from the buffer and perform a second duty correction operation on the first corrected clock signal using a second data code and out a second corrected clock signal, a second data code generation circuit to generate the second data code based on the second corrected clock signal, and a data strobe signal generator to generate the data strobe signal based on the second corrected clock signal an

Abstract: A storage system includes a memory controller providing a clock signal; a buffer having a first duty cycle corrector to receive the clock signal and a chip selection signal from the memory controller, perform a first duty correction operation on the clock signal using a first data code and output a first corrected clock signal, a register to store the first data code regarding the chip selection signal, and a sampler to receive a data signal and a data strobe signal regarding the data signal and output a data stream; and a nonvolatile memory having a second duty cycle corrector to receive the first corrected clock signal from the buffer and perform a second duty correction operation on the first corrected clock signal using a second data code and out a second corrected clock signal, a second data code generation circuit to generate the second data code based on the second corrected clock signal, and a data strobe signal generator to generate the data strobe signal based on the second corrected clock signal an

Abstract: A storage system includes: a memory controller which provides a clock signal; a buffer which receives the clock signal and re-drives the clock signal, the buffer including a sampler which receives a data signal and a data strobe signal regarding the data signal, and which outputs a data stream; and a nonvolatile memory, including: a first duty cycle corrector, which receives the clock signal outputs a corrected clock signal by performing a first duty correction operation on the clock signal; and a data strobe signal generator, which generates the data strobe signal based on the corrected clock signal and provides the data strobe signal to the buffer. The buffer receives the data strobe signal output from the nonvolatile memory, senses a duty ratio of the data strobe signal input to the sampler, and performs a second duty correction operation on the duty ratio of the input data strobe signal.

Abstract: A storage system includes: a memory controller which provides a clock signal; a buffer which receives the clock signal and re-drives the clock signal, the buffer including a sampler which receives a data signal and a data strobe signal regarding the data signal, and which outputs a data stream; and a nonvolatile memory, including: a first duty cycle corrector, which receives the clock signal outputs a corrected clock signal by performing a first duty correction operation on the clock signal; and a data strobe signal generator, which generates the data strobe signal based on the corrected clock signal and provides the data strobe signal to the buffer. The buffer receives the data strobe signal output from the nonvolatile memory, senses a duty ratio of the data strobe signal input to the sampler, and performs a second duty correction operation on the duty ratio of the input data strobe signal.

Abstract: Provided are multi-chip packages. A multi-chip package includes a first memory chip and a second memory chip on a printed circuit board; a memory controller electrically connected to the first memory chip and the second memory chip via a first bonding wire and a second bonding wire; and a strength control module configured to control a drive strength of each of a first output driver of the first memory chip and a second output driver of the second memory chip, wherein the memory controller includes an interface circuit configured to receive each of first test data and second test data from the first output driver and the second output driver in which the drive strength is set by the strength control module, and output detection data for detecting whether the first bonding wire and the bonding wire are short-circuited based on the first and second test data.

Abstract: Provided are multi-chip packages. A multi-chip package includes a first memory chip and a second memory chip on a printed circuit board; a memory controller electrically connected to the first memory chip and the second memory chip via a first bonding wire and a second bonding wire; and a strength control module configured to control a drive strength of each of a first output driver of the first memory chip and a second output driver of the second memory chip, wherein the memory controller includes an interface circuit configured to receive each of first test data and second test data from the first output driver and the second output driver in which the drive strength is set by the strength control module, and output detection data for detecting whether the first bonding wire and the bonding wire are short-circuited based on the first and second test data.

Abstract: Provided are multi-chip packages. A multi-chip package includes a first memory chip and a second memory chip on a printed circuit board; a memory controller electrically connected to the first memory chip and the second memory chip via a first bonding wire and a second bonding wire; and a strength control module configured to control a drive strength of each of a first output driver of the first memory chip and a second output driver of the second memory chip, wherein the memory controller includes an interface circuit configured to receive each of first test data and second test data from the first output driver and the second output driver in which the drive strength is set by the strength control module, and output detection data for detecting whether the first bonding wire and the bonding wire are short-circuited based on the first and second test data.

Abstract: Provided are multi-chip packages. A multi-chip package includes a first memory chip and a second memory chip on a printed circuit board; a memory controller electrically connected to the first memory chip and the second memory chip via a first bonding wire and a second bonding wire; and a strength control module configured to control a drive strength of each of a first output driver of the first memory chip and a second output driver of the second memory chip, wherein the memory controller includes an interface circuit configured to receive each of first test data and second test data from the first output driver and the second output driver in which the drive strength is set by the strength control module, and output detection data for detecting whether the first bonding wire and the bonding wire are short-circuited based on the first and second test data.

Abstract: A semiconductor package including a first master-slave status circuit configured to store one of a first signal or a second signal independently from a second master-slave status circuit, store the first signal in response to receiving a first initial signal from a first initialization circuit, the second master-slave status circuit configured to store one of the first signal or the second signal, store the first signal in response to receiving a second initial signal from a second initialization circuit, the first initialization circuit configured to provide the first initial signal to the first master-slave status circuit, the second initialization circuit configured to provide the second initial signal to the second master-slave status circuit, and a first master-slave determination circuit connected to the second master-slave status circuit, the first master-slave determination circuit configured to provide the second signal to the second master-slave status circuit may be provided.

Abstract: A semiconductor package including a first master-slave status circuit configured to store one of a first signal or a second signal independently from a second master-slave status circuit, store the first signal in response to receiving a first initial signal from a first initialization circuit, the second master-slave status circuit configured to store one of the first signal or the second signal, store the first signal in response to receiving a second initial signal from a second initialization circuit, the first initialization circuit configured to provide the first initial signal to the first master-slave status circuit, the second initialization circuit configured to provide the second initial signal to the second master-slave status circuit, and a first master-slave determination circuit connected to the second master-slave status circuit, the first master-slave determination circuit configured to provide the second signal to the second master-slave status circuit may be provided.

Abstract: A multi-chip package capable of testing internal signal lines including a printed circuit board, a first semiconductor chip mounted on the printed circuit board and including a test circuit, and second semiconductor chips mounted on the printed circuit board and electrically connected to the first semiconductor chip via a plurality of internal signal lines may be provided. The test circuit may be configured to enable circuits of the first semiconductor chip connected to pads contacting the plurality of internal signal lines, transmit complementary data to at least two pads from among the pads, and form a current path in the circuits connected to the at least two pads, thereby detecting a short-circuit between the internal bonding wires.

Abstract: An apparatus includes data transmitter having first through N-th data drivers configured to provide first through N-th data signals, respectively, and a strobe driver configured to provide a strobe signal, and a data receiver having a strobe buffer configured to generate a control signal based on the strobe signal, and first through N-th sense amplifiers configured to sense N-bit data based on the control signal, a reference signal and the first through N-th data signals. The bus includes a strobe TSV configured to connect the strobe driver with the strobe buffer, and first through N-th data TSVs configured to connect the first through N-th data drivers with the first through N-th sense amplifiers, respectively. A reference signal supplier controls the reference signal such that a discharge speed of the reference signal is slower than a discharge speed of each of the first through N-th data signals during data transmission.

Abstract: An apparatus includes data transmitter having first through N-th data drivers configured to provide first through N-th data signals, respectively, and a strobe driver configured to provide a strobe signal, and a data receiver having a strobe buffer configured to generate a control signal based on the strobe signal, and first through N-th sense amplifiers configured to sense N-bit data based on the control signal, a reference signal and the first through N-th data signals. The bus includes a strobe TSV configured to connect the strobe driver with the strobe buffer, and first through N-th data TSVs configured to connect the first through N-th data drivers with the first through N-th sense amplifiers, respectively. A reference signal supplier controls the reference signal such that a discharge speed of the reference signal is slower than a discharge speed of each of the first through N-th data signals during data transmission.

Abstract: A multi-chip package capable of testing internal signal lines including a printed circuit board, a first semiconductor chip mounted on the printed circuit board and including a test circuit, and second semiconductor chips mounted on the printed circuit board and electrically connected to the first semiconductor chip via a plurality of internal signal lines may be provided. The test circuit may be configured to enable circuits of the first semiconductor chip connected to pads contacting the plurality of internal signal lines, transmit complementary data to at least two pads from among the pads, and form a current path in the circuits connected to the at least two pads, thereby detecting a short-circuit between the internal bonding wires.

Abstract: A semiconductor package includes an external electrode, an interface chip, and a semiconductor chip. The interface chip includes an external interface pad bonded to the external electrode, a plurality of internal interface pads, and an interface circuit coupled between the external interface pad and the plurality of internal interface pads. The semiconductor chip includes a signal pad that is selectively bonded to one of the plurality of internal interface pads. The interface circuit activates a connection between a selected pad, which corresponds to a pad that is bonded to the signal pad among the plurality of internal interface pads, and the external interface pad, and deactivates connections between unselected pads, which correspond to pads that are not bonded to the signal pad among the plurality of internal interface pads, and the external interface pad.

Abstract: A clock signal processor includes a duty cycle corrector, a switch point calculator, and a multiplexer. The duty cycle corrector generates a second clock signal by modifying a duty cycle of a first clock signal. The switch point calculator activates a switch signal at an end of a latency period in which a read command is provided to a non-volatile memory device and an invalid data is read from the non-volatile memory device. The multiplexer outputs one of the first and second clock signals as a third clock signal based on the switch signal.

Abstract: A semiconductor package includes an external electrode, an interface chip, and a semiconductor chip. The interface chip includes an external interface pad bonded to the external electrode, a plurality of internal interface pads, and an interface circuit coupled between the external interface pad and the plurality of internal interface pads. The semiconductor chip includes a signal pad that is selectively bonded to one of the plurality of internal interface pads. The interface circuit activates a connection between a selected pad, which corresponds to a pad that is bonded to the signal pad among the plurality of internal interface pads, and the external interface pad, and deactivates connections between unselected pads, which correspond to pads that are not bonded to the signal pad among the plurality of internal interface pads, and the external interface pad.

Abstract: A clock signal processor includes a duty cycle corrector, a switch point calculator, and a multiplexer. The duty cycle corrector generates a second clock signal by modifying a duty cycle of a first clock signal. The switch point calculator activates a switch signal at an end of a latency period in which a read command is provided to a non-volatile memory device and an invalid data is read from the non-volatile memory device. The multiplexer outputs one of the first and second clock signals as a third clock signal based on the switch signal.