Abstract: A coil electronic component includes a body having a multilayer structure formed by stacking a plurality of sheets and external electrodes disposed on outer surfaces of the body. A coil pattern is printed on each of the plurality of sheets. The coil pattern includes a coil body and a corner pattern spaced apart from the coil pattern and coupled to the external electrodes. An inner edge of the second coil pattern facing the coil body is formed as a curved line or a linear line.

Abstract: A coil electronic component includes a body portion and an external electrode. The body portion includes a coil layer and a reinforcing layer disposed on at least one of an upper portion and a lower portion of the coil layer. The external electrode is disposed on an outer surface of the body portion. The coil layer includes an insulating layer, a coil pattern, and a first conductivity type via penetrating through the insulating layer to be connected to the coil pattern, and the reinforcing layer has a higher degree of rigidity than the insulating layer.

Abstract: A coil electronic component includes a body having a multilayer structure formed by stacking a plurality of sheets and external electrodes disposed on outer surfaces of the body. A coil pattern is printed on each of the plurality of sheets. The coil pattern includes a coil body and a corner pattern spaced apart from the coil pattern and coupled to the external electrodes. An inner edge of the second coil pattern facing the coil body is formed as a curved line or a linear line.

Abstract: A coil electronic component includes a body portion and an external electrode. The body portion includes a coil layer and a reinforcing layer disposed on at least one of an upper portion and a lower portion of the coil layer. The external electrode is disposed on an outer surface of the body portion. The coil layer includes an insulating layer, a coil pattern, and a first conductivity type via penetrating through the insulating layer to be connected to the coil pattern, and the reinforcing layer has a higher degree of rigidity than the insulating layer.

Abstract: A resin composition for a printed circuit includes a first resin having a polycyclic group; a second resin having an imide group conjugated to at least one cyclic group; and a hardening accelerator having two or more functional groups, wherein the resin composition does not include a hardening agent.

Abstract: A resin composition for a printed circuit board and a printed circuit board formed of the same. The resin composition for a printed circuit board may have: a liquid crystal oligomer including a structural unit of the Chemical Formula 1 and a structural unit of the Chemical Formula 2 and including a functional group of the Chemical Formula E on at least one end; and an ether-type naphthalene-based epoxy resin of Chemical Formula N. According to an exemplary embodiment, even though a printed circuit board becomes light, thin, and miniaturized, electric, thermal, and mechanical stability of the printed circuit board may be secured.

Abstract: Disclosed herein are an insulating resin composition for a printed circuit board, and an insulating film, a prepreg, a copper clad laminate, or a printed circuit board manufactured by using the same. More specifically, the insulating resin composition contains an eucryptite inorganic filler having a negative coefficient of thermal expansion, such that a glass transition temperature and a coefficient of thermal expansion may be improved, and warpage of the insulating film, the prepreg, the copper clad laminate, or the printed circuit board manufactured by using the insulating resin composition for a printed circuit board may be minimized.

Abstract: Disclosed herein are a carrier and a method of manufacturing a printed circuit board using the same. More specifically, in the carrier according to the present invention, the carrier has characteristics of a coefficient of thermal expansion (CTE), a glass transition temperature (Tg), and a storage modulus which are improved by an insulating layer including an epoxy resin and a liquid crystal oligomer. In addition, a first metal layer is formed on the insulating layer, such that the printed circuit board stacked on one surface or both surfaces of the carrier may be protected from deformation by physical impact and the warpage phenomenon may be minimized.

Abstract: Disclosed herein are an insulating resin composition for a printed circuit board and products manufactured by using the same, and more particularly, an insulating resin composition for a printed circuit board including an amino triazine novolac curing agent having an amino group and a hydroxyl group to have improved coefficient of thermal expansion and glass transition temperature properties, and improved acid resistant property that discoloration of the product is not generated, and an insulating film and a prepreg as products manufactured by using the same.

Abstract: An inorganic filler has a negative coefficient of thermal expansion, and a shell thereon that decreases diffusion of ions contained in the inorganic filler to outside of the shell and organic filler.